公开(公告)号：MY166589A

公开(公告)日：2018-07-17

申请号：MYPI2014001824

申请日：2012-12-14

Applicant: GEN ELECTRIC

Inventor： CAO JINBO ,  ROJO JUAN CARLOS ,  DALAKOS GEORGE THEODORE ,  YAKIMOV AHARON ,  ZHONG DALONG ,  KOREVAAR BASTIAAN ARIE ,  FELDMAN-PEABODY SCOOT D

IPC: H01L31/0296 ,  H01L21/477 ,  H01L31/0392 ,  H01L31/18

Abstract: A METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES IS PROVIDED. THE MANUFACTURING METHOD INCLUDES THERMALLY PROCESSING A FIRST SEMICONDUCTOR ASSEMBLY (100) COMPRISING A FIRST SEMICONDUCTOR LAYER (110) DISPOSED ON A FIRST SUPPORT (120) AND THERMALLY PROCESSING A SECOND SEMICONDUCTOR ASSEMBLY (200) COMPRISING A SECOND SEMICONDUCTOR LAYER (210) DISPOSED ON A SECOND SUPPORT (220). THE FIRST AND SECOND SEMICONDUCTOR ASSEMBLIES (100, 200) ARE THERMALLY PROCESSED SIMULTANEOUSLY, AND THE FIRST AND SECOND SEMICONDUCTOR ASSEMBLIES (100, 200) ARE ARRANGED SUCH THAT THE FIRST SEMICONDUCTOR LAYER (110) FACES THE SECOND SEMICONDUCTOR LAYER (210) DURING THE THERMAL PROCESSING. THE MOST SUITABLE DRAWING: