公开(公告)号：US20180038008A1

公开(公告)日：2018-02-08

申请号：US15669735

申请日：2017-08-04

Applicant: EBARA CORPORATION

Inventor： Takashi MITSUYA ,  Ryuya KOIZUMI ,  Toshio YOKOYAMA ,  Masashi SHIMOYAMA ,  Kunio OISHI

IPC: C25D17/00 ,  H01L23/00 ,  H01L21/288 ,  C25D21/12 ,  H01L21/768

CPC classification number: C25D17/001 ,  C25D17/004 ,  C25D17/008 ,  C25D17/06 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/6723 ,  H01L21/67253 ,  H01L21/76879 ,  H01L21/76885 ,  H01L21/76898 ,  H01L22/26 ,  H01L24/11 ,  H01L2224/11462 ,  H01L2224/117

Abstract: A plating system comprising a plating tank for applying plate processing to a substrate, a sensor configured to measure actual plating film thickness of the substrate, and a controller configured to control plating current supplied to the plating tank and plating time for the plate processing of the substrate within the plating tank. The controller is capable of setting target plating film thickness, plating current, and plating time as a plate processing recipe. At least one of the plating current and the plating time is automatically corrected so that the actual plating film thickness and the target plating film thickness become equal to each other, and the result is reflected in the plate processing for the subsequent substrate.

公开(公告)号：US20180203434A1

公开(公告)日：2018-07-19

申请号：US15868753

申请日：2018-01-11

Applicant: EBARA CORPORATION

Inventor： Koji NONOBE ,  Takashi MITSUYA ,  Ryuya KOIZUMI ,  Kunio OISHI

IPC: G05B19/4155 ,  H01L21/677 ,  G05B19/418 ,  H01L21/67

CPC classification number: G05B19/4155 ,  G05B19/41865 ,  G05B2219/32252 ,  G05B2219/45031 ,  H01L21/6723 ,  H01L21/67253 ,  H01L21/67276 ,  H01L21/67745 ,  H01L21/67766 ,  H01L21/67778 ,  Y02P90/18 ,  Y02P90/20 ,  Y02P90/26 ,  Y02P90/28

Abstract: A calculation amount and calculation time for a substrate conveyance schedule are reduced. A scheduler is provided which is incorporated in a control section of a substrate processing apparatus including a plurality of substrate processing sections that process a substrate, a conveyance section that conveys the substrate, and the control section that controls the conveyance section and the substrate processing sections, and calculates a substrate conveyance schedule. The scheduler includes: a modeling section that models processing conditions, processing time and constraints of the substrate processing apparatus into nodes and edges using a graph network theory, prepares a graph network, and calculates a longest route length to each node; and a calculation section that calculates the substrate conveyance schedule based on the longest route length.

公开(公告)号：US20170358472A1

公开(公告)日：2017-12-14

申请号：US15690025

申请日：2017-08-29

Applicant: EBARA CORPORATION

Inventor： Toshio YOKOYAMA ,  Masahiko SEKIMOTO ,  Kenichi KOBAYASHI ,  Kenichi AKAZAWA ,  Takashi MITSUYA ,  Keiichi KURASHINA

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67718 ,  H01L21/67086 ,  H01L21/67751 ,  H01L21/68707

Abstract: A substrate processing apparatus according to the present invention comprises a transferring device including a grasping section configured to grasp a substrate holder, and a transferring section configured to transfer the substrate holder grasped by the grasping section, and a processing bath for storing a substrate held by the substrate holder so that a surface of the substrate is vertically oriented, and processing the substrate. The grasping section is configured to grasp the substrate holder with a surface of the substrate oriented horizontally. The transferring section is configured to transfer the substrate holder above the processing bath, with the surface of the substrate oriented horizontally.

公开(公告)号：US20150270151A1

公开(公告)日：2015-09-24

申请号：US14666196

申请日：2015-03-23

Applicant: EBARA CORPORATION

Inventor： Toshio YOKOYAMA ,  Masahiko SEKIMOTO ,  Kenichi KOBAYASHI ,  Kenichi AKAZAWA ,  Takashi MITSUYA ,  Keiichi KURASHINA

IPC: H01L21/677

CPC classification number: H01L21/67718 ,  H01L21/67086 ,  H01L21/67751 ,  H01L21/68707

Abstract: A substrate processing apparatus according to the present invention comprises a transferring device including a grasping section configured to grasp a substrate holder, and a transferring section configured to transfer the substrate holder grasped by the grasping section, and a processing bath for storing a substrate held by the substrate holder so that a surface of the substrate is vertically oriented, and processing the substrate. The grasping section is configured to grasp the substrate holder with a surface of the substrate oriented horizontally. The transferring section is configured to transfer the substrate holder above the processing bath, with the surface of the substrate oriented horizontally.

Abstract translation: 根据本发明的基板处理装置包括转印装置，该转印装置包括构造成夹持基板保持器的把持部，以及转印部，其被配置为转印由该抓持部抓住的基板支架，以及用于存储由 衬底保持器，使得衬底的表面垂直取向，并处理衬底。 把持部被配置为将基板的表面水平取向地抓握基板保持件。 转印部分被配置为将衬底保持器转移到处理槽上方，其中衬底的表面水平定向。

公开(公告)号：US20190271970A1

公开(公告)日：2019-09-05

申请号：US16258137

申请日：2019-01-25

Applicant: EBARA CORPORATION

Inventor： Koji NONOBE ,  Takashi MITSUYA ,  Ryuya KOIZUMI ,  Kunio OISHI

IPC: G05B19/418 ,  G05B19/4155

Abstract: A calculation amount and calculation time for a substrate conveyance schedule are reduced. A scheduler is provided which is incorporated in a control section of a substrate processing apparatus including a plurality of substrate processing sections that process a substrate, a conveyance section that conveys the substrate, and the control section that controls the conveyance section and the substrate processing sections, and calculates a substrate conveyance schedule. The scheduler includes: a modeling section that models processing conditions, processing time and constraints of the substrate processing apparatus into nodes and edges using a graph network theory, prepares a graph network, and calculates a longest route length to each node; and a calculation section that calculates the substrate conveyance schedule based on the longest route length.

公开(公告)号：US20190237350A1

公开(公告)日：2019-08-01

申请号：US16245448

申请日：2019-01-11

Applicant: EBARA CORPORATION

Inventor： Takashi MITSUYA

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67745 ,  H01L21/67034 ,  H01L21/67161 ,  H01L21/67742

Abstract: A substrate treatment apparatus includes a plurality of treatment chambers performing different treatment types on a substrate; a transfer device; and a controller that controls the transfer of the substrate and the substrate treatment. The controller enables fixation of a time for pulling up the substrate for each treatment chambers/treatment type and creation of a transfer schedule for transferring the substrate among the plurality of treatment chambers/treatment types and treating the substrate so as to maximize throughput, and enables correction of the transfer schedule to extend, based on a waiting time of the transfer device after storage of the substrate into a treatment chamber of one treatment type and a waiting time of the treatment chamber after treatment of the substrate, a time required for pulling up the substrate from a treatment chamber of an immediately previous treatment type in transfer order of the substrate.

公开(公告)号：US20150270147A1

公开(公告)日：2015-09-24

申请号：US14666215

申请日：2015-03-23

Applicant: EBARA CORPORATION

Inventor： Kenichi KOBAYASHI ,  Masahiko SEKIMOTO ,  Toshio YOKOYAMA ,  Kenichi AKAZAWA ,  Keiichi KURASHINA ,  Takashi MITSUYA

IPC: H01L21/67 ,  B25J11/00 ,  H01L21/687

CPC classification number: H01L21/67057 ,  B25J11/0095 ,  H01L21/67034 ,  H01L21/67173 ,  H01L21/67276 ,  H01L21/68721 ,  H01L21/68742

Abstract: A substrate processing apparatus capable of inhibiting diffusion of a chemical solution atmosphere around a processing bath. The substrate processing apparatus has a processing bath for storing a substrate holder holding a substrate and for processing the substrate, a lifter configured to support the substrate holder, store the substrate holder in the processing bath, and take out the substrate holder from the processing bath, and a cover configured to cover the periphery of the substrate holder taken out from the processing bath by the lifter.

Abstract translation: 能够抑制处理槽周围的化学溶液气氛扩散的基板处理装置。 基板处理装置具有用于存储保持基板并用于处理基板的基板保持件的处理槽，构造成支撑基板保持器的升降器，将基板保持器存储在处理槽中，并从处理槽取出基板保持件 以及盖，其构造成覆盖由所述升降机从所述处理槽取出的所述基板保持器的周边。