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公开(公告)号：US20240075410A1
公开(公告)日：2024-03-07
申请号：US18363815
申请日：2023-08-02
Applicant: EBARA CORPORATION
Inventor： Suguru OZAWA , Yuji ARAKI , Yoichi NAKAGAWA , Toshifumi WATANABE , Risa KIMURA , Ryuta KATO
CPC classification number: B01D19/0036 , B01F21/02
Abstract: There is provided a gas solution supply apparatus capable of preventing bubbles from being generated in use at a point-of-use even if gas solution to be provided to a point-of-use has a high concentration. The gas solution supply apparatus 1 includes: a gas dissolving unit 4 that dissolves a source gas in a source liquid to produce a first gas solution; a first gas-liquid separator 10 that stores the first gas solution produced and produces a second gas solution through gas-liquid separation of the first gas solution; a pressure reducer 17 that depressurizes the second gas solution produced in the first gas-liquid separator 10; and a second gas-liquid separator 12 that stores the depressurized second gas solution and produces a third gas solution through gas-liquid separation of the second gas solution. The third gas solution is supplied to a point-of-use.
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公开(公告)号：US20210245115A1
公开(公告)日：2021-08-12
申请号：US17164026
申请日：2021-02-01
Applicant: EBARA CORPORATION
Inventor： Suguru OZAWA , Yuji ARAKI , Yoichi NAKAGAWA , Toshifumi WATANABE
Abstract: A gas solution manufacturing device 1 includes a gas supply line 2 configured to supply a gas as a raw material of a gas solution, a liquid supply line 3 configured to supply a liquid as a raw material of the gas solution, a gas solution production unit 4 configured to mix the gas and the liquid together to produce the gas solution, a gas-liquid separation unit 5 configured to perform gas-liquid separation of the produced gas solution into a supplied liquid to be supplied to a use point and a discharged gas to be discharged through an exhaust port, and a gas dissolving unit 6 provided in the liquid supply line 4 and configured to dissolve the discharged gas resulting from the gas-liquid separation in the liquid. The gas dissolving unit 6 is configured with a hollow fiber membrane configured with a gas permeable membrane.
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公开(公告)号：US20190193034A1
公开(公告)日：2019-06-27
申请号：US16225666
申请日：2018-12-19
Applicant: EBARA CORPORATION
Inventor： Yoichi NAKAGAWA , Suguru OZAWA , Toshifumi WATANABE , Tao XU
IPC: B01F3/04
CPC classification number: B01F3/04737 , B01F3/04439 , B01F2003/04886 , C02F1/78 , C02F2201/782 , C02F2209/40 , G02F2001/1316 , H01L21/67051
Abstract: A gas-dissolved liquid producing apparatus 1 includes a gas supply unit 2, a first liquid supply unit 3, a gas-dissolved liquid generator 4, a second liquid generator 20, a second liquid supply unit 21, a flow rate measuring unit 14, and a controller 23. The controller 23 controls the supply amount of the first liquid to be supplied to the gas-dissolved liquid generator 4 according to the flow rate of circulated gas-dissolved liquid measured by the flow rate measuring unit 14. The gas-dissolved liquid generator 4 dissolves gas supplied from the gas supply unit 2 in first liquid supplied from the first liquid supply unit 3 and second liquid supplied from the second liquid supply unit 21 to generate gas-dissolved liquid.
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公开(公告)号：US20220105478A1
公开(公告)日：2022-04-07
申请号：US17488814
申请日：2021-09-29
Applicant: EBARA CORPORATION
Inventor： Suguru OZAWA , Yuji ARAKI , Toshifumi WATANABE , Yoichi NAKAGAWA , Risa KIMURA , Tao XU
Abstract: A gas solution supply device 1 includes: a first gas-liquid separator 8 in which gas solution is stored; a second gas-liquid separator 16 provided at a stage subsequent to the first gas-liquid separator 8 and in which gas solution to be supplied to a use point is stored; an intermediate line 17 provided between the first gas-liquid separator 8 and the second gas-liquid separator 16; a pressure booster pump 18 provided on the intermediate line 17 and increases a pressure of gas solution being supplied from the first gas-liquid separator 8 to the second gas-liquid separator 16; a gas supply line 2 that supplies gas as a material of the gas solution; and a gas dissolving unit 20 provided on the intermediate line 17 and dissolves the gas supplied from the gas supply line 2 in the gas solution supplied from the first gas-liquid separator 8.
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Patent Agency Ranking
公开(公告)号：US20180133861A1
公开(公告)日：2018-05-17
申请号：US15564417
申请日：2017-01-06
Applicant: EBARA CORPORATION
Inventor： Masayuki NAKANISHI , Toshifumi WATANABE , Kenji KODERA
IPC: B24B9/06 , B24B21/00 , B24B49/12 , H01L21/304
CPC classification number: B24B9/065 , B24B21/002 , B24B49/12 , H01L21/304
Abstract: To provide a polishing apparatus capable of polishing bevel portions of varying shape by selecting a suitable polishing recipe, based on a state before polishing.The polishing apparatus 100 comprises: a holding/polishing unit 102 for holding and polishing a workpiece W1; and an identifying unit 104 for identifying data 104a associated with a state of the peripheral portion of the substrate W1 before polishing. The holding/polishing unit 102 comprises: a holder 106 for holding and rotating the substrate W1; and a polisher 108 for polishing the peripheral portion of the substrate W1 by pressing a polishing member against the peripheral portion. A polishing-condition determiner 110 determines a polishing condition, based on data 104a indicating to which type, of a plurality of shape-related types, the shape of a given peripheral portion belongs.
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公开(公告)号：US20140213155A1
公开(公告)日：2014-07-31
申请号：US14167898
申请日：2014-01-29
Applicant: EBARA CORPORATION
Inventor： Tetsuji TOGAWA , Atsushi YOSHIDA , Toshifumi WATANABE
IPC: B24B9/06 , B24B21/00 , H01L21/463
CPC classification number: B24B9/065 , B24B21/002 , B24B21/004 , B24B21/008 , B24B21/06 , B24B27/0076 , H01L21/02035 , H01L21/463
Abstract: An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.
Abstract translation: 描述了抛光衬底的装置和方法。 抛光包括：旋转衬底; 将第一抛光工具压靠在基板的边缘部分上以抛光边缘部分; 并且将第二抛光工具压靠在基板的边缘部分上以抛光边缘部分。 相对于基板的径向方向，第二抛光工具位于比第一抛光工具更向内的位置。 第一抛光工具具有比第二抛光工具的抛光表面更粗糙的抛光表面。
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公开(公告)号：US20210017056A1
公开(公告)日：2021-01-21
申请号：US16922415
申请日：2020-07-07
Applicant: EBARA CORPORATION
Inventor： Yoichi NAKAGAWA , Suguru OZAWA , Yuji ARAKI , Toshifumi WATANABE
Abstract: A gas dissolved liquid manufacturing device includes: a pump configured to pressurize a liquid; a pipe communicating with the pump; a nozzle disposed in the pipe, the nozzle being configured to generate micro bubbles using a supplied gas; and a gas-liquid separation tank whose upper part communicates with the pipe, the gas-liquid separation tank being configured to separate a gas-liquid mixture generated by the nozzle into a gas and a liquid.
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公开(公告)号：US20180277401A1
公开(公告)日：2018-09-27
申请号：US15933237
申请日：2018-03-22
Applicant: EBARA CORPORATION
Inventor： Toshifumi WATANABE , Satoru YAMAMOTO , Yu MACHIDA
CPC classification number: H01L21/67051 , B24B9/065 , B24B21/002 , B24B21/004 , B24B21/008 , B24B37/00 , H01L21/02021 , H01L21/02087 , H01L21/67288 , H01L22/12 , H01L22/20
Abstract: A substrate processing method which can clean a peripheral portion of a substrate after polishing and can check the cleaning effect of the peripheral portion of the substrate is disclosed. The substrate processing method includes polishing a peripheral portion of the substrate by pressing a polishing tape having abrasive grains against the peripheral portion of the substrate with a first head, cleaning the peripheral portion of the substrate by supplying a cleaning liquid to the peripheral portion of the substrate after polishing, bringing a tape having no abrasive grains into contact with the peripheral portion of the substrate after cleaning by a second head, applying light to the tape and receiving reflected light from the tape by a sensor, and judging that the peripheral portion of the substrate is contaminated when an intensity of the received reflected light is lower than a predetermined value.
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公开(公告)号：US20160297048A1
公开(公告)日：2016-10-13
申请号：US15188638
申请日：2016-06-21
Applicant: EBARA CORPORATION
Inventor： Tetsuji TOGAWA , Atsushi YOSHIDA , Toshifumi WATANABE
IPC: B24B9/06 , H01L21/463 , H01L21/02 , B24B21/00
CPC classification number: B24B9/065 , B24B21/002 , B24B21/004 , B24B21/008 , B24B21/06 , B24B27/0076 , H01L21/02035 , H01L21/463
Abstract: An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.
Abstract translation: 描述了抛光衬底的装置和方法。 抛光包括：旋转衬底; 将第一抛光工具压靠在基板的边缘部分上以抛光边缘部分; 并且将第二抛光工具压靠在基板的边缘部分上以抛光边缘部分。 相对于基板的径向方向，第二抛光工具位于比第一抛光工具更向内的位置。 第一抛光工具具有比第二抛光工具的抛光表面更粗糙的抛光表面。
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