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    MICROSTRIP ARRANGEMENT
    1.
    发明申请
    MICROSTRIP ARRANGEMENT 审中-公开
    微带安排

    公开(公告)号：WO9927606A3

    公开(公告)日：1999-08-19

    申请号：PCT/SE9802092

    申请日：1998-11-19

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  GEORGIAN SPARTAK

    IPC: H01P3/08 ,  H01Q9/04 ,  H01Q13/20 ,  H01Q21/00 ,  H05K1/02

    CPC classification number: H01P3/084 ,  H01Q9/0407 ,  H01Q9/045 ,  H01Q13/206 ,  H01Q21/0081 ,  H05K1/024 ,  H05K1/0245 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/098 ,  H05K2201/09972

    Abstract: The invention relates to a microstrip arrangement comprising a first and a second microstrip conductor. The two microstrip conductors have essentially the same dimensions in their longitudinal direction and transverse direction, and are galvanically interconnected by means of at least one connection. The two microstrip conductors also extend essentially parallel to one another on either side of a dielectric material. As a result of this design of the microstrip arrangement, the field losses and also other influences caused by the dielectric material will be very considerably reduced, and in practice a resultant microstrip arrangement is obtained, which, with regard to its electrical performance, appears to be suspended in the air. Preferred embodiments comprise a microstrip antenna, a circuit board and a conductor application.

    Abstract translation: 本发明涉及包括第一和第二微带导体的微带装置。 两个微带导体在其纵向方向和横向方向上具有基本相同的尺寸，并且通过至少一个连接电流互连。 两个微带导体也在电介质材料的任一侧基本上彼此平行地延伸。 由于微带装置的这种设计，由介电材料引起的场损耗和其它影响将非常显着地降低，并且实际上获得了所得到的微带结构，就其电性能而言，似乎 悬浮在空中。 优选实施例包括微带天线，电路板和导体应用。

    5.
    发明专利
    未知

    公开(公告)号：SE9802859L

    公开(公告)日：2000-02-27

    申请号：SE9802859

    申请日：1998-08-26

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  GEORGIAN SPARTAK

    IPC: H01P3/08

    Abstract: More even current distribution in a transmission line is provided by an arrangement including a first conductive layer, a dielectric layer and a ground plane. The first conductive layer, the dielectric layer and the ground plane extend mainly in substantially the same direction, with the dielectric layer arranged between the first conductive layer and the ground plane. The arrangement includes an object located between the dielectric layer and the ground plane. The object can be electrically conductive or made of a dielectric material.

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