公开(公告)号：EP3248936A1

公开(公告)日：2017-11-29

申请号：EP15894015.5

申请日：2015-12-14

Applicant: Goertek Inc.

Inventor： ZHENG, Guoguang

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81B7/02 ,  B81B3/0021 ,  B81B7/0061 ,  B81B2201/0228 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2203/04 ,  B81C1/00166 ,  B81C1/00269 ,  G01L9/12 ,  G01L19/04 ,  G01P15/125

Abstract: The present invention discloses a integrated structure of an MEMS pressure sensor and an MEMS inertia sensor, comprising: an insulating layer formed on a substrate, a first lower electrode and a second lower electrode both formed on the insulating layer, further comprising a first upper electrode forming an air pressure-sensitive capacitor together with the first lower electrode, and a second upper electrode forming a reference capacitor together with the second lower electrode; further comprising an inertia-sensitive structure supported above the substrate by a third support part, and a fixed electrode plate forming an inertia detecting capacitor of an inertia sensor together with the inertia-sensitive structure; and a cover body which packages the inertia detecting capacitor composed of the inertia-sensitive structure and the fixed electrode plate on the substrate. The integrated structure according to the present invention integrates the MEMS inertia sensor and the MEMS pressure sensor on the same substrate, which may effectively reduce the area of the chip, so as to reduce the cost of the chip. Single packaging may complete the packaging of the entire chip and reduce the cost of the chip packaging.

Abstract translation: 本发明公开了一种MEMS压力传感器与MEMS惯性传感器的集成结构，包括：形成在基板上的绝缘层，均形成在绝缘层上的第一下电极和第二下电极，还包括第一上电极 与第一下电极一起形成空气压敏电容器，以及与第二下电极一起形成参考电容器的第二上电极; 还包括由第三支撑部分支撑在所述基板上方的惯性敏感结构以及与所述惯性敏感结构一起形成惯性传感器的惯性检测电容器的固定电极板; 以及将由惯性敏感结构和固定电极板组成的惯性检测电容器封装在基板上的盖体。 本发明的集成结构将MEMS惯性传感器和MEMS压力传感器集成在同一个基板上，可以有效减小芯片面积，从而降低芯片成本。 单一封装可以完成整个芯片的封装并降低芯片封装的成本。