METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM

    公开(公告)号:US20200243737A1

    公开(公告)日:2020-07-30

    申请号:US16748860

    申请日:2020-01-22

    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

    METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM

    公开(公告)号:US20200243478A1

    公开(公告)日:2020-07-30

    申请号:US16551764

    申请日:2019-08-27

    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

    Light-Emitting Device with Temperature Compensation
    3.
    发明申请
    Light-Emitting Device with Temperature Compensation 有权
    带温度补偿的发光装置

    公开(公告)号:US20130314001A1

    公开(公告)日:2013-11-28

    申请号:US13957139

    申请日:2013-08-01

    Abstract: The present application provides a light-emitting device comprising a first light-emitting diode group; a second light-emitting diode group electrically connected to the first light-emitting diode group in parallel; and a temperature compensation. element electrically connected to the second light-emitting diode group in series; and a first switch device connected between the second light-emitting diode group and the temperature compensation element.

    Abstract translation: 本发明提供一种包括第一发光二极管组的发光装置; 与第一发光二极管组并联电连接的第二发光二极管组; 和温度补偿。 元件串联电连接到第二发光二极管组; 以及连接在第二发光二极管组和温度补偿元件之间的第一开关装置。

    LIGHT-EMITTING STRUCTURE
    6.
    发明申请

    公开(公告)号:US20210183942A1

    公开(公告)日:2021-06-17

    申请号:US17170407

    申请日:2021-02-08

    Abstract: A light-emitting device, includes a substrate with a top surface; a first light-emitting structure unit and a second light-emitting structure unit separately formed on the top surface and adjacent to each other, and wherein the first light-emitting structure unit includes a first sidewall and a second sidewall; a trench between the first and the second light-emitting structure units; and an electrical connection arranged on the first sidewall and the second light-emitting structure unit, and electrically connecting the first light-emitting structure unit and the second light-emitting structure unit; wherein the first sidewall connects to the top surface; wherein the first sidewall faces the second light-emitting structure units, and the second sidewall is not between the first light-emitting structure unit and the second light-emitting structure unit; and wherein the second sidewall is steeper than the first sidewall.

    LIGHT-EMITTING DEVICE
    7.
    发明申请

    公开(公告)号:US20190051698A1

    公开(公告)日:2019-02-14

    申请号:US16160653

    申请日:2018-10-15

    Abstract: This disclosure discloses a light-emitting display module display. The light-emitting display module comprises: a board; and a plurality of light-emitting diode modules arranged in an array configuration on the board; wherein one of the light-emitting diode modules comprises a plurality of encapsulated light-emitting units spaced apart from each other; and one of the encapsulated light-emitting units comprises a plurality of optoelectronic units, a first supporting, and a fence; and wherein the plurality of optoelectronic units are covered by the first supporting structure, and the fence surrounds the first supporting structure and the plurality of optoelectronic units.

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