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1.
公开(公告)号:WO2015041780A3
公开(公告)日:2015-07-23
申请号:PCT/US2014051465
申请日:2014-08-18
Applicant: GEN ELECTRIC
Inventor: LEE WARREN , HAIDER BRUNO HANS , EDWARDSEN STEPHEN DODGE , HAUGEN GEIR , COGAN SCOTT , SAJ CHESTER , YETTER CHRISTOPHER , STEN-NILSEN BJORNAR , AMEMIYA SHINICHI , BAUMGARTNER CHARLES EDWARD
IPC: B06B1/06
CPC classification number: A61B8/4494 , A61B8/4411 , A61B8/4455 , B06B1/0622
Abstract: An ultrasound transducer array for an ultrasound probe is presented. The ultrasound transducer array includes a support structure. Further, the ultrasound transducer array includes a plurality of electro-acoustic modules coupled to the support structure, wherein each of the plurality of electro-acoustic modules comprises at least one matrix acoustic array and an interconnect element, wherein each of the plurality of electro-acoustic modules is interchangeable on the support structure so as to adapt to one or more shapes of the ultrasound probe, and wherein each of the plurality of electro-acoustic modules operates in a manner substantially identical to each other of the plurality of electro-acoustic modules.
Abstract translation: 提出了一种用于超声探头的超声波换能器阵列。 超声换能器阵列包括支撑结构。 此外,超声换能器阵列包括耦合到支撑结构的多个电声模块,其中多个电声模块中的每一个包括至少一个矩阵声阵列和互连元件,其中, 声学模块在支撑结构上是可互换的,以便适应于一个或多个形状的超声波探头,并且其中多个电声模块中的每一个以多个电声模块中的彼此基本相同的方式操作 。
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2.
公开(公告)号:WO2013148515A3
公开(公告)日:2013-12-27
申请号:PCT/US2013033527
申请日:2013-03-22
Applicant: GEN ELECTRIC
Inventor: BAUMGARTNER CHARLES EDWARD , DUROCHER KEVIN MATTHEW , WODNICKI ROBERT GIDEON , MILLS DAVID MARTIN , HUBER WILLIAM HULLINGER , KAPUSTA CHRISTOPHER JAMES , SOGOIAN GEORGE CHARLES
IPC: B06B1/06
CPC classification number: B06B1/0622 , H01L41/338 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1433 , H01L2924/15321 , Y10T29/42 , H01L2924/00
Abstract: An ultrasound acoustic assembly (100) includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer (42) assembled with at least one acoustic impedance dematching layer (41) and with a support layer (2). The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die (32). Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.
Abstract translation: 超声波声学组件(100)包括多个超声波阵列,每个阵列包括声堆叠,声堆叠包括与至少一个声阻抗分配层(41)和支撑层(2)组装的压电层(42)。 声学堆叠限定了多个切割切口和多个声学元件,使得切割切口形成在相邻的声学元件之间。 切割切口延伸穿过压电层并通过声阻抗分层,但仅部分延伸穿过支撑层。 超声波声学组件还包括许多专用集成电路(ASIC)管芯(32)。 每个超声波阵列耦合到相应的ASIC管芯,以形成相应的声电传感器模块。 还提供了制造方法。
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3.
公开(公告)号:JP2003262676A
公开(公告)日:2003-09-19
申请号:JP2002354474
申请日:2002-12-06
Applicant: GEN ELECTRIC
Inventor: BAUMGARTNER CHARLES EDWARD , FOBARE DAVID FRANCIS , DEJULE MICHAEL CLEMENT , WEI CHING-YEU , HENNESSY WILLIAM ANDREW , WOJNAROWSKI ROBERT JOHN , HEREE ARUDEBIRI , BURDICK WILLIAM EDWARD JR
IPC: G01T1/20 , G01T1/161 , G01T1/202 , G01T1/24 , G01T1/29 , H01L27/14 , H01L31/0216 , H01L31/09 , H04N5/32 , H04N5/335
Abstract: PROBLEM TO BE SOLVED: To restrain deterioration of X-ray images by protecting a scintillator material and a scintillator material protecting structure from the penetration of an inner hygroscopic moisture source and surrounding hygroscopic moisture. SOLUTION: The X-ray detector assembly comprises a scintillator material, that is arranged on a detector matrix array disposed on a detector base, an encapsulating coating that is arranged on the scintillator material, a moisture- resistant cover that is disposed over the upper portion of the detector base and the enclosing coating, and an adhesive that is arranged between the detector base and the moisture-resistant cover to form a vapor barrier so that the adhesive will not come into contact with the encapsulating coating. The X-ray detector assembly is manufactured, by arranging the enclosing coating on one portion of the scintillator material and the detector base, and by removing the enclosing coating from one portion of the above in the detector base. COPYRIGHT: (C)2003,JPO
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公开(公告)号:JP2001281291A
公开(公告)日:2001-10-10
申请号:JP2000360410
申请日:2000-11-28
Applicant: GEN ELECTRIC
Inventor: KRAHN JOHN RAYMOND , BAUMGARTNER CHARLES EDWARD
Abstract: PROBLEM TO BE SOLVED: To provide a PDS joint including a flexible joint part. SOLUTION: A partial discharge analysis(PDA) joint device includes a shell (22), a potting material (26) which hermetically capsules at least two capacitors (28, 30), and a conductive flexible joint part (50) which connects the capacitors (28, 30). The joint part (50) may be only a hose clamp or spring (70) which electrically connects the capacitors (28, 30) and expands while the potting material (26) thermally expands.
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公开(公告)号:FR2946785B1
公开(公告)日:2016-07-29
申请号:FR1054152
申请日:2010-05-28
Applicant: GEN ELECTRIC
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公开(公告)号:DE10256979A1
公开(公告)日:2003-07-24
申请号:DE10256979
申请日:2002-12-05
Applicant: GEN ELECTRIC
Inventor: BAUMGARTNER CHARLES EDWARD , FOBARE DAVID FRANCIS , DEJULE MICHAEL CLEMENT , WEI CHING-YEU , HENNESSY WILLIAM ANDREW , WOJNAROWSKI ROBERT JOHN , ARDEBILI HALEH , BURDICK WILLIAM EDWARD
IPC: G01T1/20 , G01T1/161 , G01T1/202 , G01T1/24 , G01T1/29 , H01L27/14 , H01L31/0216 , H01L31/09 , H04N5/32
Abstract: The present invention provides an X-ray detector assembly and a fabrication method, where the X-ray detector assembly comprises a scintillator material disposed on a detector matrix array disposed on a detector substrate; an encapsulating coating disposed on the scintillator material; a moisture resistant cover disposed over the detector substrate and the encapsulating coating, and an adhesive material disposed between the detector substrate and the moisture resistant cover so as to form a moisture vapor barrier. The adhesive material is disposed so that it is not in contact with the encapsulating coating. The fabrication method of the X-ray detector assembly includes the steps of disposing the encapsulating coating on the scintillator material and a portion of the detector substrate and removing the encapsulating coating from the portion of the detector substrate.
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公开(公告)号:FR2833358A1
公开(公告)日:2003-06-13
申请号:FR0215372
申请日:2002-12-05
Applicant: GEN ELECTRIC
Inventor: BAUMGARTNER CHARLES EDWARD , FOBARE DAVID FRANCIS , DEJULE MICHAEL CLEMENT , WEI CHING YEU , HENNESSY WILLIAM ANDREW , WOJNAROWSKI ROBERT JOHN , ARDEBILI HALEH , BURDICK WILLIAM EDWARD JR
IPC: G01T1/20 , G01T1/161 , G01T1/202 , G01T1/24 , G01T1/29 , H01L27/14 , H01L31/0216 , H01L31/09 , H04N5/32
Abstract: The present invention provides an X-ray detector assembly and a fabrication method, where the X-ray detector assembly comprises a scintillator material disposed on a detector matrix array disposed on a detector substrate; an encapsulating coating disposed on the scintillator material; a moisture resistant cover disposed over the detector substrate and the encapsulating coating, and an adhesive material disposed between the detector substrate and the moisture resistant cover so as to form a moisture vapor barrier. The adhesive material is disposed so that it is not in contact with the encapsulating coating. The fabrication method of the X-ray detector assembly includes the steps of disposing the encapsulating coating on the scintillator material and a portion of the detector substrate and removing the encapsulating coating from the portion of the detector substrate.
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公开(公告)号:FR2910169A1
公开(公告)日:2008-06-20
申请号:FR0759797
申请日:2007-12-13
Applicant: GEN ELECTRIC
Inventor: SMITH LOWELL SCOTT , LEWANDOWSKI ROBERT STEPHEN , HAIDER BRUNO HANS , BAUMGARTNER CHARLES EDWARD , SOGOIAN GEORGES CHARLES , YETTER CHRISTOPHER STEPHEN , WILDES DOUGLAS GLENN , KAISER STEPHEN ROYAL , BERGSTOEL SVEIN , BRUESTLE REINHOLD , ICOZ TUNC , BJAERUM STEINAR , SAJ CHESTER FRANK
IPC: G01S7/521
Abstract: Système d'échographie (10) pour réaliser une image d'un objet. Le système d'échographie (10) comprend une sonde échographique (52) pour acquérir des données d'échographie et un sous-système de refroidissement (54) pour évacuer de manière active de la chaleur de la sonde échographique (52). Le sous-système de refroidissement (54) comprend une pompe (62) disposée à l'intérieur d'un réservoir (68) contenant un agent de refroidissement (64) agencée pour faire circuler l'agent de refroidissement (64) dans la sonde échographique (52) via un conduit (66).
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公开(公告)号:FR2896043A1
公开(公告)日:2007-07-13
申请号:FR0656003
申请日:2006-12-28
Applicant: GEN ELECTRIC
Inventor: LEE WARREN , BAUMGARTNER CHARLES EDWARD , WILDES DOUGLAS GLENN , LEWANDOWSKI ROBERT STEPHEN
Abstract: Structure composite d'interconnexion (50) sur l'axe z. La structure composite (50) comprend une pluralité de couches de matière absorbante (40) disposées de manière alternée entre plusieurs couches d'interconnexion (38), les différentes couches d'interconnexion (38) étant agencées pour faciliter le couplage de la structure composite de l'interconnexion (50) sur l'axe z avec un réseau de transducteurs, la structure composite d'interconnexion (50) sur l'axe z étant agencée pour servir dans une sonde invasive.
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公开(公告)号:FR2872583A1
公开(公告)日:2006-01-06
申请号:FR0506413
申请日:2005-06-23
Applicant: GEN ELECTRIC
Inventor: SMITH LOWELL SCOTT , FISHER RAYETTE ANN , MILLS DAVID M , BAUMGARTNER CHARLES EDWARD
Abstract: La présente technique propose la fabrication et/ou l'utilisation d'une sonde ultrasonore configurée pour acquérir des données non d'imagerie en plus de données d'imagerie. En particulier, la sonde ultrasonore comprend un transducteur ultrasonore micro-usiné (48) formé sur la surface d'un substrat (44) en utilisant des techniques de microsystèmes électromécaniques ou d'autres techniques associées à la fabrication des composants à semiconducteur. Des capteurs non d'imagerie (46) sont formés sur le substrat, soit sur la surface soit à l'intérieur, ou sur un substrat proche du substrat sur lequel est formé le transducteur. Les capteurs non d'imagerie peuvent être utilisés pour acquérir des données non d'imagerie conjointement avec l'acquisition de données d'imagerie par le transducteur.
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