公开(公告)号：US20240033876A1

公开(公告)日：2024-02-01

申请号：US18352325

申请日：2023-07-14

Applicant: EBARA CORPORATION

Inventor： Shumpei MIURA ,  Kenichi SUZUKI ,  Itsuki KOBATA ,  Yasuyuki MOTOSHIMA ,  Ban ITO ,  Seungho YUN

IPC: B24B37/015 ,  B24B37/34

CPC classification number: B24B37/015 ,  B24B37/34

Abstract: A polishing apparatus is disclosed, which is capable of heating and maintaining a temperature distribution of a polishing pad at a predetermined temperature distribution with a simple structure. The polishing apparatus has a pad-temperature regulating apparatus for regulating a temperature of a polishing surface, and the pad-temperature regulating apparatus includes a heating-fluid nozzle arranged above and spaced apart from the polishing surface. The heating-fluid nozzle includes: a nozzle body; a slit formed along a longitudinal direction of the nozzle body for ejecting a heating fluid toward the polishing surface; a header tube which is formed within the nozzle body and into which the heating fluid is supplied; a buffer tube which is formed within the nozzle body and communicates with the slit, and a plurality of branch tubes for coupling the header tube to the buffer tube.

公开(公告)号：US20240351163A1

公开(公告)日：2024-10-24

申请号：US18634676

申请日：2024-04-12

Applicant: EBARA CORPORATION

Inventor： Masayoshi ITO ,  Seungho YUN ,  Yukihiro KANG ,  Yasuyuki MOTOSHIMA ,  Shumpei MIURA ,  Kenichi SUZUKI

IPC: B24B49/14 ,  B24B49/04 ,  B24B49/16

CPC classification number: B24B49/14 ,  B24B49/04 ,  B24B49/16

Abstract: A polishing method capable of appropriately controlling a temperature of a polishing surface of a polishing pad during polishing of a workpiece is disclosed. The polishing method includes detecting a surface condition of a sample while polishing the sample on a polishing surface of a polishing pad; creating time-series data representing temporal change in the surface condition of the sample; determining a point in time at which the surface condition of the sample has distinctively changed based on the time-series data; determining a temperature control time based on the determined point in time; and controlling a temperature of the polishing surface of the polishing pad based on the temperature control time, while polishing a workpiece on the polishing surface of the polishing pad.