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公开(公告)号:WO2019027432A1
公开(公告)日:2019-02-07
申请号:PCT/US2017/044742
申请日:2017-07-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: CHOY, Si-lam , CUMBIE, Michael W. , CHEN, Chien-Hua , POLLARD, Jeffrey R.
Abstract: In one example in accordance with the present disclosure, a fluidic ejection device is described. The device includes a fluidic ejection die embedded in a moldable material. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages. The device also includes the moldable material which includes supply slots to deliver fluid to and from the fluidic ejection die. A carrier substrate of the device supports the fluidic ejection die and moldable material.
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公开(公告)号:WO2005092785A1
公开(公告)日:2005-10-06
申请号:PCT/US2005/004988
申请日:2005-02-16
Inventor: POLLARD, Jeffrey R. , MILLER, Michael D.
IPC: B81C1/00
CPC classification number: B81C1/00087 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1634 , B81B2201/052
Abstract: The described embodiments relate to slotted substrates (300) and methods of forming same. One exemplary method forms a first slot portion (410a) into a first surface (302) of a substrate (300), the first slot portion (410a) defining a footprint (404) at the first surface (302). The method also forms a second slot portion (410a 1 ) through the first slot portion (410a); and, forms a third slot portion (410a 2 ) through a second surface (303) of the substrate (300) sufficiently to intercept the second slot portion (410a 1 ) to form a fluid-handling slot (305) through the substrate (300).
Abstract translation: 所描述的实施例涉及开槽衬底(300)及其形成方法。 一种示例性方法形成到衬底(300)的第一表面(302)中的第一槽部分(410a),第一槽部分(410a)在第一表面(302)处限定了足迹(404)。 该方法还通过第一槽部(410a)形成第二槽部(410a1)。 并且通过所述基板(300)的第二表面(303)形成足以拦截所述第二槽部(410a1)以形成通过所述基板(300)的流体处理槽(305)的第三槽部(410a2)。
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公开(公告)号:WO2021183121A1
公开(公告)日:2021-09-16
申请号:PCT/US2020/022034
申请日:2020-03-11
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: LUM, Jacob M. , CHOY, Si-lam J. , POLLARD, Jeffrey R. , YAMASHITA, Tsuyoshi , SELLS, Jeremy , CLARK, Garrett E.
Abstract: A fluid ejection die may include a fluid actuator, a substrate supporting the fluid actuator, a chamber layer supported by the substrate and a bypass passage in the substrate. The substrate may include a closed inlet channel having an inlet opening for connection to an outlet of a fluid source and an outlet channel having an outlet opening of a first size for connection to an inlet of the fluid source. The chamber layer includes a recirculation passage to supply fluid for ejection by the fluid actuator through an ejection orifice and to circulate fluid across the fluid actuator from the closed inlet channel to the outlet channel. The bypass passage is of a second size less than the first size and connects the inlet channel to the inlet of the fluid source while bypassing any fluid actuator provided for ejecting fluid through an ejection orifice.
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公开(公告)号:WO2004101214A2
公开(公告)日:2004-11-25
申请号:PCT/US2004/013520
申请日:2004-04-29
Inventor: POLLARD, Jeffrey R.
IPC: B23K26/12
CPC classification number: B23K26/123 , B23K26/12 , B23K26/125 , B23K26/127 , B23K26/142 , B23K26/1476
Abstract: The described embodiments relate to laser micromachining a substrate (104). One exemplary embodiment includes a chamber (114) configured to receive an assist gas from an assist gas source. The chamber (114) is configured to allow a laser beam (108) to pass through the chamber (114) to contact a substrate (104) positioned outside of the chamber (114). The laser machine also includes a nozzle plate (202) positioned in gas receiving relation with the chamber (114), the nozzle plate (202) having at least one nozzle opening (204) formed therein, wherein the at least one nozzle opening (204) is substantially coincident a footprint of a feature (206) desired to be formed in the substrate (104).
Abstract translation: 所描述的实施例涉及激光微加工衬底(104)。 一个示例性实施例包括被配置为从辅助气体源接收辅助气体的腔室(114)。 腔室(114)被配置为允许激光束(108)穿过腔室(114)以接触位于腔室(114)外部的衬底(104)。 激光机还包括与腔室(114)以气体接收关系定位的喷嘴板(202),喷嘴板(202)具有形成在其中的至少一个喷嘴开口(204),其中至少一个喷嘴开口(204 )基本上重合期望形成在衬底(104)中的特征(206)的覆盖区。
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公开(公告)号:WO2021021079A1
公开(公告)日:2021-02-04
申请号:PCT/US2019/043650
申请日:2019-07-26
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: WILLARD, Randall Orson , POLLARD, Jeffrey R. , GOVYADINOV, Alexander , WOODFORD, Tod
Abstract: The present disclosure is drawn to microfluidic devices. The microfluidic device includes a substrate, an optically translucent lid, an adhesive securing the substrate to the lid, and an optical barrier material between the substrate and the optically translucent lid.
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公开(公告)号:WO2019103752A1
公开(公告)日:2019-05-31
申请号:PCT/US2017/063275
申请日:2017-11-27
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: CHEN, Chien-Hua , POLLARD, Jeffrey R. , CUMBIE, Michael W. , CHOY, Si-lam
CPC classification number: B41J2/14145 , B41J2202/12
Abstract: A die may, in an example, include at least one cross-die recirculation channel formed into the die to recirculate an amount of printing fluid therethrough, the cross-die recirculation channel including a first-sized inlet port and a first-sized outlet port formed on a first side of the die, at least one chamber recirculation channel formed into the die and fluidically coupled to the cross-die recirculation channel to recirculate an amount of printing fluid therethrough, the chamber recirculation channel including a second-sized inlet port and a second-sized outlet port, at least one pump formed within the chamber recirculation channel to recirculate the amount of printing fluid therethrough.
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公开(公告)号:WO2006138158A1
公开(公告)日:2006-12-28
申请号:PCT/US2006/022444
申请日:2006-06-07
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , BLAIR, Dustin W. , POLLARD, Jeffrey R. , GIERE, Matthew D. , PRAKASH, Satya
Inventor: BLAIR, Dustin W. , POLLARD, Jeffrey R. , GIERE, Matthew D. , PRAKASH, Satya
CPC classification number: B41J2/1603 , B41J2/1408 , B41J2/14145 , B41J2/1629 , B41J2/1631 , B41J2/1634
Abstract: A thermal ink-jet head has extended surface elements, like fins (350) or protrusions (650) used to cool the portion of the head dissipated by the resistors (130) that does not go into vaporizing the ink and is conducted through the substrate (122) . This head is manufactured using a light beam and anisotropic etching.
Abstract translation: 热喷墨头具有延伸的表面元件,例如用于冷却由电阻器(130)耗散的头部部分的翅片(350)或突出部(650),其不会使油墨蒸发并且通过基底 (122)。 该头部使用光束和各向异性蚀刻制造。
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8.
公开(公告)号:EP2016024A2
公开(公告)日:2009-01-21
申请号:EP07761748.8
申请日:2007-05-02
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: SHARAN, Alok , POLLARD, Jeffrey R.
IPC: B81C3/00
CPC classification number: B81C3/001 , B81B2203/033 , B81B2203/0338 , B81C2203/031 , B81C2203/032 , B81C2203/036 , H01L21/67092 , H01L25/0657 , H01L25/50 , H01L2924/0002 , H01L2924/00
Abstract: An apparatus includes a first component (102) and a second component (104). The apparatus includes one or more cavities (110) within one or more of the first and the second components. The apparatus includes one or more channels (108) within one or more of the first and the second components. The channels are fluidically inerconnectable with the cavities. Upon pressing the first component against the second component to bond the first component to the second component, gas trapped between the first and the second components is forced into the cavities via the channels.
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公开(公告)号:EP1720795A1
公开(公告)日:2006-11-15
申请号:EP05723177.1
申请日:2005-02-16
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: POLLARD, Jeffrey R. , MILLER, Michael D.
CPC classification number: B81C1/00087 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1634 , B81B2201/052
Abstract: The described embodiments relate to slotted substrates (300) and methods of forming same. One exemplary method forms a first slot portion (410a) into a first surface (302) of a substrate (300), the first slot portion (410a) defining a footprint (404) at the first surface (302). The method also forms a second slot portion (410a1) through the first slot portion (410a); and, forms a third slot portion (410a2) through a second surface (303) of the substrate (300) sufficiently to intercept the second slot portion (410a1) to form a fluid-handling slot (305) through the substrate (300).
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公开(公告)号:EP4117925A1
公开(公告)日:2023-01-18
申请号:EP20924385.6
申请日:2020-03-11
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: LUM, Jacob M. , CHOY, Si-lam J. , POLLARD, Jeffrey R. , YAMASHITA, Tsuyoshi , SELLS, Jeremy , CLARK, Garrett E.
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