公开(公告)号：US20200243737A1

公开(公告)日：2020-07-30

申请号：US16748860

申请日：2020-01-22

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Shih-An LIAO ,  Ying-Yang SU ,  Hsin-Mao LIU ,  Tzu-Hsiang WANG ,  Chi-Chih PU

IPC: H01L33/62 ,  H01L33/60 ,  H01L25/075

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

公开(公告)号：US20200243478A1

公开(公告)日：2020-07-30

申请号：US16551764

申请日：2019-08-27

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Shih-An LIAO ,  Ying-Yang SU ,  Hsin-Mao LIU ,  Tzu-Hsiang WANG ,  Chi-Chih PU

IPC: H01L23/00 ,  H01L25/16 ,  H01L25/075 ,  H01L23/498 ,  B23K26/22

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

公开(公告)号：US20130314001A1

公开(公告)日：2013-11-28

申请号：US13957139

申请日：2013-08-01

Applicant: EPISTAR CORPORATION

Inventor： Hsin-Mao LIU ,  Zong-Xi CHEN ,  Min-Hsun HSIEH ,  Chien-Yan WANG

IPC: H05B33/08

CPC classification number: H05B33/0854 ,  H01L25/167 ,  H01L27/153 ,  H01L2924/0002 ,  H05B33/0872 ,  H01L2924/00

Abstract: The present application provides a light-emitting device comprising a first light-emitting diode group; a second light-emitting diode group electrically connected to the first light-emitting diode group in parallel; and a temperature compensation. element electrically connected to the second light-emitting diode group in series; and a first switch device connected between the second light-emitting diode group and the temperature compensation element.

Abstract translation: 本发明提供一种包括第一发光二极管组的发光装置; 与第一发光二极管组并联电连接的第二发光二极管组; 和温度补偿。 元件串联电连接到第二发光二极管组; 以及连接在第二发光二极管组和温度补偿元件之间的第一开关装置。

公开(公告)号：US20230420484A1

公开(公告)日：2023-12-28

申请号：US18465733

申请日：2023-09-12

Applicant: EPISTAR CORPORATION

Inventor： Min Hsun HSIEH ,  Hsin-Mao LIU

IPC: H01L27/15 ,  G09G3/32 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L27/156 ,  H01L27/15 ,  G09G3/32 ,  H01L33/486 ,  H01L33/507 ,  H01L33/56 ,  H01L33/62 ,  H01L33/385

Abstract: A light-emitting module including a first optoelectronic unit having a first electrode pad and a second electrode pad, a second optoelectronic unit having a third electrode pad and a fourth electrode pad, a first supporting structure enclosing the first optoelectronic unit and the second optoelectronic unit, a first pin overlapping and confronted with both of the first electrode pad and the third electrode pad, a second pin overlapping the second electrode pad and the first supporting structure, and a third pin overlapping the fourth electrode pad and physically separated from the second pin.

公开(公告)号：US20230187473A1

公开(公告)日：2023-06-15

申请号：US18105045

申请日：2023-02-02

Applicant: Epistar Corporation

Inventor： Chien-Fu SHEN ,  Chao-Hsing CHEN ,  Tsun-Kai KO ,  Schang-Jing HON ,  Sheng-Jie HSU ,  De-Shan KUO ,  Hsin-Ying WANG ,  Chiu-Lin YAO ,  Chien-Fu HUANG ,  Hsin-Mao LIU ,  Chien-Kai CHUNG

IPC: H01L27/15 ,  H01L25/075 ,  H01L33/20 ,  H01L33/62 ,  H01L33/38 ,  H01L33/44

CPC classification number: H01L27/156 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/20 ,  H01L33/44 ,  H01L33/62 ,  H01L33/382 ,  H01L33/385 ,  H01L2924/0002

Abstract: A light-emitting device includes a substrate with a top surface; a first light-emitting structure unit and a second light-emitting structure unit separately formed on the top surface and adjacent to each other, and wherein the first light-emitting structure unit includes a first sidewall and the second light-emitting structure unit includes a second sidewall; an isolation layer formed on the first sidewall and the second sidewall, including a first edge on the first light-emitting structure unit and wherein the first edge has an acute angle in a cross-sectional view; and an electrical connection formed on the isolation layer, the first light-emitting structure unit and the second light-emitting structure unit, and electrically connecting the first light-emitting structure unit and the second light-emitting structure unit; wherein the first sidewall and the second sidewall are inclined; and wherein the electrical connection includes a first part on the first light-emitting structure unit, and the first part does not overlap the first edge of the isolation layer.

公开(公告)号：US20210183942A1

公开(公告)日：2021-06-17

申请号：US17170407

申请日：2021-02-08

Applicant: EPISTAR CORPORATION

Inventor： Chien-Fu SHEN ,  Chao-Hsing CHEN ,  Tsun-Kai KO ,  Schang-Jing HON ,  Sheng-Jie HSU ,  De-Shan KUO ,  Hsin-Ying WANG ,  Chiu-Lin YAO ,  Chien-Fu HUANG ,  Hsin-Mao LIU ,  Chien-Kai CHUNG

IPC: H01L27/15 ,  H01L25/075 ,  H01L33/20 ,  H01L33/62 ,  H01L33/38 ,  H01L33/44

Abstract: A light-emitting device, includes a substrate with a top surface; a first light-emitting structure unit and a second light-emitting structure unit separately formed on the top surface and adjacent to each other, and wherein the first light-emitting structure unit includes a first sidewall and a second sidewall; a trench between the first and the second light-emitting structure units; and an electrical connection arranged on the first sidewall and the second light-emitting structure unit, and electrically connecting the first light-emitting structure unit and the second light-emitting structure unit; wherein the first sidewall connects to the top surface; wherein the first sidewall faces the second light-emitting structure units, and the second sidewall is not between the first light-emitting structure unit and the second light-emitting structure unit; and wherein the second sidewall is steeper than the first sidewall.

公开(公告)号：US20190051698A1

公开(公告)日：2019-02-14

申请号：US16160653

申请日：2018-10-15

Applicant: EPISTAR CORPORATION

Inventor： Min Hsun HSIEH ,  Hsin-Mao LIU

IPC: H01L27/15 ,  H01L33/56 ,  H01L33/48 ,  H01L33/50 ,  G09G3/32 ,  H01L33/62 ,  H01L33/38 ,  H01L33/44

Abstract: This disclosure discloses a light-emitting display module display. The light-emitting display module comprises: a board; and a plurality of light-emitting diode modules arranged in an array configuration on the board; wherein one of the light-emitting diode modules comprises a plurality of encapsulated light-emitting units spaced apart from each other; and one of the encapsulated light-emitting units comprises a plurality of optoelectronic units, a first supporting, and a fence; and wherein the plurality of optoelectronic units are covered by the first supporting structure, and the fence surrounds the first supporting structure and the plurality of optoelectronic units.

公开(公告)号：US20180287031A1

公开(公告)日：2018-10-04

申请号：US16001676

申请日：2018-06-06

Applicant: EPISTAR CORPORATION

Inventor： Shih-I CHEN ,  Chia-Liang HSU ,  Tzu-Chieh HSU ,  Han-Min WU ,  Ye-Ming HSU ,  Chien-Fu HUANG ,  Chao-Hsing CHEN ,  Chiu-Lin YAO ,  Hsin-Mao LIU ,  Chien-Kai CHUNG

IPC: H01L33/62 ,  H01L33/60 ,  H01L27/15 ,  H01L33/08 ,  H01L33/10 ,  H01L25/075 ,  H01L33/48 ,  H01L33/46 ,  H01L33/44 ,  H01L33/42 ,  H01L33/38 ,  H01L33/14 ,  H01L33/40 ,  H01L33/32

Abstract: A light-emitting device includes a supportive substrate and a first light-emitting element on the supportive substrate. The first light-emitting element includes a first light-emitting stacked layer having a first surface and a second surface opposite to the first surface, and a first transparent layer on the first surface and electrically connected to the first light-emitting stacked layer. A second light-emitting element locates on the supportive substrate and a metal layer electrically connects to the first light-emitting element and the second light-emitting element and physically connects to the first transparent layer. The first light-emitting stacked layer includes a first width and the first transparent layer includes a second width different from the first width from a cross section view of the light-emitting device.

公开(公告)号：US20160049442A1

公开(公告)日：2016-02-18

申请号：US14924264

申请日：2015-10-27

Applicant: EPISTAR CORPORATION

Inventor： Chien-Fu SHEN ,  Chao-Hsing CHEN ,  Tsun-Kai KO ,  Schang-Jing HON ,  Sheng-Jie HSU ,  De-Shan KUO ,  Hsin-Ying WANG ,  Chiu-Lin YAO ,  Chien-Fu HUANG ,  Hsin-Mao LIU ,  Chien-Kai CHUN

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/20

CPC classification number: H01L27/156 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/20 ,  H01L33/382 ,  H01L33/385 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light-emitting structure, comprising a substrate; a first unit and a second unit, separately formed on the substrate; a trench between the first unit and the second unit; and an electrical connection, electrically connecting the first unit and the second unit and comprising a bridging portion and a joining portion extending from the bridging portion, wherein the bridging portion is wider than the joining portion and the bridging portion is configured to cover the trench, and the joining portion is configured to cover first unit and the second unit.

Abstract translation: 1.一种发光结构，包括基板; 分别形成在所述基板上的第一单元和第二单元; 第一单元和第二单元之间的沟槽; 以及电连接，电连接所述第一单元和所述第二单元，并且包括桥接部分和从所述桥接部分延伸的接合部分，其中所述桥接部分比所述接合部分宽，并且所述桥接部分构造成覆盖所述沟槽， 并且所述接合部被构造成覆盖所述第一单元和所述第二单元。

公开(公告)号：US20150194586A1

公开(公告)日：2015-07-09

申请号：US14663544

申请日：2015-03-20

Applicant: Epistar Corporation

Inventor： Shih-I CHEN ,  Chia-Liang HSU ,  Tzu-Chieh HSU ,  Han-Min WU ,  Ye-Ming HSU ,  Chien-Fu HUANG ,  Chao-Hsing CHEN ,  Chiu-Lin YAO ,  Hsin-Mao LIU ,  Chien-Kai CHUNG

IPC: H01L33/62 ,  H01L33/14 ,  H01L33/10 ,  H01L33/08 ,  H01L33/48 ,  H01L33/44

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/08 ,  H01L33/10 ,  H01L33/145 ,  H01L33/32 ,  H01L33/382 ,  H01L33/385 ,  H01L33/40 ,  H01L33/42 ,  H01L33/44 ,  H01L33/46 ,  H01L33/483 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light-emitting device is disclosed. The light-emitting device comprises a supportive substrate; a first light-emitting element and a second light-emitting element on the supportive substrate, wherein the first light-emitting element comprises a transparent layer on the supportive substrate, a first light-emitting stacked layer on the transparent layer, and a plurality of contact parts between the transparent layer and the first light-emitting stacked layer; and the second light-emitting element comprises an electrode and a second light-emitting stacked layer between the electrode and the supportive substrate; and a metal line on the supportive substrate and electrically connecting the electrode and one of the contact parts.

Abstract translation: 公开了一种发光器件。 发光装置包括支撑基板; 第一发光元件和第二发光元件，其中所述第一发光元件包括在所述支撑基板上的透明层，所述透明层上的第一发光层叠层，以及多个 透明层与第一发光层叠层之间的接触部分; 并且所述第二发光元件包括在所述电极和所述支撑衬底之间的电极和第二发光层叠层; 以及在所述支撑基板上的金属线，并且电连接所述电极和所述接触部分之一。