公开(公告)号：WO2006015642A3

公开(公告)日：2006-09-08

申请号：PCT/EP2005006165

申请日：2005-06-08

Applicant: EPCOS AG ,  KRUEGER HANS ,  NICOLAUS KARL ,  PORTMANN JUERGEN ,  SELMEIER PETER

Inventor： KRUEGER HANS ,  NICOLAUS KARL ,  PORTMANN JUERGEN ,  SELMEIER PETER

IPC: H01L21/60

CPC classification number: H01L23/49838 ,  H01L23/50 ,  H01L23/562 ,  H01L24/14 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10135 ,  H01L2224/14132 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2224/29099 ,  H01L2224/05599

Abstract: The invention relates to an electric component comprising a carrier substrate (1), which has a thermal expansion coefficient a p and a chip (2), which is fixed onto the carrier substrate (1) in a flip-chip construction by means of bumps (31 to 34). In a preferred orientation x 1 , the chip (2) has a thermal expansion co-efficient a 1 , whereby ?a 1 = |a p - a 1 | represents the first expansion differential. In a second preferred orientation x 2 , the chip (2) has a thermal expansion coefficient a 2 , whereby ?a 2 = |a p - a 2 | represents the second expansion differential. ?x 1 is the distance between the centres (310, 320) of the terminal bumps (31, 32) in the x 1 orientation. ?x 2 is the distance between the centres (330, 340) of the terminal bumps (33, 34) in the x 2 orientation. The following applies: ?x 1 2 when ?ax 1 > ?a 2 and ?x 1 > ?x 2 when ?a 1 2 . This enables the shear force that occurs during temperature modifications and that acts on the terminal bumps to be minimised.

Abstract translation: 本发明涉及一种包含（1）具有的热膨胀系数的p载体衬底的电子组件，和一个芯片（2），其是（1）安装在倒装芯片型通过凸块（31〜34）的方式在载体衬底上。 该芯片（2）具有在第一个优选的方向x _{1 的热膨胀系数的 1 ，其中 1 = | AP - 一个< SUB> 1 | 第一膨胀差。 该芯片（2）具有在第二个优选的方向x 2 的热膨胀系数的 2 ，其中 2 = | AP - 一个< SUB> 2 | 第二膨胀差。 ？X 1 是在x方向上 1 端子凸块（31，32）的中心（310，320）之间的距离。 ？X 2 是在x方向上 2 端子凸块（33，34）的中心（330，340）之间的距离。 其中 2 ？在？斧 1 >真？X 1 ？A 2 和βX 1 <在/ SUB >>？X 2 ？一个 1 <？A 2 。 从而可以最小化在温度产生的变化以及作用在终端凸点的剪切力是可能的。}

公开(公告)号：DE102008023374B4

公开(公告)日：2010-02-11

申请号：DE102008023374

申请日：2008-05-13

Applicant: EPCOS AG

Inventor： SELMEIER PETER

IPC: H03H9/54 ,  H03H9/64

公开(公告)号：DE19730710C2

公开(公告)日：2002-12-05

申请号：DE19730710

申请日：1997-07-17

Applicant: EPCOS AG

Inventor： PITSCHI MAXIMILIAN ,  SELMEIER PETER

IPC: H03H9/145 ,  H03H9/64 ,  H03H9/25

Abstract: A surface acoustic wave (SAW) filter having an improved edge steepness includes at least three resonators connected in series and/or parallel with one another. An edge steepness of a pass band is improved if a plurality of resonators with different finger periodicities of interdigital transducers are provided.

公开(公告)号：DE102008052222A1

公开(公告)日：2010-04-22

申请号：DE102008052222

申请日：2008-10-17

Applicant: EPCOS AG

Inventor： KLAMM HELMUT ,  SELMEIER PETER

IPC: H04B1/40 ,  H03H9/64

公开(公告)号：DE102008023374A1

公开(公告)日：2009-12-03

申请号：DE102008023374

申请日：2008-05-13

Applicant: EPCOS AG

Inventor： SELMEIER PETER

IPC: H03H9/54 ,  H03H9/64

Abstract: The circuit has a signal path (SP) connecting signal path inputs (SPE) with signal path outputs (SPA). Each of a set of ground connection (MA) has a base switching element (BSE1, BSE2). A series resonator i.e. surface acoustic wave resonator, and parallel resonators are switched between the inputs and the outputs, the inputs and the connections, and the connections and the outputs, respectively. A reactance element is electrically switched between the connections. The switching elements are electrically switched over inputs and outputs in the path in a parallel manner. An independent claim is also included for a method for optimizing a filter circuit.

公开(公告)号：DE10147877A1

公开(公告)日：2003-04-17

申请号：DE10147877

申请日：2001-09-28

Applicant: EPCOS AG

Inventor： KRUEGER HANS ,  PAHL WOLFGANG ,  SELMEIER PETER

IPC: H01L41/053 ,  H03H3/08 ,  H05K3/34

Abstract: Production of a component support having a piezoelectric component comprises: (a) soldering a component with a piezoelectric substrate (S) onto a component support (BT) in a flip chip assembly; and (b) removing the substrate material from the surface facing away from the component support until the required reduced substrate layer thickness is reached. Production of a component support having a piezoelectric component comprises: (a) soldering a component with a piezoelectric substrate (S) onto a component support (BT) in a flip chip assembly so that the component structures are arranged on the substrate surface facing the component support; and (b) removing the substrate material from the surface facing away from the component support until the required reduced substrate layer thickness is reached. Preferably the region between the lower edges of the substrate and the component support is filled with an elastic plastic composition after soldering the component and before removing the substrate material. The component is reduced up to a thickness of less than 300 microns .

公开(公告)号：DE10147877B4

公开(公告)日：2011-08-11

申请号：DE10147877

申请日：2001-09-28

Applicant: EPCOS AG

Inventor： KRUEGER HANS ,  PAHL WOLFGANG ,  SELMEIER PETER

IPC: H01L21/58 ,  B24C1/00 ,  H01L21/304 ,  H01L21/60 ,  H01L41/053 ,  H03H3/08

Abstract: Verfahren zur Herstellung eines mit zumindest einem piezoelektrischen Bauelement bestückten Bauelementträgers geringer Bauhöhe mit den Schritten: – Auflöten eines Bauelements mit einem piezoelektrischen Substrat (S) auf einen Bauelementträger (BT) in Flip Chip Montagetechnik, so daß die Bauelement-Strukturen (BS) auf der zum Bauelementträger weisenden Substratoberfläche angeordnet sind – Abtragen von Substratmaterial von der dem Bauelementträger abgewandten Oberfläche, bis eine gewünschte reduzierte Substratschichtdicke erreicht ist.

公开(公告)号：DE10301934A1

公开(公告)日：2004-07-29

申请号：DE10301934

申请日：2003-01-20

Applicant: EPCOS AG

Inventor： KREMS TOBIAS ,  SELMEIER PETER

IPC: H03H9/145 ,  H03H9/64 ,  H01L23/50 ,  H03H9/02 ,  H03H9/54

Abstract: Electrical component comprises a substrate with component structures (BS) on which are arranged solder metallizations (LA) electrically connected to the component structures. The substrate is connected in a flip-chip arrangement to a support (T) via bump connections formed by solder bumps (B). At least one of the bump connections sits on a non-round solder metallization.

公开(公告)号：CA2378303A1

公开(公告)日：2001-01-18

申请号：CA2378303

申请日：2000-07-06

Applicant: EPCOS AG

Inventor： SELMEIER PETER

IPC: H03H3/10 ,  H03H9/10 ,  H03H9/25 ,  H03H9/64

Abstract: The invention relates to a surface acoustic wave (SAW) filter of the reactan ce filter type comprising at least two SAW resonators (R2, R3) in two parallel branches and comprising a SAW resonator (R1) in a serial branch. According t o the invention, an electric connection, said connection being produced on the substrate, of the ground sides (12-6, 12-7) of both SAW resonators (R2, R3) in the parallel branches is provided before the connection (12-5) to the housin g in order to be able to shift the pole location associated with the parallel branch to a lower frequency.

公开(公告)号：DE102004037817A1

公开(公告)日：2006-03-16

申请号：DE102004037817

申请日：2004-08-04

Applicant: EPCOS AG

Inventor： KRUEGER HANS ,  NICOLAUS KARL ,  PORTMANN JUERGEN ,  SELMEIER PETER

IPC: H03H9/25 ,  H01L21/60 ,  H01L23/14 ,  H01L23/50