公开(公告)号：WO2013132065A2

公开(公告)日：2013-09-12

申请号：PCT/EP2013/054725

申请日：2013-03-08

Applicant: EPCOS AG

Inventor： SCHIFFER, Michael ,  PESCHKA, Andreas ,  ZAPF, Jörg ,  WEIDNER, Karl ,  HEDLER, Harry

IPC: G01L19/14

CPC classification number: G01L19/14 ,  B23K1/0008 ,  B23K1/0016 ,  B81B7/007 ,  B81B2207/092 ,  B81B2207/096 ,  G01D11/245 ,  G01L19/147 ,  G01L19/148 ,  G01P1/023 ,  H01L2224/16225 ,  H01L2924/10155 ,  H01L2924/15151

Abstract: Es wird ein Mikromechanisches Messelement (1) angegeben, das ein sensitives Element (21) und einen Träger (3) aufweist. Das sensitive Element (21) ist mittels zumindest einer ersten und zumindest einer zweiten Lotverbindung (41, 42) mit dem Träger (3) verbunden, wobei das das sensitive Element (21) über die erste Lotverbindung (41) elektrisch kontaktiert wird. Des Weiteren bildet das sensitive Element (21), der Träger (3) und die zweite Lotverbindung (42) eine erste Kammer (51), die eine erste Öffnung (61) aufweist. Weiterhin wird ein Verfahren zur Herstellung eines mikromechanischen Messelements (1) angegeben.

Abstract translation: 提供了一种具有一个敏感元件（21）和载体（3）的微机械传感元件（1）。 通过连接到载体（3），其中所述敏感元件（21）由所述第一焊料（41）电接触的至少一个第一和至少一个第二钎焊接合部（41，42）的装置中的敏感元件（21）。 此外，敏感元件（21），所述载体（3）和所述第二焊接接头（42），其限定第一腔室（51）具有第一开口（61）。 此外，被指定用于制造微机械的感应元件（1）的方法。

公开(公告)号：WO2009150087A3

公开(公告)日：2009-12-17

申请号：PCT/EP2009/056832

申请日：2009-06-03

Applicant: EPCOS AG ,  PAHL, Wolfgang ,  WEIDNER, Karl

Inventor： PAHL, Wolfgang ,  WEIDNER, Karl

IPC: B81B7/00 ,  H01L23/498

Abstract: Ein Chip (2, 3) wird über einer Oberseite eines flexiblen Trägers (1) angeordnet und von dem Träger mechanisch entkoppelt. Elektrische Verbindungen (8, 11) des Chips sind in einer planaren Verbindungstechnik ausgeführt. Der Chip kann vom Träger durch einen Luftspalt oder eine Grundschicht (7) aus einem weichen oder kompressiblen Material getrennt sein.

公开(公告)号：EP2823276B1

公开(公告)日：2018-05-02

申请号：EP13710814.8

申请日：2013-03-08

Applicant: Epcos AG

Inventor： SCHIFFER, Michael ,  PESCHKA, Andreas ,  ZAPF, Jörg ,  WEIDNER, Karl ,  HEDLER, Harry

IPC: B23K1/00 ,  G01P1/02 ,  G01D11/24 ,  G01L19/14 ,  B81B7/00

CPC classification number: G01L19/14 ,  B23K1/0008 ,  B23K1/0016 ,  B81B7/007 ,  B81B2207/092 ,  B81B2207/096 ,  G01D11/245 ,  G01L19/147 ,  G01L19/148 ,  G01P1/023 ,  H01L2224/16225 ,  H01L2924/10155 ,  H01L2924/15151

公开(公告)号：EP1080615B1

公开(公告)日：2002-02-13

申请号：EP99930999.0

申请日：1999-05-03

Applicant: EPCOS AG

Inventor： STELZL, Alois ,  KRÜGER, Hans ,  WEIDNER, Karl ,  WOSSLER, Manfred

IPC: H05K3/18 ,  H05K3/24 ,  H05K3/42

CPC classification number: H05K3/403 ,  H01L21/4853 ,  H01L23/49805 ,  H01L23/49816 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H03H3/00 ,  H05K1/0243 ,  H05K3/0052 ,  H05K3/242 ,  H05K3/245 ,  H05K3/3442 ,  H05K3/3473 ,  H05K3/42 ,  H05K2201/09181 ,  H05K2201/09481 ,  H05K2201/10083 ,  H05K2203/043 ,  H05K2203/1572 ,  H01L2224/81

Abstract: The invention relates to a multiple printed panel (1) which can be divided into individual printed panels (2) for electronic components (3), especially acoustic surface wave components. Each of these electronic components is suitable for contacting chips on the individual printed panels (2) using the flip-chip technique and for contacting the individual printed panels (2) with external connections using SMD technology. The inventive multiple printed panel (1) has metal-plated surfaces (5) for each individual printed panel (2), said metal-plated surfaces being located on a network which is integrated in the multiple printed panel and leads to a terminal pole (8). The bumps (13) are formed by galvanically separating metal onto the metal-plated surfaces (5).

公开(公告)号：EP1057258B1

公开(公告)日：2002-10-30

申请号：EP99915480.0

申请日：1999-02-16

Applicant: EPCOS AG

Inventor： STELZL, Alois ,  KRÜGER, Hans ,  WEIDNER, Karl ,  WOSSLER, Manfred

IPC: H03H9/05

CPC classification number: H03H9/1092 ,  H01L2924/0002 ,  H03H9/058 ,  Y10T29/42 ,  H01L2924/00

Abstract: The invention relates to an OFW component working with acoustic surface waves. Said component comprises a chip (1), a piezoelectric substrate (1a), electrically conductive structures (2, 3, 4) arranged on the substrate and a base plate (15) with external electrical connections lines which are in contact with the electrical conductive structures of the chip (1). A protective film (5, 6) is applied on the surface of the chip supporting the electrically conductive structures (2, 3, 4), which has electrical contact elements (7, 11) on the surface opposite to their piezoelectric substrate (1a). Said elements are connected directly to the structures (2, 3, 4) of the chip (1) by through contacts (8) in the protective film (5, 6) and/or through bumps (10) and to the electrical connection elements of the base plate (15) using SMT technology.

公开(公告)号：EP1080615A1

公开(公告)日：2001-03-07

申请号：EP99930999.0

申请日：1999-05-03

Applicant: EPCOS AG

Inventor： STELZL, Alois ,  KRÜGER, Hans ,  WEIDNER, Karl ,  WOSSLER, Manfred

IPC: H05K3/18 ,  H05K3/24 ,  H05K3/42

CPC classification number: H05K3/403 ,  H01L21/4853 ,  H01L23/49805 ,  H01L23/49816 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H03H3/00 ,  H05K1/0243 ,  H05K3/0052 ,  H05K3/242 ,  H05K3/245 ,  H05K3/3442 ,  H05K3/3473 ,  H05K3/42 ,  H05K2201/09181 ,  H05K2201/09481 ,  H05K2201/10083 ,  H05K2203/043 ,  H05K2203/1572 ,  H01L2224/81

Abstract: The invention relates to a multiple printed panel (1) which can be divided into individual printed panels (2) for electronic components (3), especially acoustic surface wave components. Each of these electronic components is suitable for contacting chips on the individual printed panels (2) using the flip-chip technique and for contacting the individual printed panels (2) with external connections using SMD technology. The inventive multiple printed panel (1) has metal-plated surfaces (5) for each individual printed panel (2), said metal-plated surfaces being located on a network which is integrated in the multiple printed panel and leads to a terminal pole (8). The bumps (13) are formed by galvanically separating metal onto the metal-plated surfaces (5).

公开(公告)号：EP1057258A1

公开(公告)日：2000-12-06

申请号：EP99915480.0

申请日：1999-02-16

Applicant: EPCOS AG

Inventor： STELZL, Alois ,  KRÜGER, Hans ,  WEIDNER, Karl ,  WOSSLER, Manfred

IPC: H03H9/05

CPC classification number: H03H9/1092 ,  H01L2924/0002 ,  H03H9/058 ,  Y10T29/42 ,  H01L2924/00

Abstract: The invention relates to an OFW component working with acoustic surface waves. Said component comprises a chip (1), a piezoelectric substrate (1a), electrically conductive structures (2, 3, 4) arranged on the substrate and a base plate (15) with external electrical connections lines which are in contact with the electrical conductive structures of the chip (1). A protective film (5, 6) is applied on the surface of the chip supporting the electrically conductive structures (2, 3, 4), which has electrical contact elements (7, 11) on the surface opposite to their piezoelectric substrate (1a). Said elements are connected directly to the structures (2, 3, 4) of the chip (1) by through contacts (8) in the protective film (5, 6) and/or through bumps (10) and to the electrical connection elements of the base plate (15) using SMT technology.

公开(公告)号：EP2823276A2

公开(公告)日：2015-01-14

申请号：EP13710814.8

申请日：2013-03-08

Applicant: Epcos AG

Inventor： SCHIFFER, Michael ,  PESCHKA, Andreas ,  ZAPF, Jörg ,  WEIDNER, Karl ,  HEDLER, Harry

IPC: G01L19/14 ,  B81B7/00 ,  B81C1/00

CPC classification number: G01L19/14 ,  B23K1/0008 ,  B23K1/0016 ,  B81B7/007 ,  B81B2207/092 ,  B81B2207/096 ,  G01D11/245 ,  G01L19/147 ,  G01L19/148 ,  G01P1/023 ,  H01L2224/16225 ,  H01L2924/10155 ,  H01L2924/15151

Abstract: The invention relates to a micromechanical measuring element (1) which has a sensitive element (21) and a support (3). The sensitive element (21) is connected to the support (3) by means of at least one first and at least one second solder connection (41, 42), said sensitive element (21) being electrically contacted via the first solder connection (41). Furthermore, the sensitive element (21), the support (3), and the second solder connection (42) form a first chamber (51) which has a first opening (61). The invention further relates to a method for producing a micromechanical measuring element (1).

Abstract translation: 微机械测量元件包括载体和通过第一焊接连接和第二焊接连接到载体的敏感元件。 敏感元件通过第一焊接接触电接触。 敏感元件，载体和第二焊接连接形成第一室。 第一个房间有第一个开口。