公开(公告)号：US20190371764A1

公开(公告)日：2019-12-05

申请号：US15993102

申请日：2018-05-30

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Jai-Tai KUO ,  Chang-Hsieh WU ,  Tzu-Hsiang WANG ,  Chi-Chih PU ,  Ya-Wen LIN ,  Pei-Yu LI

IPC: H01L25/065

Abstract: An electronic device includes a top carrier having a first top surface and a first bottom surface, a first electronic element formed on the first top surface, a second electronic element formed on the first bottom surface, a bottom carrier below the top carrier and having a second top surface near the top carrier, and a controller formed on the second top surface.

公开(公告)号：US20230378142A1

公开(公告)日：2023-11-23

申请号：US18200429

申请日：2023-05-22

Applicant: Yenrich Technology Corporation ,  EPISTAR CORPORATION

Inventor： Li-Yuan HUANG ,  Tzu-Hsiang WANG ,  Chi-Chih PU ,  Ya-Wen LIN ,  Pei-Yu LI ,  Hsiao-Pei CHIU

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/38

CPC classification number: H01L25/0753 ,  H01L33/62 ,  H01L33/38 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: A pixel package includes a base material, a circuit structure, light-emitting semiconductor elements, a non-light-emitting semiconductor element, and a light-transmitting adhesive layer. The base material has an upper surface, a lower surface, and a side surface. The circuit structure is buried in the base material and includes an first circuit layer exposed from the upper surface, bottom electrodes exposed from the lower surface, and a middle circuit layer between the upper circuit layer and the plurality of bottom electrodes and covered by the base material. The light-emitting semiconductor elements are on the upper surface and electrically connected to the circuit structure. The non-light-emitting semiconductor element is buried in the base material and directly connected to the middle circuit layer, and at least one outside surface is exposed. The light-transmitting adhesive layer covers the light-emitting semiconductor elements and is in direct contact with the base material.

公开(公告)号：US20220392876A1

公开(公告)日：2022-12-08

申请号：US17830268

申请日：2022-06-01

Applicant: EPISTAR CORPORATION ,  Yenrich Technology Corporation

Inventor： Min-Hsun HSIEH ,  Hsin-Mao LIU ,  Li-Yuan HUANG ,  Tzu-Hsiang WANG ,  Chi-Chih PU ,  Ya-Wen LIN ,  Hsiao-Pei CHIU ,  Pei-Yu LI

IPC: H01L25/075 ,  H01L33/62

Abstract: A light-emitting device includes a first carrier, which includes a side surface between a first surface and a second surface, upper conductive pads on the first surface, and lower conductive pads under the second surface; a RDL pixel package includes a RDL which includes bonding pads and bottom electrodes, and the light-emitting units on the RDL, and connected to the bonding pads. A light-transmitting layer on the RDL and covers the light-emitting units, an upper surface, a lower surface, and a lateral surface between the upper surface and the lower surface. The RDL pixel package is on the first surface and electrically connected to the upper conductive pads. A protective layer covers the first surface and contacting the side surface of the RDL pixel package. The lower electrodes and the upper conductive pads are connected, and the distance between two adjacent bonding pads is less than 30 μm.