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    RINSING BATH AND SUBSTRATE CLEANING METHOD USING SUCH RINSING BATH
    2.
    发明申请
    RINSING BATH AND SUBSTRATE CLEANING METHOD USING SUCH RINSING BATH 审中-公开
    使用这种冲洗浴的冲洗浴和衬底清洁方法

    公开(公告)号：US20160059271A1

    公开(公告)日：2016-03-03

    申请号：US14834019

    申请日：2015-08-24

    Applicant: EBARA CORPORATION

    Inventor： Masahiko SEKIMOTO ,  Toshio YOKOYAMA ,  Kenichi KOBAYASHI ,  Kenichi AKAZAWA

    IPC: B08B3/04

    CPC classification number: B08B3/048 ,  H01L21/67057

    Abstract: A rinsing bath which can simplify a discharging structure of a rinsing liquid is disclosed. The rinsing bath includes an inner bath for storing the rinsing liquid, an overflow bath configured to receive the rinsing liquid overflowing the inner bath, a stopper for closing a drain hole provided on a bottom of the inner bath, an actuator configured to move the stopper between a closing position in which the stopper closes the drain hole and a opening position in which the stopper is away from the drain hole, a rinsing liquid supply pipe configured to supply the rinsing liquid into the inner bath, and a drain pipe coupled to a bottom of the overflow bath. The drain hole communicates between an inside of the inner bath and an inside of the overflow bath.

    Abstract translation: 公开了一种能够简化冲洗液体排放结构的冲洗槽。 冲洗槽包括用于储存冲洗液体的内部浴液，构造成接收溢出内部浴槽的冲洗液体的溢流槽，用于关闭设置在内部浴槽底部的排水孔的止动件，构造成使塞子移动的致动器 在所述止动器关闭所述排水孔的关闭位置和所述止动件从所述排水孔离开的打开位置之间，构造成将所述冲洗液体供应到所述内部浴室中的冲洗液体供给管，以及与所述排液管 底部的溢流浴。 排水孔在内槽的内部和溢流槽的内部连通。

    SUBSTRATE PROCESSING APPARATUS AND PROCESSED SUBSTRATE MANUFACTURING METHOD
    3.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND PROCESSED SUBSTRATE MANUFACTURING METHOD 有权
    基板加工设备和加工基板制造方法

    公开(公告)号：US20140311532A1

    公开(公告)日：2014-10-23

    申请号：US14259075

    申请日：2014-04-22

    Applicant: EBARA CORPORATION

    Inventor： Toshio YOKOYAMA ,  Junji KUNISAWA ,  Mitsuru MIYAZAKI ,  Teruaki HOMBO ,  Naoki TOYOMURA

    IPC: H01L21/67 ,  H01L21/68 ,  H01L21/677

    CPC classification number: H01L21/67046 ,  H01L21/67051 ,  H01L21/68728 ,  H01L21/68764

    Abstract: A substrate processing apparatus has a substrate rotating device 10, 20 for holding and rotating a substrate W, a cleaning device 41 configured to clean a substrate W which is rotated by the substrate rotating device 10, 20 at predetermined rotating speed, a movement device 42 configured to move the cleaning device 41 between a cleaning position P3 and a separate position P2, and a control unit 64. The control unit 64 controls the movement device 42 so that the cleaning device 41 located at the separate position P2 starts moving toward the cleaning position P3 before a rotating speed of the substrate W held by the substrate rotating device 10, 20 reaches the predetermined rotating speed and the cleaning device 41 reaches the cleaning position P3 after a rotating speed of the substrate W reaches the predetermined rotating speed. Therefore, it is possible to improve the throughput in the substrate cleaning step.

    Abstract translation: 基板处理装置具有用于保持和旋转基板W的基板旋转装置10,20，被构造成以预定转速清洁基板旋转装置10,20旋转的基板W的清洁装置41，移动装置42 被配置为将清洁装置41移动到清洁位置P3和分离位置P2之间，以及控制单元64.控制单元64控制移动装置42，使得位于分离位置P2的清洁装置41开始朝向清洁 在由基板旋转装置10,20保持的基板W的旋转速度之前的位置P3达到预定转速，并且清洁装置41在基板W的转速达到预定转速之后到达清洁位置P3。 因此，可以提高基板清洗工序的生产量。

    SUBSTRATE PROCESSING APPARATUS, SUBSTRATE TRANSFER METHOD AND SUBSTRATE TRANSFER DEVICE
    6.
    发明申请
    SUBSTRATE PROCESSING APPARATUS, SUBSTRATE TRANSFER METHOD AND SUBSTRATE TRANSFER DEVICE 审中-公开
    基板处理装置，基板传送方法和基板传送装置

    公开(公告)号：US20150221536A1

    公开(公告)日：2015-08-06

    申请号：US14677479

    申请日：2015-04-02

    Applicant: EBARA CORPORATION

    Inventor： Toshio YOKOYAMA ,  Junji KUNISAWA ,  Mitsuru MIYAZAKI ,  Kenichi SUZUKI ,  Hiroshi SOTOZAKI

    IPC: H01L21/677 ,  B25J11/00

    CPC classification number: H01L21/67718 ,  B25J11/0095 ,  H01L21/6704 ,  H01L21/67173 ,  H01L21/67196 ,  H01L21/67219 ,  H01L21/67706 ,  H01L21/67742 ,  H01L21/68707

    Abstract: A substrate processing apparatus can prevent photo-corrosion of, e.g., copper interconnects due to exposure of a surface to be processed of a substrate to light, and can perform processing, such as cleaning, of a substrate surface while preventing photo-corrosion of, e.g., copper interconnects due to exposure to light. The substrate processing apparatus includes a plurality of processing areas housing therein processing units which have been subjected to light shielding processing; and at least one transfer area housing therein a transfer robot and disposed between two adjacent ones of the plurality of processing areas. A light shielding wall is provided between the transfer area and each of the two adjacent processing areas, and a light-shielding maintenance door is provided for the front opening of the transfer area. The processing units are coupled to the light shielding walls in a light-shielding manner.

    Abstract translation: 基板处理装置可以防止由于基板的被处理表面暴露于光而导致的铜互连的光腐蚀，并且可以执行基板表面的处理，例如清洁基板表面，同时防止光蚀刻， 例如，由于曝光而导致的铜互连。 基板处理装置包括容纳其中已进行遮光处理的处理单元的多个处理区域; 以及至少一个传送区域，其中容纳有传送机器人并设置在所述多个处理区域中的两个相邻处理区域之间。 在传送区域和两个相邻的处理区域中的每一个之间设置遮光壁，并且为传送区域的前开口设置遮光维护门。 处理单元以遮光方式耦合到遮光壁。

    SUPPLY-LIQUID PRODUCING APPARATUS AND SUPPLY-LIQUID PRODUCING METHOD
    7.
    发明申请
    SUPPLY-LIQUID PRODUCING APPARATUS AND SUPPLY-LIQUID PRODUCING METHOD 审中-公开

    公开(公告)号：US20190015801A1

    公开(公告)日：2019-01-17

    申请号：US16069862

    申请日：2017-01-13

    Applicant: EBARA CORPORATION

    Inventor： Suguru OZAWA ,  Yoichi NAKAGAWA ,  Muneto TAKAHASHI ,  Tao XU ,  Toshio YOKOYAMA

    IPC: B01F15/02 ,  B01F3/08 ,  B01F3/04

    Abstract: Provided is a supply-liquid producing apparatus capable of producing a supply liquid by an amount needed at a use point.A supply-liquid producing apparatus includes a mixer that mixes water and ozone gas to produce ozone water; a booster pump that increases the pressure of the water supplied to the mixer; a gas-liquid separation tank that separates the ozone water produced by the mixer into ozone water to be supplied to a use point and exhaust gas to be discharged from an exhaust port; a flowmeter that measures the flow rate of the ozone water supplied from the gas-liquid separation tank to the use point; a flow control unit that adjusts the flow rate of the water supplied to the mixer by controlling the booster pump in response to the flow rate of the ozone water measured by the flowmeter; and an exhaust pressure control unit that controls the exhaust pressure to keep constant the water level in the gas-liquid separation tank.

    SUBSTRATE PROCESSING APPARATUS
    10.
    发明申请
    SUBSTRATE PROCESSING APPARATUS 审中-公开
    基板加工设备

    公开(公告)号：US20160284571A1

    公开(公告)日：2016-09-29

    申请号：US15076265

    申请日：2016-03-21

    Applicant: EBARA CORPORATION

    Inventor： Keiichi KURASHINA ,  Toshio YOKOYAMA

    IPC: H01L21/67 ,  H01L21/673

    Abstract: The substrate processing apparatus includes a processing chamber including an outer chamber configured to hold a processing liquid and an inner chamber capable of surrounding the substrate held by the substrate holder; a liquid delivery pipe having one end coupled to a bottom of the inner chamber and other end coupled to the outer chamber; a pump configured to suck the processing liquid from the inner chamber through the liquid delivery pipe and to deliver the processing liquid to the outer chamber through the liquid delivery pipe; and a guide cover having a through-hole in which the substrate holder can be inserted. The guide cover is located below an upper end of the outer chamber and above the inner chamber.

    Abstract translation: 基板处理装置包括处理室，该处理室包括被配置为保持处理液体的外室和能够围绕由基板保持器保持的基板的内室; 液体输送管，其一端联接到内室的底部，另一端联接到外室; 构造成通过所述液体输送管从所述内部室吸收所述处理液并将所述处理液通过所述液体输送管输送到所述外部室的泵; 以及具有可以插入基板保持件的通孔的引导盖。 引导盖位于外腔的上端下方并在内腔的上方。

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