ULTRASOUND TRANSDUCER ARRAY OF ELECTRO-ACOUSTIC MODULES
    1.
    发明申请
    ULTRASOUND TRANSDUCER ARRAY OF ELECTRO-ACOUSTIC MODULES 审中-公开
    超声波传感器阵列的电声模块

    公开(公告)号:WO2015041780A3

    公开(公告)日:2015-07-23

    申请号:PCT/US2014051465

    申请日:2014-08-18

    Applicant: GEN ELECTRIC

    CPC classification number: A61B8/4494 A61B8/4411 A61B8/4455 B06B1/0622

    Abstract: An ultrasound transducer array for an ultrasound probe is presented. The ultrasound transducer array includes a support structure. Further, the ultrasound transducer array includes a plurality of electro-acoustic modules coupled to the support structure, wherein each of the plurality of electro-acoustic modules comprises at least one matrix acoustic array and an interconnect element, wherein each of the plurality of electro-acoustic modules is interchangeable on the support structure so as to adapt to one or more shapes of the ultrasound probe, and wherein each of the plurality of electro-acoustic modules operates in a manner substantially identical to each other of the plurality of electro-acoustic modules.

    Abstract translation: 提出了一种用于超声探头的超声波换能器阵列。 超声换能器阵列包括支撑结构。 此外,超声换能器阵列包括耦合到支撑结构的多个电声模块,其中多个电声模块中的每一个包括至少一个矩阵声阵列和互连元件,其中, 声学模块在支撑结构上是可互换的,以便适应于一个或多个形状的超声波探头,并且其中多个电声模块中的每一个以多个电声模块中的彼此基本相同的方式操作 。

    ULTRASOUND ACOUSTIC ASSEMBLIES AND METHODS OF MANUFACTURE
    2.
    发明申请
    ULTRASOUND ACOUSTIC ASSEMBLIES AND METHODS OF MANUFACTURE 审中-公开
    超声波组件及其制造方法

    公开(公告)号:WO2013148515A3

    公开(公告)日:2013-12-27

    申请号:PCT/US2013033527

    申请日:2013-03-22

    Applicant: GEN ELECTRIC

    Abstract: An ultrasound acoustic assembly (100) includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer (42) assembled with at least one acoustic impedance dematching layer (41) and with a support layer (2). The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die (32). Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.

    Abstract translation: 超声波声学组件(100)包括多个超声波阵列,每个阵列包括声堆叠,声堆叠包括与至少一个声阻抗分配层(41)和支撑层(2)组装的压电层(42)。 声学堆叠限定了多个切割切口和多个声学元件,使得切割切口形成在相邻的声学元件之间。 切割切口延伸穿过压电层并通过声阻抗分层,但仅部分延伸穿过支撑层。 超声波声学组件还包括许多专用集成电路(ASIC)管芯(32)。 每个超声波阵列耦合到相应的ASIC管芯,以形成相应的声电传感器模块。 还提供了制造方法。

    PDA JOINT INCLUDING FLEXIBLE JOINT PART

    公开(公告)号:JP2001281291A

    公开(公告)日:2001-10-10

    申请号:JP2000360410

    申请日:2000-11-28

    Applicant: GEN ELECTRIC

    Abstract: PROBLEM TO BE SOLVED: To provide a PDS joint including a flexible joint part. SOLUTION: A partial discharge analysis(PDA) joint device includes a shell (22), a potting material (26) which hermetically capsules at least two capacitors (28, 30), and a conductive flexible joint part (50) which connects the capacitors (28, 30). The joint part (50) may be only a hose clamp or spring (70) which electrically connects the capacitors (28, 30) and expands while the potting material (26) thermally expands.

    TRANSDUCTEUR ULTRASONORE AVEC CAPTEURS SUPPLEMENTAIRES

    公开(公告)号:FR2872583A1

    公开(公告)日:2006-01-06

    申请号:FR0506413

    申请日:2005-06-23

    Applicant: GEN ELECTRIC

    Abstract: La présente technique propose la fabrication et/ou l'utilisation d'une sonde ultrasonore configurée pour acquérir des données non d'imagerie en plus de données d'imagerie. En particulier, la sonde ultrasonore comprend un transducteur ultrasonore micro-usiné (48) formé sur la surface d'un substrat (44) en utilisant des techniques de microsystèmes électromécaniques ou d'autres techniques associées à la fabrication des composants à semiconducteur. Des capteurs non d'imagerie (46) sont formés sur le substrat, soit sur la surface soit à l'intérieur, ou sur un substrat proche du substrat sur lequel est formé le transducteur. Les capteurs non d'imagerie peuvent être utilisés pour acquérir des données non d'imagerie conjointement avec l'acquisition de données d'imagerie par le transducteur.

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