公开(公告)号：EP3249952B1

公开(公告)日：2020-01-15

申请号：EP15894016.3

申请日：2015-12-14

Applicant: Goertek Inc.

Inventor： SUN, Yanmei

IPC: H04R19/04 ,  H04R19/00 ,  H04R31/00

公开(公告)号：EP3249952A1

公开(公告)日：2017-11-29

申请号：EP15894016.3

申请日：2015-12-14

Applicant: Goertek Inc.

Inventor： SUN, Yanmei

IPC: H04R19/04

CPC classification number: B81B7/02 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/00158 ,  B81C2201/0105 ,  B81C2201/013 ,  G01L7/08 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R2201/003

Abstract: The present invention discloses a manufacturing method of an integrated structure of a MEMS microphone and a pressure sensor, which comprises the following steps: depositing an insulating layer, a first polycrystalline silicon layer, a sacrificial layer and a second polycrystalline silicon layer in sequence on a shared substrate; etching the second polycrystalline silicon layer to form a vibrating diaphragm and an upper electrode; eroding the sacrificial layer to form a containing cavity of a microphone and a pressure sensor, and etching the sacrificial layer between the microphone and the pressure sensor; etching the first polycrystalline silicon layer to form a back electrode of the microphone and a lower electrode of the pressure sensor; etching a position of the shared substrate below a back electrode of the microphone to form a back cavity; and etching away the region of the insulating layer below the back electrode. A capacitance structure of a MEMS microphone and that of a pressure sensor are integrated on a shared substrate, improving integration of a MEMS microphone and a pressure sensor, and greatly reducing a size of a whole packaging structure; in addition, a microphone and a pressure sensor can be simultaneously manufactured on a shared substrate to improve the efficiency of production.

Abstract translation: 本发明公开了一种MEMS麦克风与压力传感器集成结构的制作方法，包括以下步骤：依次在绝缘层，第一多晶硅层，牺牲层和第二多晶硅层上依次沉积 共享基板; 蚀刻第二多晶硅层以形成振动膜片和上电极; 侵蚀牺牲层以形成麦克风和压力传感器的容纳腔，以及刻蚀麦克风和压力传感器之间的牺牲层; 刻蚀第一多晶硅层以形成麦克风的背电极和压力传感器的下电极; 蚀刻麦克风的背电极下面的共享基板的位置以形成后腔; 并且蚀刻掉背电极下方的绝缘层的区域。 MEMS麦克风和压力传感器的电容结构集成在共用基板上，提高了MEMS麦克风和压力传感器的集成度，大大减小了整个封装结构的体积; 另外，麦克风和压力传感器可以同时制造在共享的基板上以提高生产效率。