公开(公告)号：US20240313146A1

公开(公告)日：2024-09-19

申请号：US18669153

申请日：2024-05-20

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Jen-Chieh YU ,  Chun-Wei CHEN

IPC: H01L31/147 ,  G09G3/32 ,  H05B45/12

CPC classification number: H01L31/147 ,  G09G3/32 ,  H05B45/12 ,  G09G2320/0626

Abstract: The present disclosure provides a light-emitting module and a display apparatus thereof. The light-emitting module includes a circuit substrate which includes a first surface and a second surface opposite to the first surface. The first surface includes a plurality of conductive channels, and the second surface includes a plurality of conductive pads. A plurality of light-emitting groups is arranged in a matrix on the first surface. Each of the light-emitting groups includes a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip. An electric component is disposed on the first surface and located in the light-emitting groups matrix. A translucent encapsulating component covers the plurality of light-emitting groups and the electric component. The light-emitting groups matrix comprises m columns and n rows.

公开(公告)号：US20170294566A1

公开(公告)日：2017-10-12

申请号：US15482422

申请日：2017-04-07

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Jen-Chieh YU ,  Wei-Fan KE

IPC: H01L33/60 ,  H01L33/62 ,  H01L33/00 ,  H01L23/00 ,  H01L33/50 ,  H01L33/38 ,  H01L33/30

CPC classification number: H01L33/60 ,  H01L24/13 ,  H01L33/0062 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/30 ,  H01L33/38 ,  H01L33/385 ,  H01L33/40 ,  H01L33/46 ,  H01L33/502 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/13111 ,  H01L2224/1312 ,  H01L2924/12041 ,  H01L2933/0016 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: This disclosure discloses a light-emitting device includes a semiconductor stack, an electrode, an electrode post, a reflective insulating layer, an extending electrode, and a supporting structure. The electrode is disposed on a lower surface of the semiconductor stack, and electrically connected to the semiconductor stack. The electrode post is disposed on the electrode. The reflective insulating layer surrounds the electrode post, and has a bottom surface which is coplanar with the electrode post. The extending electrode is disposed on an upper surface of the semiconductor stack. The supporting structure is located on the extending electrode.

公开(公告)号：US20210273138A1

公开(公告)日：2021-09-02

申请号：US17322459

申请日：2021-05-17

Applicant: EPISTAR CORPORATION

Inventor： Chien-Liang LIU ,  Ming-Chi HSU ,  Shih-An LIAO ,  Jen-Chieh YU ,  Min-Hsun HSIEH ,  Jia-Tay KUO ,  Yu-His SUNG ,  Po-Chang CHEN

IPC: H01L33/38 ,  H01L33/10 ,  H01L33/00 ,  H01L33/32 ,  H01L33/46 ,  H01L33/24

Abstract: The present application discloses a light-emitting device comprises a semiconductor light-emitting element, a transparent element covering the semiconductor light-emitting element, an insulating layer which connects to the transparent element, an intermediate layer which connects to the insulating layer; and a conductive adhesive material connecting to the intermediate layer.

公开(公告)号：US20190221728A1

公开(公告)日：2019-07-18

申请号：US16250774

申请日：2019-01-17

Applicant: EPISTAR CORPORATION

Inventor： Jen-Chieh YU ,  Yih-Hua RENN ,  Hsin-Mao LIU ,  Lung-Kuan LAI ,  Ching-Tai CHENG

IPC: H01L33/50 ,  H01L33/58 ,  H01L25/13

CPC classification number: H01L33/507 ,  H01L25/13 ,  H01L33/58

Abstract: An embodiment of present disclosure discloses a light-emitting device which includes a first light-emitting unit, a second light-emitting unit, a first optic structure, a second optic structure, a first light-transmitting structure, a second light-transmitting structure, and a light-blocking structure. The first optic structure covers a top surface and a side surface of the first light-emitting unit, the second optic structure covers a top surface and a side surface of the second light-emitting unit. The first light-transmitting structure covers the first optic structure. The second light-transmitting structure covers the second optic structure. The light-blocking structure surrounds the first light-emitting unit and the second light-emitting unit, and covers the side surfaces of the first optic structure, the second optic structure, the first light-transmitting structure and the second light-transmitting structure.

公开(公告)号：US20160190406A1

公开(公告)日：2016-06-30

申请号：US14757365

申请日：2015-12-22

Applicant: EPISTAR CORPORATION

Inventor： Chien-Liang LIU ,  Ming-Chi HSU ,  Jen-Chieh YU

IPC: H01L33/60 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/505

Abstract: This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting stack with a first (top) surface, a bottom surface and at least one side surface connected to the first surface and the bottom surface, a light-reflective enclosure with a second (top) surface, a contact electrode formed on the bottom surface of the light-emitting layer, and a wavelength converting layer. Moreover, the light-reflective enclosure surrounds the side surface of the light-emitting stack and exposes to the first surface. The wavelength converting layer covers the first surface and the second surface. In addition, the second surface has a plurality of fine concave structures distributed on the second surface.

Abstract translation: 本公开公开了一种发光装置。 发光装置包括具有第一（顶部）表面，底表面和连接到第一表面和底表面的至少一个侧表面的发光叠层，具有第二（顶部）表面的光反射外壳 形成在发光层的底面上的接触电极和波长转换层。 此外，光反射外壳围绕发光叠层的侧表面并暴露于第一表面。 波长转换层覆盖第一表面和第二表面。 此外，第二表面具有分布在第二表面上的多个细凹形结构。

公开(公告)号：US20150129919A1

公开(公告)日：2015-05-14

申请号：US14541680

申请日：2014-11-14

Applicant: EPISTAR CORPORATION

Inventor： Chien-Liang LIU ,  Ming-Chi HSU ,  Shih-An LIAO ,  Jen-Chieh YU ,  Min-Hsun HSIEH ,  Jia-Tay KUO ,  Yu-His SUNG ,  Po-Chang CHEN

IPC: H01L33/48 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L24/19 ,  H01L33/0095 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

Abstract: The present application discloses a light-emitting device comprises a semiconductor light-emitting element, a transparent element covering the semiconductor light-emitting element, an insulating layer which connects to the transparent element, an intermediate layer which connects to the insulating layer; and a conductive adhesive material connecting to the intermediate layer.

Abstract translation: 本申请公开了一种发光装置，包括半导体发光元件，覆盖半导体发光元件的透明元件，连接到透明元件的绝缘层，连接到绝缘层的中间层; 以及连接到中间层的导电粘合剂材料。

公开(公告)号：US20190273193A1

公开(公告)日：2019-09-05

申请号：US16419570

申请日：2019-05-22

Applicant: EPISTAR CORPORATION

Inventor： Chien-Liang LIU ,  Ming-Chi HSU ,  Jen-Chieh YU

IPC: H01L33/60 ,  H01L33/50

Abstract: This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting stack with a first (top) surface, a bottom surface and at least one side surface connected to the first surface and the bottom surface, a light-reflective enclosure with a second (top) surface, a contact electrode formed on the bottom surface of the light-emitting layer, and a wavelength converting layer. Moreover, the light-reflective enclosure surrounds the side surface of the light-emitting stack and exposes to the first surface. The wavelength converting layer covers the first surface and the second surface. In addition, the second surface has a plurality of fine concave structures distributed on the second surface.