公开(公告)号：US20230389431A1

公开(公告)日：2023-11-30

申请号：US18448861

申请日：2023-08-11

Applicant: Guangdong University of Technology

Inventor： Yun CHEN ,  Pengfei YU ,  Aoke SONG ,  Zijian LI ,  Maoxiang HOU ,  Xin CHEN

IPC: H10N30/082 ,  H10N30/081

CPC classification number: H10N30/082 ,  H10N30/081 ,  H10N30/30

Abstract: A core-shell coaxial gallium nitride piezoelectric nanogenerator includes a core-shell coaxial gallium nitride nanowire array and a flexible substrate. A first conductive layer is provided on a surface of the flexible substrate. The core-shell coaxial gallium nitride nanowire array is fixed to the flexible substrate. A top end of the core-shell coaxial gallium nitride nanowire array is provided with a second conductive layer. The first conductive layer and the second conductive layer are both connected to an external circuit via a wire. A nanowire of the core-shell coaxial gallium nitride nanowire array is covered with an alumina layer. A method for preparing the core-shell coaxial gallium nitride piezoelectric nanogenerator is further provided. The gallium nitride nanowire array is formed by electrodeless photoelectrochemical etching.

公开(公告)号：US20240363792A1

公开(公告)日：2024-10-31

申请号：US18769404

申请日：2024-07-11

Applicant: Guangdong University of Technology

Inventor： Yun CHEN ,  Yanhui CHEN ,  Li MA ,  Pengwei LV ,  Hao ZHANG ,  Maoxiang HOU ,  Xin CHEN

IPC: H01L33/00 ,  H01L21/68 ,  H01L21/683 ,  H01L25/075

CPC classification number: H01L33/005 ,  H01L21/681 ,  H01L21/6835 ,  H01L25/0753

Abstract: A device for mass transfer of Mini-LEDs based on array water jet-based ejection, including a planar motion platform, a vision camera, an array water jet-type ejection unit, a Z-axis motion platform, a blue membrane, an operation platform and a transfer substrate. The vision camera and the array water jet-type ejection unit are provided on a side of the planar motion platform. The array water jet-type ejection unit includes a water jet channel and a through-hole array. The Z-axis motion platform is provided at a side of the planar motion platform near the vision camera, and is configured for placement of the blue membrane. Multiple Mini-LED chips are bonded to the blue membrane. The operation platform is spacedly provided at a side of the Z-axis motion platform away from the planar motion platform.

公开(公告)号：US20210166981A1

公开(公告)日：2021-06-03

申请号：US17037849

申请日：2020-09-30

Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY

Inventor： Yun CHEN ,  Yao YAO ,  Shuquan DING ,  Junyu LONG ,  Maoxiang HOU ,  Dachuang SHI ,  Xin CHEN ,  Jian GAO ,  Qiang LIU ,  Lanyu ZHANG ,  Yunbo HE ,  Shenghui ZHANG ,  Zhengping WANG

IPC: H01L21/66 ,  B23K26/08 ,  B23K26/06 ,  B23K26/082

Abstract: The disclosure relates to a method for repairing an internal circuit break defect in a chip, including: S1, detecting the defect position of the chip and the type and performance parameters of a filling material; S2, positioning the chip on a two-dimensional motion platform; S3, setting parameters of two beams of laser; adjusting a focal length of the two beams of laser three-dimensional incident angle and a Z axis, so that a focus point of the two beams of laser irradiate any end of the circuit break of the chip; S4, the two-dimensional motion platform drives the chip to move, so that the focus point of the two beams of laser is moved to an other end of the circuit break, and an moving trajectory of the focus point of the two beams of laser feeds through the two ends of the circuit break of the chip.

公开(公告)号：US20240363793A1

公开(公告)日：2024-10-31

申请号：US18769413

申请日：2024-07-11

Applicant: Guangdong University of Technology

Inventor： Yun CHEN ,  Yanhui CHEN ,  Li MA ,  Hao ZHANG ,  Jintao CHEN ,  Maoxiang HOU ,  Xin CHEN

IPC: H01L33/00

CPC classification number: H01L33/005

Abstract: An ejector pin sliding on membrane-based device and method for mass transfer of mini light-emitting diodes (Mini-LEDs) are provided. The device includes a gantry transverse beam. The gantry transverse beam is provided with an ejector pin base, and the ejector pin base is configured to move along the gantry transverse beam. The ejector pin base is fixedly provided with a vision camera and an ejector pin. A blue membrane is horizontally provided at a side of the gantry transverse beam close to the ejector pin, and is spaced from the gantry beam. A surface of a side of the blue membrane away from the gantry transverse beam is adhesively provided with a plurality of Mini-LED chips arranged evenly. A transfer substrate is horizontally provided at a side of the blue membrane close to the plurality of Mini-LED chips, and is spaced from the blue membrane.

公开(公告)号：US20230390746A1

公开(公告)日：2023-12-07

申请号：US18339190

申请日：2023-08-17

Applicant: Guangdong University of Technology

Inventor： Yun CHEN ,  Shengbao LAI ,  Biao LI ,  Zuohui LIU ,  Guanhai WEN ,  Maoxiang HOU ,  Xin CHEN

IPC: B01J27/224 ,  B01J21/18 ,  B01J6/00 ,  B01J37/06 ,  B01J37/08 ,  B01J37/04 ,  B01J35/00 ,  C01B3/04

CPC classification number: B01J27/224 ,  B01J21/18 ,  B01J6/001 ,  B01J37/06 ,  B01J37/08 ,  B01J37/04 ,  B01J35/004 ,  C01B3/045

Abstract: This application discloses a silicon carbide (SiC)-loaded graphene photocatalyst for hydrogen production under visible light irradiation and a preparation method thereof. Pure SiC and pure black carbon are respectively prepared and mixed to obtain a mixture with a resistance less than 100Ω. Then the mixture was vacuumized and processed with a current pulse with an increasing voltage until a breakdown occurs, and subjected to ultrasonic stirring, centrifugal washing and vacuum drying in turn to obtain the SiC-loaded graphene photocatalyst. By means of the current pulse, a heterojunction is formed between SiC and graphene to improve the catalytic activity of the photocatalyst; and the photocatalytic hydrogen production rate of SiC nanoparticles can be enhanced after loaded on the graphene.

公开(公告)号：US20230364657A1

公开(公告)日：2023-11-16

申请号：US18359139

申请日：2023-07-26

Applicant: Guangdong University of Technology

Inventor： Yun CHEN ,  Biao LI ,  Aoke SONG ,  Shankun DONG ,  Shengbao LAI ,  Maoxiang HOU ,  Xin CHEN

IPC: B08B7/02 ,  B06B1/06

CPC classification number: B08B7/028 ,  B06B1/0688 ,  B06B2201/56 ,  B06B2201/71 ,  G03F7/405

Abstract: A method of fabricating a film vibration device, including: photoetching a surface of a silicon wafer to form a circular-hole array; etching an aluminum layer on the silicon wafer; etching the silicon wafer to form a through-hole array to obtain a porous silicon wafer; attaching a polyethylene terephthalate (PET) sheet to a side of the porous silicon wafer; ablating the PET sheet to obtain a porous PET film; attaching a polyvinylidene fluoride (PVDF) film to a lower side of the porous silicon wafer; performing vacuumization above the porous silicon wafer, while heating the PVDF film below the porous silicon wafer to create dome micro-structures on the PVDF film; and laminating the porous PET film on each of two sides of the PVDF film to obtain the film vibration device. This application also provides a cleaning device having the film vibration device.

公开(公告)号：US20250115483A1

公开(公告)日：2025-04-10

申请号：US18982794

申请日：2024-12-16

Applicant: Guangdong University of Technology

Inventor： Yun CHEN ,  Bin XIE ,  Yuanhui GUO ,  Hao ZHANG ,  Maoxiang HOU ,  Li MA ,  Xin CHEN

IPC: G01N27/12 ,  B23K26/362 ,  C01B32/184

Abstract: A method for manufacturing a humidity alarm device based on laser-induced graphene is performed as follows. Carbon-based films are coated with a hydroxide ion-containing solution and processed by a laser device to generate hydrophilic graphene layers. The hydrophilic graphene layers are peeled off from the carbon-based films, wetted, and respectively wrapped around shaping rods varying in diameter. The wrapped rods are heated and shaped by a drying oven to obtain curled graphene switches. Each curled graphene switch is connected in series with an alarm lamp to form an alarm component. The alarm components are connected in parallel, and then connected to a positive terminal and a negative terminal of a power supply to form the humidity alarm device.

公开(公告)号：US20230048134A1

公开(公告)日：2023-02-16

申请号：US17968960

申请日：2022-10-19

Applicant: Guangdong University of Technology

Inventor： Yun CHEN ,  Yuanhui GUO ,  Bin XIE ,  Lu YAN ,  Maoxiang HOU ,  Xin CHEN

IPC: B01J20/02 ,  B01J20/20 ,  B01J20/30 ,  B01J20/32 ,  B01J20/28 ,  C23C14/35 ,  C23C14/02 ,  C23C14/18 ,  C23C14/08

Abstract: A method of fabricating a magnetically-controlled graphene-based micro-/nano-motor includes: (a) mixing FeCl3 crystal powder with deionized water to obtain a FeCl3 solution; (b) completely immersing a carbon-based microsphere in the FeCl3 solution; transferring the carbon-based microsphere from the FeCl3 solution followed by heating to allow crystallization of FeCl3 on the surface of the carbon-based microsphere to obtain a FeCl3-carbon-based microsphere; (c) heating the FeCl3-carbon-based microsphere in a vacuum chamber until there is no moisture in the vacuum chamber; continuously removing gas in the vacuum chamber and introducing oxygen; and treating the FeCl3-carbon-based microsphere with a laser in an oxygen-enriched environment to obtain the magnetically controlled graphene-based micro-/nano-motor. A magnetically-controlled graphene-based micro-/nano-motor is further provided.

公开(公告)号：US20210210461A1

公开(公告)日：2021-07-08

申请号：US17037909

申请日：2020-09-30

Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY

Inventor： Yun CHEN ,  Shuquan DING ,  Yunbo HE ,  Maoxiang HOU ,  Xin CHEN ,  Jian GAO ,  Ni ZHAO ,  Lanyu ZHANG ,  Zhengping WANG

IPC: H01L23/00

Abstract: A method for processing an ultra-high density interconnect wire under light source guidance, comprising preparing a photo-thermal response conductive paste, and putting it into an air pressure injector; driving the air pressure injector; the air pressure injector extrudes the photo-thermal response conductive paste, so that the photo-thermal response conductive paste is connected with the first chip to form an interconnection wire; stopping extruding the photo-thermal response conductive paste, and driving the air pressure injector to pull off the interconnection wire; a linear light source emits light and irradiates on the interconnection wire to bend to an upper side of a second chip bonding pad; an extrusion mechanism presses a free end of the interconnection wire on the second chip bonding pad; the first chip and the second chip are subjected to glue dripping encapsulation.