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公开(公告)号:US10670244B2
公开(公告)日:2020-06-02
申请号:US16365115
申请日:2019-03-26
Applicant: EPISTAR CORPORATION
Inventor: Chi-Chih Pu , Chen-Hong Lee , Shih-Yu Yeh , Wei-Kang Cheng , Shyi-Ming Pan , Siang-Fu Hong , Chih-Shu Huang , Tzu-Hsiang Wang , Shih-Chieh Tang , Cheng-Kuang Yang
IPC: F21V21/14 , H01L33/50 , H01L33/48 , H01L33/44 , F21V21/00 , H01L25/075 , F21V29/85 , F21V3/02 , F21V17/10 , F21V23/06 , H01L23/00 , H01L33/00 , F21Y107/00 , F21Y115/10
Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.
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公开(公告)号:USRE48798E1
公开(公告)日:2021-10-26
申请号:US16172403
申请日:2018-10-26
Applicant: EPISTAR CORPORATION
Inventor: Chih-Shu Huang , Chang-Hseih Wu , Min-Hsun Hsieh
IPC: H05B33/08 , H02M5/25 , H05B45/31 , H05B45/395 , H05B45/355
Abstract: A driver includes a semiconductor chip, a bridge rectifier, and a current driver. The semiconductor chip includes a rectifying diode and a constant current source formed thereon. The bridge rectifier includes the rectifying diode. The current driver includes the first constant current source to provide a constant current.
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公开(公告)号:US10247395B2
公开(公告)日:2019-04-02
申请号:US15663125
申请日:2017-07-28
Applicant: EPISTAR CORPORATION
Inventor: Chi-Chih Pu , Chen-Hong Lee , Shih-Yu Yeh , Wei-Kang Cheng , Shyi-Ming Pan , Siang-Fu Hong , Chih-Shu Huang , Tzu-Hsiang Wang , Shih-Chieh Tang , Cheng-Kuang Yang
Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.
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公开(公告)号:US09894719B2
公开(公告)日:2018-02-13
申请号:US15059053
申请日:2016-03-02
Applicant: EPISTAR CORPORATION
Inventor: Chih-Shu Huang , Chang-Hseih Wu , Min-Hsun Hsieh
CPC classification number: H05B33/0809 , H02M5/25 , H05B33/0803 , Y02B20/348
Abstract: A driver includes a semiconductor chip, a bridge rectifier, and a current driver. The semiconductor chip includes a rectifying diode and a constant current source formed thereon. The bridge rectifier includes the rectifying diode. The current driver includes the first constant current source to provide a constant current.
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公开(公告)号:US11808436B2
公开(公告)日:2023-11-07
申请号:US17651891
申请日:2022-02-21
Applicant: EPISTAR CORPORATION
Inventor: Chi-Chih Pu , Chen-Hong Lee , Shih-Yu Yeh , Wei-Kang Cheng , Shyi-Ming Pan , Siang-Fu Hong , Chih-Shu Huang , Tzu-Hsiang Wang , Shih-Chieh Tang , Cheng-Kuang Yang
IPC: F21V21/14 , H01L33/50 , H01L33/48 , H01L33/44 , F21K9/232 , F21V21/00 , H01L25/075 , F21V29/85 , F21V3/02 , F21V17/10 , F21V23/06 , H01L33/00 , F21Y107/00 , F21Y115/10 , H01L23/00
CPC classification number: F21V21/14 , F21K9/232 , F21V3/02 , F21V17/10 , F21V21/00 , F21V23/06 , F21V29/85 , H01L25/0753 , H01L33/44 , H01L33/486 , H01L33/50 , H01L33/508 , F21Y2107/00 , F21Y2115/10 , H01L24/14 , H01L24/16 , H01L24/48 , H01L24/49 , H01L33/007 , H01L2224/1403 , H01L2224/14051 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48465 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , H01L2224/83385 , H01L2224/8592 , H01L2924/00011 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/19107 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2224/45147 , H01L2924/00 , H01L2924/3025 , H01L2924/00 , H01L2224/48465 , H01L2224/48091 , H01L2924/00 , H01L2924/00014 , H01L2224/13099 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00 , H01L2924/00014 , H01L2224/45099 , H01L2224/73204 , H01L2224/16225 , H01L2224/32225 , H01L2924/00 , H01L2924/01322 , H01L2924/00 , H01L2924/12041 , H01L2924/00 , H01L2924/00011 , H01L2924/01015 , H01L2224/48465 , H01L2224/48227 , H01L2924/00
Abstract: A light emitting apparatus, including: a first light emitting device with a first substrate having a first upper surface and first bottom surface, a plurality of first LED chips disposed on the first upper surface, emitting a light penetrating the first substrate, and a first wavelength conversion layer directly contacting the plurality of first LED chips and first upper surface, and a first shape in a cross-sectional view; a second wavelength conversion layer directly contacting the first bottom surface; a second shape in the cross-sectional view substantially the same as the first shape; a second light emitting device separated from the first light emitting device, including a second substrate and plurality of second LEDs disposed on the second substrate; a support base connected to the first light emitting device by a first angle and connected to the second light emitting device by a second angle; and a first support arranged between the support base and first light emitting device.
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公开(公告)号:US11255524B2
公开(公告)日:2022-02-22
申请号:US16887948
申请日:2020-05-29
Applicant: EPISTAR CORPORATION
Inventor: Chi-Chih Pu , Chen-Hong Lee , Shih-Yu Yeh , Wei-Kang Cheng , Shyi-Ming Pan , Siang-Fu Hong , Chih-Shu Huang , Tzu-Hsiang Wang , Shih-Chieh Tang , Cheng-Kuang Yang
IPC: F21V21/14 , H01L33/50 , H01L33/48 , H01L33/44 , F21K9/232 , F21V21/00 , H01L25/075 , F21V29/85 , F21V3/02 , F21V17/10 , F21V23/06 , H01L23/00 , H01L33/00 , F21Y107/00 , F21Y115/10
Abstract: A light-emitting device including a substrate with a top surface and a bottom surface opposite to the top surface and a plurality of LED chips disposed on the top surface and configured to generate a top light visible above the top surface and a bottom light visible beneath the bottom surface, each LED chip comprising a plurality of light-emitting surfaces. The substrate has a thickness greater than 200 μm and comprises aluminum oxide, sapphire, glass, plastic, or rubber. The plurality of LED chips has an incident light with a wavelength of 420-470 nm. The top light and the bottom light have a color temperature difference of not greater than 1500K.
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公开(公告)号:US10306714B2
公开(公告)日:2019-05-28
申请号:US15601616
申请日:2017-05-22
Applicant: EPISTAR CORPORATION
Inventor: Chih-Shu Huang , Chun-Ju Tun , Shyi-Ming Pan , Wei-Kang Cheng , Keng-Ying Liao
Abstract: A semiconductor component including a Wheatstone bridge rectifying circuit and a transistor is provided, wherein the Wheatstone bridge rectifying circuit and the transistor are formed on a same growth substrate, and wherein the Wheatstone bridge rectifying circuit includes a first rectifying diode; a second rectifying diode electrically connected to the first rectifying diode; a third rectifying diode electrically connected to the second rectifying diode; and a fourth rectifying diode electrically connected to the third rectifying diode.
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