公开(公告)号：JP2003232809A

公开(公告)日：2003-08-22

申请号：JP2002367883

申请日：2002-12-19

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  ELDRIDGE BENJAMIN N ,  MATHIEU GAETAN L ,  GARY W GRUBE

IPC: G01R1/073 ,  G01R1/067 ,  G01R3/00 ,  G01R31/28 ,  G01R31/316 ,  H01H1/00 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H01R13/24 ,  H05K3/20 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a microminiature spring contact suitable for probing of an active semiconductor device, and its manufacturing method. SOLUTION: A cantilever-shaped contact element 100 is long and narrow and has two ends 102, 104 and a center part 106 between the ends. The end 102 is a base part, and the contact element 100 is fitted with an electronic part (unillustrated) on the end 102. A coupling fixture 110 is provided on the base part 102. The coupling fixture 110 can be formed as a tab or a stud to facilitate brazing on a substrate at the assembly time. The end 104 is a free end, and a device to be tested is brought into contact with the end 104. An integrated projecting fixture 108, for example, in a pyramidal geometric shape, is provided on the tip 104 to assist connection by pressure to the terminal of the device to be tested. The contact element 100 has a step-shaped structure. The contact element can be easily manufactured by using a known lithography technology. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2008275646A

公开(公告)日：2008-11-13

申请号：JP2008204891

申请日：2008-08-07

Applicant: Formfactor Inc ,  フォームファクター, インコーポレイテッド

Inventor： KHANDROS IGOR Y ,  ELDRIDGE BENJAMIN N ,  MATHIEU GAETAN L ,  GARY W GRUBE

IPC: G01R1/073 ,  G01R1/067 ,  G01R3/00 ,  G01R31/28 ,  G01R31/316 ,  H01H1/00 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H01R13/24 ,  H05K3/20 ,  H05K3/34

CPC classification number: G01R1/07342 ,  G01R1/06727 ,  G01R1/06744 ,  G01R3/00 ,  H01H1/0036 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/10 ,  H01L24/45 ,  H01L24/72 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05657 ,  H01L2224/0566 ,  H01L2224/06136 ,  H01L2224/45144 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/20 ,  H05K3/3421 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48657 ,  H01L2224/4866 ,  H01L2224/85399

Abstract: PROBLEM TO BE SOLVED: To provide a microelectronic contact structure and its manufacturing method. SOLUTION: The method for mounting two or more spring contact elements to the terminals of an electronic component includes fabricating the two or more spring contact elements on a sacrificial substrate, then mounting the parts of the spring contact elements to the terminals of the electronic component while the spring contact elements are on the sacrificial substrate, and removing the sacrificial substrate after the parts of the spring contact elements are mounted to the terminals of the electronic component. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供微电子接触结构及其制造方法。 解决方案：将两个或更多个弹簧接触元件安装到电子部件的端子的方法包括在牺牲基板上制造两个或更多个弹簧接触元件，然后将弹簧接触元件的部件安装到 电子部件，同时弹簧接触元件在牺牲基板上，并且在部分弹簧接触元件安装到电子部件的端子之后移除牺牲基板。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008046139A

公开(公告)日：2008-02-28

申请号：JP2007244529

申请日：2007-09-20

Applicant: Formfactor Inc ,  フォームファクター, インコーポレイテッド

Inventor： KHANDROS IGOR Y ,  ELDRIDGE BENJAMIN N ,  MATHIEU GAETAN L ,  GARY W GRUBE

IPC: G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  G01R31/316 ,  H01H1/00 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H01R13/24 ,  H05K3/20 ,  H05K3/34

CPC classification number: G01R1/07342 ,  G01R1/06727 ,  G01R1/06744 ,  G01R3/00 ,  H01H1/0036 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/10 ,  H01L24/45 ,  H01L24/72 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05657 ,  H01L2224/0566 ,  H01L2224/06136 ,  H01L2224/45144 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/20 ,  H05K3/3421 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48657 ,  H01L2224/4866 ,  H01L2224/85399

Abstract: PROBLEM TO BE SOLVED: To provide a microelectronic contact structure and a manufacturing method for manufacturing the microelectronic contact structure. SOLUTION: The method for mounting a plurality of spring contact elements to the terminal of an electronic component includes the manufacture of a plurality of spring contact elements on a sacrifice substrate, mounting one portion of the spring contact elements to the terminal of electronic components while the spring contact element is on the sacrifice substrate, and the removal of the sacrifice substrate after one portion of the spring contact element is mounted to the terminal of the electronic components. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供微电子接触结构和用于制造微电子接触结构的制造方法。 解决方案：用于将多个弹簧接触元件安装到电子部件的端子的方法包括在牺牲基板上制造多个弹簧接触元件，将一部分弹簧接触元件安装到电子端子 部件，而弹簧接触元件在牺牲基板上，并且在一部分弹簧接触元件安装到电子部件的端子之后，牺牲基板的移除。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2008014957A

公开(公告)日：2008-01-24

申请号：JP2007244528

申请日：2007-09-20

Applicant: Formfactor Inc ,  フォームファクター, インコーポレイテッド

Inventor： KHANDROS IGOR Y ,  ELDRIDGE BENJAMIN N ,  MATHIEU GAETAN L ,  GARY W GRUBE

IPC: G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  G01R31/316 ,  H01H1/00 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H01R13/24 ,  H05K3/20 ,  H05K3/34

CPC classification number: G01R1/07342 ,  G01R1/06727 ,  G01R1/06744 ,  G01R3/00 ,  H01H1/0036 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/10 ,  H01L24/45 ,  H01L24/72 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05657 ,  H01L2224/0566 ,  H01L2224/06136 ,  H01L2224/45144 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/20 ,  H05K3/3421 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48657 ,  H01L2224/4866 ,  H01L2224/85399

Abstract: PROBLEM TO BE SOLVED: To provide a microelectronic contact structure and a method of making the same. SOLUTION: A device includes an electronic component including a trench in a surface, a terminal disposed on the surface of the electronic component and spaced from the trench, and an elongate spring contact element. The elongate spring contact element has a base portion affixed to the terminal, a body portion spaced above the surface of the electronic component and extended across the trench, and a contact portion spaced above the trench. The contact portion is movable toward the trench, and the spring contact element has a first spring constant. When the contact portion is moved enough toward the trench, the body portion contacts the end located between the surface and the trench, and when the contact portion is moved further toward the trench, the spring contact element exhibits a second spring constant different from the first spring constant. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供微电子接触结构及其制造方法。 解决方案：一种设备包括电子部件，其包括表面中的沟槽，设置在电子部件的表面上并与沟槽间隔开的端子和细长的弹簧接触元件。 细长弹簧接触元件具有固定到端子的基部，在电子部件的表面上间隔开并延伸穿过沟槽的主体部分以及在沟槽上方间隔开的接触部分。 接触部分可以朝向沟槽移动，并且弹簧接触元件具有第一弹簧常数。 当接触部分足够地朝向沟槽移动时，主体部分接触位于表面和沟槽之间的端部，并且当接触部分进一步向沟槽移动时，弹簧接触元件呈现与第一 弹簧常数。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：AU3127797A

公开(公告)日：1997-12-09

申请号：AU3127797

申请日：1997-05-15

Applicant: FORMFACTOR INC

Inventor： IGOR Y KHANDROS ,  BENJAMIN N ELDRIDGE ,  GAETAN L MATHIEU ,  GARY W GRUBE

IPC: G01R1/073 ,  G01R1/067 ,  G01R3/00 ,  G01R31/28 ,  G01R31/316 ,  H01H1/00 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H01R13/24 ,  H05K3/20 ,  H05K3/34

Abstract: The contact provides a micro-miniature spring contact for mounting active semiconductor devices. The structure comprises a resilient spring contact (100) with one end (102) being a base end which is mounted to an electronic component. The other end (104) is a "free end" tip which provides a pressure connection to another electronic component. The structure is steeped with the base end at one height and with the free end at second height. There is a central portion (106) between the two end portions and which is at a third height. Thus there are two steps in the structure which performs as a cantilever beam.

公开(公告)号：AU5964096A

公开(公告)日：1996-12-11

申请号：AU5964096

申请日：1996-05-28

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  DOZIER THOMAS H ,  ELDRIDGE BENJAMIN N ,  GARY W GRUBE ,  GAETAN L MATHIEU

IPC: H01L23/32 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/40

Abstract: Interconnection elements (550) for electronic components (556), exhibiting desirable mechanical characteristics (such as resiliency), for making pressure contact(s) are formed by shaping a ribbon-like core element (552) of a soft material (such as gold or soft copper) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (558) such as nickel and it alloys, to impart a desired spring (resilient) characteristic to the resulting composite interconnection element (550). A final overcoat of a material (220) having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element (200). The resulting interconnection elements (500, 550) may be mounted to a variety of electronic components.

公开(公告)号：EP0828582A4

公开(公告)日：1999-02-03

申请号：EP96916923

申请日：1996-05-28

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  DOZIER THOMAS H ,  ELDRIDGE BENJAMIN N ,  GARY W GRUBE ,  GAETAN L MATHIEU

IPC: H01L23/32 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K3/4015 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/06711 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/73203 ,  H01L2224/78302 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H01L2924/00

Abstract: Interconnection elements (550) for electronic components (556), exhibiting desirable mechanical characteristics (such as resiliency), for making pressure contact(s) are formed by shaping a ribbon-like core element (552) of a soft material (such as gold or soft copper) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (558) such as nickel and it alloys, to impart a desired spring (resilient) characteristic to the resulting composite interconnection element (550). A final overcoat of a material (220) having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element (200). The resulting interconnection elements (500, 550) may be mounted to a variety of electronic components.