公开(公告)号：US20240351163A1

公开(公告)日：2024-10-24

申请号：US18634676

申请日：2024-04-12

Applicant: EBARA CORPORATION

Inventor： Masayoshi ITO ,  Seungho YUN ,  Yukihiro KANG ,  Yasuyuki MOTOSHIMA ,  Shumpei MIURA ,  Kenichi SUZUKI

IPC: B24B49/14 ,  B24B49/04 ,  B24B49/16

CPC classification number: B24B49/14 ,  B24B49/04 ,  B24B49/16

Abstract: A polishing method capable of appropriately controlling a temperature of a polishing surface of a polishing pad during polishing of a workpiece is disclosed. The polishing method includes detecting a surface condition of a sample while polishing the sample on a polishing surface of a polishing pad; creating time-series data representing temporal change in the surface condition of the sample; determining a point in time at which the surface condition of the sample has distinctively changed based on the time-series data; determining a temperature control time based on the determined point in time; and controlling a temperature of the polishing surface of the polishing pad based on the temperature control time, while polishing a workpiece on the polishing surface of the polishing pad.

公开(公告)号：US20240033876A1

公开(公告)日：2024-02-01

申请号：US18352325

申请日：2023-07-14

Applicant: EBARA CORPORATION

Inventor： Shumpei MIURA ,  Kenichi SUZUKI ,  Itsuki KOBATA ,  Yasuyuki MOTOSHIMA ,  Ban ITO ,  Seungho YUN

IPC: B24B37/015 ,  B24B37/34

CPC classification number: B24B37/015 ,  B24B37/34

Abstract: A polishing apparatus is disclosed, which is capable of heating and maintaining a temperature distribution of a polishing pad at a predetermined temperature distribution with a simple structure. The polishing apparatus has a pad-temperature regulating apparatus for regulating a temperature of a polishing surface, and the pad-temperature regulating apparatus includes a heating-fluid nozzle arranged above and spaced apart from the polishing surface. The heating-fluid nozzle includes: a nozzle body; a slit formed along a longitudinal direction of the nozzle body for ejecting a heating fluid toward the polishing surface; a header tube which is formed within the nozzle body and into which the heating fluid is supplied; a buffer tube which is formed within the nozzle body and communicates with the slit, and a plurality of branch tubes for coupling the header tube to the buffer tube.

公开(公告)号：US20230321696A1

公开(公告)日：2023-10-12

申请号：US18128892

申请日：2023-03-30

Applicant: EBARA CORPORATION

Inventor： Hiroki TAKAHASHI ,  Ban ITO ,  Seungho YUN ,  Kohei SATO

IPC: B08B3/10 ,  B08B1/00 ,  B08B3/02 ,  B08B5/02 ,  B24B57/02

CPC classification number: B08B3/10 ,  B08B1/002 ,  B08B3/02 ,  B08B5/02 ,  B24B57/02 ,  B08B2205/00 ,  B08B2203/00

Abstract: A substrate processing system capable of supplying a processing liquid containing fine bubbles at a high concentration without generating large sized bubbles in a middle of a supply line of the processing liquid is disclosed. There is provided a substrate processing system comprising: a gas dissolved water generation tank; a chemical liquid dilution module; and a substrate processing module. The substrate processing module comprises a processing liquid supply nozzle configured to supply the processing liquid onto a substrate. The processing liquid supply nozzle has a decompression release portion configured to generate fine bubbles of a gas from a diluted chemical liquid. The processing liquid supply nozzle is configured to supply the diluted chemical liquid containing fine bubbles in a process scrubbing the substrate.

公开(公告)号：US20250153302A1

公开(公告)日：2025-05-15

申请号：US18833522

申请日：2023-01-25

Applicant: EBARA CORPORATION

Inventor： Seungho YUN

IPC: B24B37/005

Abstract: An information processing apparatus (5) includes: an information acquisition section (500) configured to acquire polishing condition information including top-ring vibration information indicating vibration of a top ring in chemical mechanical polishing of the substrate and top-ring sound information indicating sound generated from the top ring in the chemical mechanical polishing of the substrate performed by a substrate processing apparatus including a polishing table rotatably supporting the polishing pad and the top ring configured to press the substrate against the polishing pad; and a state prediction section (501) configured to predict substrate slip-out information for the polishing condition information by inputting the polishing condition information acquired by the information acquisition section (500) to a learning model (10A) that has been generated by machine learning that causes the learning model to learn a correlation between the polishing condition information and the substrate slip-out information indicating occurrence of slip out of the substrate on which the chemical mechanical polishing is performed.

公开(公告)号：US20240157503A1

公开(公告)日：2024-05-16

申请号：US18358811

申请日：2023-07-25

Applicant: EBARA CORPORATION

Inventor： Seungho YUN

IPC: B24B37/015 ,  B24B49/10

CPC classification number: B24B37/015 ,  B24B49/10

Abstract: A polishing apparatus capable of measuring a surface temperature of a substrate while suppressing shielding by a polishing liquid is disclosed. The polishing apparatus includes a microwave detection sensor configured to generate microwave detection data by detecting microwaves, and a controller configured to determine the surface temperature of the substrate based on the microwave detection data.