公开(公告)号：US20230340688A1

公开(公告)日：2023-10-26

申请号：US18168486

申请日：2023-02-13

Applicant: EBARA CORPORATION

Inventor： Tsubasa ISHII ,  Masashi SHIMOYAMA ,  Masashi OBUCHI ,  Koichi MASUYA ,  Ryosuke HIWATASHI

IPC: C25D21/12 ,  C25D17/02 ,  C25D17/06 ,  C25D17/10

CPC classification number: C25D21/12 ,  C25D17/02 ,  C25D17/06 ,  C25D17/10

Abstract: An object is to precisely grasping, in real time, film thickness of a plated film during a plating process. A plating apparatus comprises: a plating tank for storing plating liquid; a substrate holder for holding a substrate; an anode arranged in the plating tank in such a manner that it faces the substrate held by the substrate holder; an electric potential sensor constructed in such a manner that it is arranged in a position close to the substrate held by the substrate holder, and measures electric potential of the plating liquid; and a state space model constructed to estimate current density of current flowing through an outer edge part of the substrate, based on a measured value of electric potential of the plating liquid obtained by the electric potential sensor and by using a state equation and an observation equation.

公开(公告)号：US20240295045A1

公开(公告)日：2024-09-05

申请号：US18589059

申请日：2024-02-27

Applicant: EBARA CORPORATION

Inventor： Tsubasa ISHII ,  Ryosuke HIWATASHI ,  Masashi SHIMOYAMA ,  Koichi MASUYA

IPC: C25D21/12

CPC classification number: C25D21/12

Abstract: Provided is a plating apparatus to determine appropriate control parameters for forming plating with high film thickness flatness on a substrate. The plating apparatus includes an estimation unit that estimates a density of a current flowing through an outer edge of the substrate, a current density calculation unit that calculates a density of a plating current flowing through a plating solution into the substrate based on the estimated current density, and a control parameter that specifies an operation mode of the plating apparatus, the current density calculation unit calculating the plating current density for each of a plurality of different operation modes of the plating apparatus, a film thickness calculation unit that calculates a thickness of a plating film formed on the substrate for each of the plurality of operation modes, based on each calculated plating current density, and a control parameter determination unit that determines a control parameter corresponding to an optimal operation mode, based on the calculated plating film thickness for each operation mode of the plating apparatus.

公开(公告)号：US20230279579A1

公开(公告)日：2023-09-07

申请号：US18086319

申请日：2022-12-21

Applicant: EBARA CORPORATION

Inventor： Tsubasa ISHII ,  Masashi SHIMOYAMA ,  Masashi OBUCHI ,  Koichi MASUYA

IPC: C25D21/12 ,  C25D17/00 ,  C25D17/06

CPC classification number: C25D21/12 ,  C25D17/007 ,  C25D17/06

Abstract: Provided is a plating apparatus capable of improving uniformity of a plating film formed on a substrate. The plating apparatus includes a plating tank, a substrate holder that holds a substrate, and an anode disposed in the plating tank to oppose the substrate held by the substrate holder. The plating apparatus also includes a conduit having a first portion including an opening end disposed in a region between the substrate held by the substrate holder and the anode, and a second portion apart from the region between the substrate held by the substrate holder and the anode, the conduit having at least a part filled with a plating solution, and a potential sensor that is disposed in the second portion of the conduit and that is configured to measure a potential of the plating solution.