公开(公告)号：DE602005025923D1

公开(公告)日：2011-02-24

申请号：DE602005025923

申请日：2005-11-14

Applicant: GEN ELECTRIC

Inventor： STEVANOVIC LJUBISA DRAGOLJUB ,  SOLOVITZ STEPHEN ADAM

IPC: H05K7/20 ,  H01L23/00

公开(公告)号：AU2009238359A1

公开(公告)日：2011-06-09

申请号：AU2009238359

申请日：2009-11-20

Applicant: GEN ELECTRIC

Inventor： STEVANOVIC LJUBISA DRAGOLJUB ,  YAN LE ,  SOLOVITZ STEPHEN ADAM ,  BALASUBRAMANIAM MADADEVAN ,  BEAUPRE RICHARD ALFRED ,  ZHANG RICHARD S ,  GUNTURI SATISH SIVARAMA ,  PAUTSCH ADAM GREGORY ,  MALLINA RAMAKRISHNA VENKATA

IPC: H05K7/20 ,  F28F13/00 ,  H01L23/367

公开(公告)号：CA2589183A1

公开(公告)日：2007-01-04

申请号：CA2589183

申请日：2005-11-14

Applicant: GEN ELECTRIC

Inventor： STEVANOVIC LJUBISA DRAGOLJUB ,  SOLOVITZ STEPHEN ADAM

IPC: H05K7/20 ,  H01L23/00

Abstract: An apparatus for cooling at least one heated surface includes a base plate defining a number of inlet and outlet manifolds. The inlet manifolds are configured to receive a coolant, and the outlet manifolds exhaust the coolant. The inlet and outlet manifolds are interleaved. The apparatus also includes at least one substrate having inner and outer surfaces. The inner surface is coupled to the base plate and defines a number of microchannels that receive the coolant from the inlet manifolds and deliver the coolant to the outlet manifolds. The microchannels are oriented substantially perpendicular to the inlet and outlet manifolds. The outer surface is in thermal contact with the heated surface. The apparatus also includes an inlet plenum that supplies the coolant to the inlet manifolds, and an outlet plenum that exhausts the coolant from the outlet manifolds. The inlet plenum and outlet plenum are oriented in a plane of the base plate.

公开(公告)号：CA2589183C

公开(公告)日：2013-11-12

申请号：CA2589183

申请日：2005-11-14

Applicant: GEN ELECTRIC

Inventor： STEVANOVIC LJUBISA DRAGOLJUB ,  SOLOVITZ STEPHEN ADAM

IPC: H05K7/20 ,  H01L23/00

Abstract: An apparatus for cooling at least one heated surface includes a base plate defining a number of inlet and outlet manifolds. The inlet manifolds are configured to receive a coolant, and the outlet manifolds exhaust the coolant. The inlet and outlet manifolds are interleaved. The apparatus also includes at least one substrate having inner and outer surfaces. The inner surface is coupled to the base plate and defines a number of microchannels that receive the coolant from the inlet manifolds and deliver the coolant to the outlet manifolds. The microchannels are oriented substantially perpendicular to the inlet and outlet manifolds. The outer surface is in thermal contact with the heated surface. The apparatus also includes an inlet plenum that supplies the coolant to the inlet manifolds, and an outlet plenum that exhausts the coolant from the outlet manifolds. The inlet plenum and outlet plenum are oriented in a plane of the base plate.

公开(公告)号：BRPI0904795A2

公开(公告)日：2013-10-29

申请号：BRPI0904795

申请日：2009-11-24

Applicant: GEN ELECTRIC

Inventor： GUNTURI SATISH SIVARAMA ,  BALASUBRAMANIAM MADADEVAN ,  MALLINA RAMAKRISHNA VENKATA ,  BEAUPRE RICHARD ALFRED ,  YAN LE ,  ZHANG RICHARD S ,  STEVANOVIC LJUBISA DRAGOLJUB ,  PAUTSCH ADAM GREGORY ,  SOLOVITZ STEPHEN ADAM

IPC: H01L23/367