公开(公告)号：US10670244B2

公开(公告)日：2020-06-02

申请号：US16365115

申请日：2019-03-26

Applicant: EPISTAR CORPORATION

Inventor： Chi-Chih Pu ,  Chen-Hong Lee ,  Shih-Yu Yeh ,  Wei-Kang Cheng ,  Shyi-Ming Pan ,  Siang-Fu Hong ,  Chih-Shu Huang ,  Tzu-Hsiang Wang ,  Shih-Chieh Tang ,  Cheng-Kuang Yang

IPC: F21V21/14 ,  H01L33/50 ,  H01L33/48 ,  H01L33/44 ,  F21V21/00 ,  H01L25/075 ,  F21V29/85 ,  F21V3/02 ,  F21V17/10 ,  F21V23/06 ,  H01L23/00 ,  H01L33/00 ,  F21Y107/00 ,  F21Y115/10

Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.

公开(公告)号：US10340431B2

公开(公告)日：2019-07-02

申请号：US15867218

申请日：2018-01-10

Applicant: EPISTAR CORPORATION

Inventor： Jai-Tai Kuo ,  Min-Hsun Hsieh ,  Lung-Kuan Lai ,  Wei-Kang Cheng ,  Chien-Liang Liu ,  Yih-Hua Renn ,  Shou-Lung Chen ,  Tsun-Kai Ko ,  Chi-Chih Pu

IPC: H01L33/46 ,  H01L33/48 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

Abstract: This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting diode, a pad electrically connected to the active layer, a metal bump formed on the pad, and a reflective insulation layer. The metal bump has a first side surface and a first bottom surface, wherein the first bottom surface comprises a curved boundary, a longer axis, and a shorter axis. The reflective insulation layer is directly contacting the first side surface, and exposing the first bottom surface.

公开(公告)号：US11515457B2

公开(公告)日：2022-11-29

申请号：US16863107

申请日：2020-04-30

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun Hsieh ,  Jai-Tai Kuo ,  Wei-Kang Cheng

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/48 ,  H01L33/50 ,  H01L33/62 ,  H01L33/58

Abstract: The present application discloses a light-emitting device comprising a light-emitting unit and a flexible carrier supporting the light-emitting unit. The light-emitting unit comprises a LED chip, a first reflective layer on the LED chip and an optical diffusion layer formed between the first reflective layer and the LED chip.

公开(公告)号：US11255524B2

公开(公告)日：2022-02-22

申请号：US16887948

申请日：2020-05-29

Applicant: EPISTAR CORPORATION

Inventor： Chi-Chih Pu ,  Chen-Hong Lee ,  Shih-Yu Yeh ,  Wei-Kang Cheng ,  Shyi-Ming Pan ,  Siang-Fu Hong ,  Chih-Shu Huang ,  Tzu-Hsiang Wang ,  Shih-Chieh Tang ,  Cheng-Kuang Yang

IPC: F21V21/14 ,  H01L33/50 ,  H01L33/48 ,  H01L33/44 ,  F21K9/232 ,  F21V21/00 ,  H01L25/075 ,  F21V29/85 ,  F21V3/02 ,  F21V17/10 ,  F21V23/06 ,  H01L23/00 ,  H01L33/00 ,  F21Y107/00 ,  F21Y115/10

Abstract: A light-emitting device including a substrate with a top surface and a bottom surface opposite to the top surface and a plurality of LED chips disposed on the top surface and configured to generate a top light visible above the top surface and a bottom light visible beneath the bottom surface, each LED chip comprising a plurality of light-emitting surfaces. The substrate has a thickness greater than 200 μm and comprises aluminum oxide, sapphire, glass, plastic, or rubber. The plurality of LED chips has an incident light with a wavelength of 420-470 nm. The top light and the bottom light have a color temperature difference of not greater than 1500K.

公开(公告)号：US10306714B2

公开(公告)日：2019-05-28

申请号：US15601616

申请日：2017-05-22

Applicant: EPISTAR CORPORATION

Inventor： Chih-Shu Huang ,  Chun-Ju Tun ,  Shyi-Ming Pan ,  Wei-Kang Cheng ,  Keng-Ying Liao

IPC: H01L27/06 ,  H01L27/15 ,  H01L33/00 ,  H05B33/08 ,  H05B37/02 ,  H01L29/872 ,  H05B33/02

Abstract: A semiconductor component including a Wheatstone bridge rectifying circuit and a transistor is provided, wherein the Wheatstone bridge rectifying circuit and the transistor are formed on a same growth substrate, and wherein the Wheatstone bridge rectifying circuit includes a first rectifying diode; a second rectifying diode electrically connected to the first rectifying diode; a third rectifying diode electrically connected to the second rectifying diode; and a fourth rectifying diode electrically connected to the third rectifying diode.

公开(公告)号：US10586895B2

公开(公告)日：2020-03-10

申请号：US16294411

申请日：2019-03-06

Applicant: EPISTAR CORPORATION

Inventor： Han-Zhong Liao ,  Chih-Hsuan Lu ,  Fang-I Li ,  Wei-Kang Cheng ,  Shyi-Ming Pan

IPC: H01L33/42 ,  H01L33/20 ,  H01L33/38

Abstract: A LED chip including a first semiconductor layer; an active layer; a second semiconductor layer; a plurality of indentations, wherein each indentation extends downward to reach and expose the first semiconductor layer, wherein each indentation includes a bottom part and two side surfaces in a cross sectional view; an exposing area exposing the first semiconductor layer at a side of the LED chip; a first metal layer disposed on the second semiconductor layer and electrically connecting to the first semiconductor layer; and a first insulating layer formed between the first metal layer and the second semiconductor layer to isolate the first metal layer from the second semiconductor layer; wherein the first metal layer continuously extends to the plurality of indentations, covers the bottom part, the two side surfaces of each indentation and a top surface of the second semiconductor layer around the two side surfaces and contacts the exposing area; and wherein the first metal layer includes a plurality of recesses corresponding to the plurality of indentations.

公开(公告)号：US20190207061A1

公开(公告)日：2019-07-04

申请号：US16294411

申请日：2019-03-06

Applicant: EPISTAR CORPORATION

Inventor： Han-Zhong Liao ,  Chih-Hsuan Lu ,  Fang-I Li ,  Wei-Kang Cheng ,  Shyi-Ming Pan

IPC: H01L33/42 ,  H01L33/20 ,  H01L33/38

CPC classification number: H01L33/42 ,  H01L33/20 ,  H01L33/38

Abstract: A LED chip including a first semiconductor layer; an active layer; a second semiconductor layer; a plurality of indentations, wherein each indentation extends downward to reach and expose the first semiconductor layer, wherein each indentation includes a bottom part and two side surfaces in a cross sectional view; an exposing area exposing the first semiconductor layer at a side of the LED chip; a first metal layer disposed on the second semiconductor layer and electrically connecting to the first semiconductor layer; and a first insulating layer formed between the first metal layer and the second semiconductor layer to isolate the first metal layer from the second semiconductor layer; wherein the first metal layer continuously extends to the plurality of indentations, covers the bottom part, the two side surfaces of each indentation and a top surface of the second semiconductor layer around the two side surfaces and contacts the exposing area; and wherein the first metal layer includes a plurality of recesses corresponding to the plurality of indentations.

公开(公告)号：US10256371B2

公开(公告)日：2019-04-09

申请号：US14826646

申请日：2015-08-14

Applicant: EPISTAR CORPORATION

Inventor： Han-Zhong Liao ,  Chih-Hsuan Lu ,  Fang-I Li ,  Wei-Kang Cheng ,  Shyi-Ming Pan

IPC: H01L33/20 ,  H01L33/42 ,  H01L33/38

Abstract: A light-emitting diode (LED) chip including a first semiconductor layer; an active layer disposed on the first semiconductor layer; a second semiconductor layer disposed on said active layer; one or a plurality of indentations, comprising a bottom part extending downward through the second semiconductor layer and the active layer to reach the first semiconductor layer and exposing the first semiconductor layer; a plurality of metal layers, comprising a first metal layer connecting to the first semiconductor layer through the bottom part, and a second metal layer deposited on the first metal layer; and an insulating layer formed between the first and the second metal layers, disposed on the indentation and covering the first metal layer, wherein the second metal layer comprises one or a plurality of recesses at a top surface thereof corresponding to the one or plurality of indentations.

公开(公告)号：US10247395B2

公开(公告)日：2019-04-02

申请号：US15663125

申请日：2017-07-28

Applicant: EPISTAR CORPORATION

Inventor： Chi-Chih Pu ,  Chen-Hong Lee ,  Shih-Yu Yeh ,  Wei-Kang Cheng ,  Shyi-Ming Pan ,  Siang-Fu Hong ,  Chih-Shu Huang ,  Tzu-Hsiang Wang ,  Shih-Chieh Tang ,  Cheng-Kuang Yang

IPC: F21V21/00 ,  H01L33/50 ,  F21K9/232 ,  F21V21/14 ,  H01L33/48 ,  H01L33/62 ,  H01L25/075

Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.

公开(公告)号：US20180130933A1

公开(公告)日：2018-05-10

申请号：US15867218

申请日：2018-01-10

Applicant: EPISTAR CORPORATION

Inventor： Jai-Tai Kuo ,  Min-Hsun Hsieh ,  Lung-Kuan Lai ,  Wei-Kang Cheng ,  Chien-Liang Liu ,  Yih-Hua Renn ,  Shou-Lung Chen ,  Tsun-Kai Ko ,  Chi-Chih Pu

IPC: H01L33/62 ,  H01L33/56 ,  H01L33/50 ,  H01L33/60 ,  H01L33/46

CPC classification number: H01L33/62 ,  H01L33/46 ,  H01L33/486 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/18

Abstract: This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting diode, a pad electrically connected to the active layer, a metal bump formed on the pad, and a reflective insulation layer. The metal bump has a first side surface and a first bottom surface, wherein the first bottom surface comprises a curved boundary, a longer axis, and a shorter axis. The reflective insulation layer is directly contacting the first side surface, and exposing the first bottom surface.