公开(公告)号：US20190371764A1

公开(公告)日：2019-12-05

申请号：US15993102

申请日：2018-05-30

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Jai-Tai KUO ,  Chang-Hsieh WU ,  Tzu-Hsiang WANG ,  Chi-Chih PU ,  Ya-Wen LIN ,  Pei-Yu LI

IPC: H01L25/065

Abstract: An electronic device includes a top carrier having a first top surface and a first bottom surface, a first electronic element formed on the first top surface, a second electronic element formed on the first bottom surface, a bottom carrier below the top carrier and having a second top surface near the top carrier, and a controller formed on the second top surface.