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    Tubular capacitor
    3.
    发明授权
    Tubular capacitor 失效
    管状电容器

    公开(公告)号：US3564359A

    公开(公告)日：1971-02-16

    申请号：US3564359D

    申请日：1967-08-10

    Applicant: ERIE TECHNOLOGICAL PROD INC

    Inventor： CODA NELLO ,  RUFFNER LAWRENCE J

    IPC: H01G4/35 ,  H01G4/38 ,  H01G4/40 ,  H01G1/06

    CPC classification number: H01G4/35 ,  H01G4/385 ,  H01G4/40

    Abstract: A TUBULAR CAPACITOR WITH A GROUND ELECTRODE SPACED INWARD FROM THE ENDS OF THE TUBE AND WITH TWO OTHER ELECTRODES SPACED FROM EACH OTHER AT THE CENTER OF THE TUBE AND EXTENDING RESPECTIVELY TOWARD OPPOSITE ENDS OF THE TUBE. THE GROUND ELECTRODE IS APPLIED TO A LAYER OF GREEN CERAMIC AND THE OTHER TWO ELECTRODES ARE APPLIED TO ANOTHER LAYER OF GREEN CERAMIC AND THE LAYERS OF CERAMIC ARE ARRANGED ONE ON TOP OF THE OTHER AND SPIRALLY WRAPPED A PLURALITY OF TURNS ABOUT THE AXIS OF THE TUBE. THE SPIRALLED TURNS OF THE GROUND ELECTRODE ARE SHORTED BY CONDUCTIVE MATERIAL IN ONE OR MORE HOLES THROUGH THE CERAMIC BETWEEN THE TWO OTHER ELECTRODES.

    5.
    发明专利
    未知

    公开(公告)号：DE1766870A1

    公开(公告)日：1972-02-24

    申请号：DE1766870

    申请日：1968-08-01

    Applicant: ERIE TECHNOLOGICAL PROD INC

    Inventor： CODA NELLO ,  RUFFNER LAWRENCE

    IPC: H01G4/35 ,  H01G4/38 ,  H01G4/40 ,  H04B15/04

    Abstract: 1,164,405. Filters. ERIE TECHNOLOGICAL PRODUCTS Inc. 5 June, 1968 [10 Aug., 1967], No. 26781/68. Heading H3U. [Also in Division H1] A filter having as shown a dual capacitor unit comprises ceramic layers 18, with metallizing 20, 21 inwardly from each edge, and 19, with a central metallized strip 23 partially overlapping both strips 20 and 21, the two ceramic layers being wound in the green state and fired to form the assembly shown in Fig. 2 wherein electrodes 6a and 8 are constituted by layers 20, 21 and the turns of which are short-circuited by metallizing 9, 13 and electrode 7 is constituted by layer 23 whose turns are shorted by metal-filled holes through the ceramic layers, and are earthed via metal coating 16, a non-capacitive impedance being produced by ferrite beads 17 around wire 12 running through the bore of the wound tube. As shown in Fig. 3 the two ceramic layers are pre-formed with holes 24, 25 which are filled with metal, an intermediate metallized strip 22 aiding the short-circuiting of the spiral turns since the holes will be staggered and also reducing the capacitive coupling between 20 and 21, i.e. electrodes 6a and 8. Alternatively (Fig. 9, not shown) holes may be drilled through the turns of electrode 7 and filled with metal. One of the electrodes 6 or 8 may be omitted to form a single capacitor.

    6.
    发明专利
    未知

    公开(公告)号：DE2039388A1

    公开(公告)日：1971-02-18

    申请号：DE2039388

    申请日：1970-08-07

    Applicant: ERIE TECHNOLOGICAL PROD INC

    Inventor： E DIETEMANN FRANCIS ,  CODA NELLO

    IPC: B23K3/06 ,  B23K20/233 ,  H01G13/00

    Abstract: 1295707 Welding by pressure; soldering; shearing ERIE TECHNOLOGICAL PRODUCTS Inc 7 Aug 1970 [8 Aug 1969] 38241/70 Headings B3A B3R and B3W In a method of securing a solder preform to an electrical lead a portion of solder is impacted against the lead to shape the solder and simultaneously cold weld it to the lead. A wire 5 which may have a head 4 is supported between jaws 6, 7 in alignment with a punch having two relatively slidable parts 10, 11 the outer part 10 having an opening through which solder wire 17 may be fed. Movement of the punch in the direction 15 causes the part 10 to abut the jaws 6, 7 the part 11 continuing its movement to sever a portion of solder and then to impact the severed portion agaisnt the head 4. Part of the solder may be extruded around the head 4. In an alternative arrangement the head is formed on the wire by a first stroke of the punch and the solder formed and attached in a second stroke. Solder may be fed in preformed elements to the punch rather than in wire form. Reference is made to securing solder to wires of copper, nickel, copper-coated steel, Invar (Registered Trade Mark) or Kovar (Registered Trade Mark). The subsequent soldering of the lead to an electrical component may be effected by heating in a reducing atmosphere, or with flux.

    8.
    发明专利
    未知

    公开(公告)号：DE1764214B1

    公开(公告)日：1972-07-27

    申请号：DE1764214

    申请日：1968-04-25

    Applicant: ERIE TECHNOLOGICAL PROD INC

    Inventor： CODA NELLO

    IPC: H01G2/04 ,  H01G2/06 ,  H05K3/34 ,  H01G1/14 ,  H01G3/09

    Abstract: 1,149,838. Capacitors. EIRIE TECHNOLOGICAL PRODUCTS Inc. 27 March, 1968 [26 April, 1967], No. 14691/68. Heading H1M. A capacitor comprises a body of dielectric material having laterally spaced feet 4, 5 supporting it on, e.g. a printed circuit board 14, the capacitor electrodes having terminals extending to the support surfaces, and the latter having means such as a metallized layer for making soldered connections 10, 11 to, e.g. printed wiring 12, 13. The capacitor may be formed from layers of green ceramic, e.g. a titanate shaped to the cross-section of the capacitor body and bearing painted, e.g. platinum or palladium electrodes 6, (8), (Fig. 4, not shown) with extensions 7, 9 to one or other of the feet portions 4, 5. Layers are stacked with corresponding metallized areas face to face and with unmetallized layers at each end and the assembly fired. The bottoms of the feet may be abraded prior to silvering. In an alternative construction (Figs. 6, 7, not shown) a capacitor comprising electrodes parallel to the support surfaces is formed by stacking metallized ceramic layers so that alternate electrodes extend to each end, and a portion of a bottom unmetallized layer is removed to form the feet, or the feet may be formed by pressing the green ceramic. After firing, and abrading the end surfaces these are dipped in metal paint to connect sets of electrodes in parallel and provide a metal coating on the support surface for making the soldered connection.

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