公开(公告)号：US20230395562A1

公开(公告)日：2023-12-07

申请号：US18450373

申请日：2023-08-15

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Shih-An LIAO ,  Ying-Yang SU ,  Hsin-Mao LIU ,  Tzu-Hsiang WANG ,  Chi-Chih PU

IPC: H01L23/00 ,  H01L25/16 ,  H01L25/075 ,  H01L23/498 ,  B23K26/22

CPC classification number: H01L24/81 ,  H01L25/167 ,  H01L25/0753 ,  H01L24/83 ,  H01L23/49866 ,  B23K26/22 ,  B23K2101/40

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

公开(公告)号：US20230207540A1

公开(公告)日：2023-06-29

申请号：US18082199

申请日：2022-12-15

Applicant: EPISTAR CORPORATION ,  Yenrich Technology Corporation

Inventor： Min-Hsun HSIEH ,  Hsin-Mao LIU ,  Tzu-Hsiang WANG ,  Ya-Wen LIN ,  Chi-Chih PU ,  Hsiao-Pei CHIU ,  Ching-Tai CHENG ,  Chong-Yu WANG

IPC: H01L25/13 ,  H01L25/075 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L25/13 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62

Abstract: A light-emitting device includes a circuit carrier board having a short side and a long side, a plurality of light-emitting units on the circuit carrier board for emitting three or more color lights, and a light-transmitting glue layer on the circuit carrier board and covering the plurality of light-emitting units. The short side is shorter than the long side. The plurality of light-emitting units include a first light-emitting unit. The first light-emitting unit has a light exit surface, a first sidewall, and a second sidewall. The first sidewall faces the short side and has a first included angle with the light exit surface, and the second sidewall faces the long side and has a second included angle with the light exit surface. The first included angle is between 85 to 95 degrees, and the second included angle is less than 85 degrees or greater than 105 degrees.

公开(公告)号：US20230378142A1

公开(公告)日：2023-11-23

申请号：US18200429

申请日：2023-05-22

Applicant: Yenrich Technology Corporation ,  EPISTAR CORPORATION

Inventor： Li-Yuan HUANG ,  Tzu-Hsiang WANG ,  Chi-Chih PU ,  Ya-Wen LIN ,  Pei-Yu LI ,  Hsiao-Pei CHIU

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/38

CPC classification number: H01L25/0753 ,  H01L33/62 ,  H01L33/38 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: A pixel package includes a base material, a circuit structure, light-emitting semiconductor elements, a non-light-emitting semiconductor element, and a light-transmitting adhesive layer. The base material has an upper surface, a lower surface, and a side surface. The circuit structure is buried in the base material and includes an first circuit layer exposed from the upper surface, bottom electrodes exposed from the lower surface, and a middle circuit layer between the upper circuit layer and the plurality of bottom electrodes and covered by the base material. The light-emitting semiconductor elements are on the upper surface and electrically connected to the circuit structure. The non-light-emitting semiconductor element is buried in the base material and directly connected to the middle circuit layer, and at least one outside surface is exposed. The light-transmitting adhesive layer covers the light-emitting semiconductor elements and is in direct contact with the base material.

公开(公告)号：US20220392876A1

公开(公告)日：2022-12-08

申请号：US17830268

申请日：2022-06-01

Applicant: EPISTAR CORPORATION ,  Yenrich Technology Corporation

Inventor： Min-Hsun HSIEH ,  Hsin-Mao LIU ,  Li-Yuan HUANG ,  Tzu-Hsiang WANG ,  Chi-Chih PU ,  Ya-Wen LIN ,  Hsiao-Pei CHIU ,  Pei-Yu LI

IPC: H01L25/075 ,  H01L33/62

Abstract: A light-emitting device includes a first carrier, which includes a side surface between a first surface and a second surface, upper conductive pads on the first surface, and lower conductive pads under the second surface; a RDL pixel package includes a RDL which includes bonding pads and bottom electrodes, and the light-emitting units on the RDL, and connected to the bonding pads. A light-transmitting layer on the RDL and covers the light-emitting units, an upper surface, a lower surface, and a lateral surface between the upper surface and the lower surface. The RDL pixel package is on the first surface and electrically connected to the upper conductive pads. A protective layer covers the first surface and contacting the side surface of the RDL pixel package. The lower electrodes and the upper conductive pads are connected, and the distance between two adjacent bonding pads is less than 30 μm.

公开(公告)号：US20210083162A1

公开(公告)日：2021-03-18

申请号：US17107391

申请日：2020-11-30

Applicant: EPISTAR CORPORATION

Inventor： Tzu-Hsiang WANG ,  Chi-Chih PU ,  Chen-Hong LEE

IPC: H01L33/62 ,  F21K9/232

Abstract: A light emitting device includes a substrate, a first group of light emitting diode (LED) structures, a second group of LED structures, and a connection port is provided. The substrate has a first surface and a second surface opposite to the first surface. The first group of LED structures is disposed on one side of the first surface. The second group of LED structures is disposed on another side of the first surface opposite to the first group of LED structures. The connection portion includes at least an opening, and a first connection pad and a second connection pad electrically coupled to at least a part of the LED structures. The connection port is adapted to be coupled to other device through the opening. A light emitting module and an illuminating apparatus are also provided.

公开(公告)号：US20200243737A1

公开(公告)日：2020-07-30

申请号：US16748860

申请日：2020-01-22

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Shih-An LIAO ,  Ying-Yang SU ,  Hsin-Mao LIU ,  Tzu-Hsiang WANG ,  Chi-Chih PU

IPC: H01L33/62 ,  H01L33/60 ,  H01L25/075

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

公开(公告)号：US20200243478A1

公开(公告)日：2020-07-30

申请号：US16551764

申请日：2019-08-27

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Shih-An LIAO ,  Ying-Yang SU ,  Hsin-Mao LIU ,  Tzu-Hsiang WANG ,  Chi-Chih PU

IPC: H01L23/00 ,  H01L25/16 ,  H01L25/075 ,  H01L23/498 ,  B23K26/22

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

公开(公告)号：US20190371764A1

公开(公告)日：2019-12-05

申请号：US15993102

申请日：2018-05-30

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Jai-Tai KUO ,  Chang-Hsieh WU ,  Tzu-Hsiang WANG ,  Chi-Chih PU ,  Ya-Wen LIN ,  Pei-Yu LI

IPC: H01L25/065

Abstract: An electronic device includes a top carrier having a first top surface and a first bottom surface, a first electronic element formed on the first top surface, a second electronic element formed on the first bottom surface, a bottom carrier below the top carrier and having a second top surface near the top carrier, and a controller formed on the second top surface.

公开(公告)号：US20230207742A1

公开(公告)日：2023-06-29

申请号：US17565158

申请日：2021-12-29

Applicant: EPISTAR CORPORATION ,  Yenrich Technology Corporation

Inventor： Chi-Chih PU ,  Li-Yuan HUANG ,  Tzu-Hsiang WANG ,  Ya-Wen LIN

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/62 ,  H01L33/38

CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/382

Abstract: A pixel package includes an electrode structure, a plurality of light-emitting units arranged on the electrode structure, and a light transmitting layer. The electrode structure has an upper layer with a first upper sheet, a lower layer with a first lower sheet, and a supporting layer arranged between the upper layer and the lower layer. The electrode structure and the plurality of light-emitting units are fully embedded in the light transmitting layer. In a top view of the pixel package, the first upper sheet is overlapped with and larger than the first lower sheet.

公开(公告)号：US20220310555A1

公开(公告)日：2022-09-29

申请号：US17838307

申请日：2022-06-13

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Shih-An LIAO ,  Ying-Yang SU ,  Hsin-Mao LIU ,  Tzu-Hsiang WANG ,  Chi-Chih PU

IPC: H01L23/00 ,  H01L25/16 ,  H01L25/075 ,  H01L23/498 ,  B23K26/22

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.