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Patent Agency Ranking
公开(公告)号：US20250146167A1
公开(公告)日：2025-05-08
申请号：US18557536
申请日：2022-12-16
Applicant: EBARA CORPORATION
Inventor： Ryosuke HIWATASHI , Tsubasa ISHII , Yasuyuki MASUDA , Masashi SHIMOYAMA
Abstract: Proposed is a plating apparatus capable of detecting a film thickness of a plating film formed on a substrate during a plating process. The plating apparatus includes a plating tank, a substrate holder configured to hold a substrate, an anode disposed in the plating tank to oppose the substrate held by the substrate holder, a resistor disposed between the substrate and the anode to adjust an electric field, a first detection electrode disposed in a region between a surface to be plated of the substrate and the anode and having an electrode end disposed at a first position inside the resistor, a second detection electrode disposed at a second position where there is less change in potential as compared with the first position in the plating tank, and a controller that measures a potential difference between the first detection electrode and the second detection electrode, to estimate a thickness of a plating film on the substrate based on the potential difference.
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公开(公告)号：US20230340688A1
公开(公告)日：2023-10-26
申请号：US18168486
申请日：2023-02-13
Applicant: EBARA CORPORATION
Inventor： Tsubasa ISHII , Masashi SHIMOYAMA , Masashi OBUCHI , Koichi MASUYA , Ryosuke HIWATASHI
Abstract: An object is to precisely grasping, in real time, film thickness of a plated film during a plating process. A plating apparatus comprises: a plating tank for storing plating liquid; a substrate holder for holding a substrate; an anode arranged in the plating tank in such a manner that it faces the substrate held by the substrate holder; an electric potential sensor constructed in such a manner that it is arranged in a position close to the substrate held by the substrate holder, and measures electric potential of the plating liquid; and a state space model constructed to estimate current density of current flowing through an outer edge part of the substrate, based on a measured value of electric potential of the plating liquid obtained by the electric potential sensor and by using a state equation and an observation equation.
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公开(公告)号：US20240314936A1
公开(公告)日：2024-09-19
申请号：US18589195
申请日：2024-02-27
Applicant: EBARA CORPORATION
Inventor： Tsubasa ISHII , Ryosuke HIWATASHI , Masashi SHIMOYAMA
IPC: H05K3/24
CPC classification number: H05K3/241 , H05K2203/0165 , H05K2203/0723 , H05K2203/1554
Abstract: In a plating apparatus, a potential sensor capable of accurately confirming flatness in thickness of a plating film is provided. The plating apparatus includes a plating tank to store a plating solution, a substrate holder that holds the substrate, an anode disposed in the plating tank to oppose the substrate held by the substrate holder, a resistor disposed between the substrate held by the substrate holder and the anode and having a plurality of holes extending through sides of the resistor facing the anode and the substrate, and a potential sensor assembly disposed between the substrate held by the substrate holder and the resistor and configured to measure a potential of the plating solution, and the potential sensor assembly includes a base plate, a plurality of potential sensors arranged on the base plate, electrical wirings formed on the base plate for taking out signals from the plurality of potential sensors, and a protective film that protects the base plate and the electrical wirings.
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公开(公告)号：US20240295045A1
公开(公告)日：2024-09-05
申请号：US18589059
申请日：2024-02-27
Applicant: EBARA CORPORATION
Inventor： Tsubasa ISHII , Ryosuke HIWATASHI , Masashi SHIMOYAMA , Koichi MASUYA
IPC: C25D21/12
CPC classification number: C25D21/12
Abstract: Provided is a plating apparatus to determine appropriate control parameters for forming plating with high film thickness flatness on a substrate. The plating apparatus includes an estimation unit that estimates a density of a current flowing through an outer edge of the substrate, a current density calculation unit that calculates a density of a plating current flowing through a plating solution into the substrate based on the estimated current density, and a control parameter that specifies an operation mode of the plating apparatus, the current density calculation unit calculating the plating current density for each of a plurality of different operation modes of the plating apparatus, a film thickness calculation unit that calculates a thickness of a plating film formed on the substrate for each of the plurality of operation modes, based on each calculated plating current density, and a control parameter determination unit that determines a control parameter corresponding to an optimal operation mode, based on the calculated plating film thickness for each operation mode of the plating apparatus.
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公开(公告)号：US20230279579A1
公开(公告)日：2023-09-07
申请号：US18086319
申请日：2022-12-21
Applicant: EBARA CORPORATION
Inventor： Tsubasa ISHII , Masashi SHIMOYAMA , Masashi OBUCHI , Koichi MASUYA
CPC classification number: C25D21/12 , C25D17/007 , C25D17/06
Abstract: Provided is a plating apparatus capable of improving uniformity of a plating film formed on a substrate. The plating apparatus includes a plating tank, a substrate holder that holds a substrate, and an anode disposed in the plating tank to oppose the substrate held by the substrate holder. The plating apparatus also includes a conduit having a first portion including an opening end disposed in a region between the substrate held by the substrate holder and the anode, and a second portion apart from the region between the substrate held by the substrate holder and the anode, the conduit having at least a part filled with a plating solution, and a potential sensor that is disposed in the second portion of the conduit and that is configured to measure a potential of the plating solution.
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