公开(公告)号：DE102008004410A1

公开(公告)日：2008-07-31

申请号：DE102008004410

申请日：2008-01-14

Applicant: GEN ELECTRIC

Inventor： DE ROOIJ MICHAEL ANDREW ,  BURDICK WILLIAM EDWARD ,  ROSE JAMES WILSON

IPC: H01F27/28 ,  H01F5/00 ,  H05B6/36

Abstract: A spirally-wound inductor having a tapered conductor. The height of the conductor increases from a smaller height near the center of the inductor to a greater height at the outer edge of the inductor. A spherically-shaped inductor and methods for manufacturing the spherically-shaped inductor. The spherically-shaped inductor has a series of coils that increase in diameter from each end toward the middle.

公开(公告)号：DE10256979A1

公开(公告)日：2003-07-24

申请号：DE10256979

申请日：2002-12-05

Applicant: GEN ELECTRIC

Inventor： BAUMGARTNER CHARLES EDWARD ,  FOBARE DAVID FRANCIS ,  DEJULE MICHAEL CLEMENT ,  WEI CHING-YEU ,  HENNESSY WILLIAM ANDREW ,  WOJNAROWSKI ROBERT JOHN ,  ARDEBILI HALEH ,  BURDICK WILLIAM EDWARD

IPC: G01T1/20 ,  G01T1/161 ,  G01T1/202 ,  G01T1/24 ,  G01T1/29 ,  H01L27/14 ,  H01L31/0216 ,  H01L31/09 ,  H04N5/32

Abstract: The present invention provides an X-ray detector assembly and a fabrication method, where the X-ray detector assembly comprises a scintillator material disposed on a detector matrix array disposed on a detector substrate; an encapsulating coating disposed on the scintillator material; a moisture resistant cover disposed over the detector substrate and the encapsulating coating, and an adhesive material disposed between the detector substrate and the moisture resistant cover so as to form a moisture vapor barrier. The adhesive material is disposed so that it is not in contact with the encapsulating coating. The fabrication method of the X-ray detector assembly includes the steps of disposing the encapsulating coating on the scintillator material and a portion of the detector substrate and removing the encapsulating coating from the portion of the detector substrate.

公开(公告)号：CA2551729A1

公开(公告)日：2007-01-15

申请号：CA2551729

申请日：2006-07-06

Applicant: GEN ELECTRIC

Inventor： SHORT JONATHAN DAVID ,  BURDICK WILLIAM EDWARD ,  ROSE JAMES WILSON ,  SHERMAN DONNA MARIE ,  SANDVIK PETER MICAH ,  BROWN DALE MARIUS ,  RAO NARESH KESAVAN

IPC: H01L25/16 ,  H01L31/0203 ,  H01L31/048

Abstract: One photodetection system includes a wide bandgap photodetector array (10) which is physically and electrically integrated on a flexible interconnect layer (18) including electrical connections (20), which is packaged in a manner for being electrically integrated with processing electronics (14) such that the packaging and the processing electronics are configured for obtaining and processing signals detected by the photodetector array, or which includes both the flexible interconnect layer and processing electronics packaging features.

公开(公告)号：DE102005030080A1

公开(公告)日：2006-01-12

申请号：DE102005030080

申请日：2005-06-27

Applicant: GEN ELECTRIC

Inventor： BURDICK WILLIAM EDWARD ,  ROSE JAMES WILSON ,  RUMSEY MICHAEL ANTHONY

IPC: H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/538 ,  H01L25/04 ,  H01L25/10 ,  H01R12/00 ,  H05K1/11 ,  H05K1/18