公开(公告)号：ZA9007479B

公开(公告)日：1991-06-26

申请号：ZA9007479

申请日：1990-09-19

Applicant: HOECHST AG

Inventor： EMMELIUS MICHAEL ,  MICHAEL EMMELIUS ,  ERBES KURT ,  KURT ERBES ,  HERWIG WALTER ,  WALTER HERWIG ,  DECKER RUDOLF ,  RUDOLF DECKER

IPC: G03F7/033 ,  C08F257/02 ,  C08F283/10 ,  C08G59/00 ,  C08G59/18 ,  C08G59/40 ,  C08K3/36 ,  G03F1/08 ,  G03F7/004 ,  G03F7/031 ,  G03F7/032 ,  G03F7/038 ,  H05K3/06 ,  H05K3/28 ,  C08L ,  C08K ,  G03F ,  H05K

CPC classification number: H05K3/287 ,  C08F257/02 ,  C08F283/10 ,  G03F7/004 ,  G03F7/032 ,  H05K2203/0793 ,  Y10S430/136

公开(公告)号：NO904115A

公开(公告)日：1991-03-22

申请号：NO904115

申请日：1990-09-20

Applicant: HOECHST AG

Inventor： EMMELIUS MICHAEL ,  HERWIG WALTER ,  ERBES KURT ,  DECKER RUDOLF

IPC: G03F7/033 ,  C08F257/02 ,  C08F283/10 ,  C08G59/00 ,  C08G59/18 ,  C08G59/40 ,  C08K3/36 ,  G03F1/08 ,  G03F7/004 ,  G03F7/031 ,  G03F7/032 ,  G03F7/038 ,  H05K3/06 ,  H05K3/28 ,  C08L25/02 ,  C08L33/00

CPC classification number: H05K3/287 ,  C08F257/02 ,  C08F283/10 ,  G03F7/004 ,  G03F7/032 ,  H05K2203/0793 ,  Y10S430/136

公开(公告)号：BR8804797A

公开(公告)日：1989-04-25

申请号：BR8804797

申请日：1988-09-16

Applicant: HOECHST AG

Inventor： EMMELIUS MICHAEL ,  ELSAESSER ANDREAS ,  MOHR DIETER

IPC: G03C1/72 ,  G03F7/023 ,  G03C1/52 ,  G03F7/08

Abstract: The radiation-sensitive composition contains, as essential constituent, a 1,2-quinone diazide which is a polymer with repeating units of the general formula I in which R is a hydrogen or halogen atom, or a cyanide or an alkyl group, R1, R2, and R3 are identical or different and are hydrogen or halogen atoms, or optionally substituted alkyl or alkoxy groups, A are the atoms required to complete a mono- or binuclear carbocyclic or heterocyclic aromatic ring system, D is a radical containing a 1,2-quinone diazide grouping, and n + m is 2 or 3. A copying material can also be prepared from this composition. The material provides lithographic plates with a large print run.

公开(公告)号：CA2025831A1

公开(公告)日：1991-03-22

申请号：CA2025831

申请日：1990-09-20

Applicant: HOECHST AG

Inventor： EMMELIUS MICHAEL ,  HERWIG WALTER ,  ERBES KURT ,  DECKER RUDOLF

IPC: G03F7/033 ,  C08F257/02 ,  C08F283/10 ,  C08G59/00 ,  C08G59/18 ,  C08G59/40 ,  C08K3/36 ,  G03F1/08 ,  G03F7/004 ,  G03F7/031 ,  G03F7/032 ,  G03F7/038 ,  H05K3/06 ,  H05K3/28 ,  G03F7/40

Abstract: The present invention relates to a radiation- polymerizable mixture which includes a polymerizable compound, a polymeric binder which has units of methacrylic acid, a methacrylic acid ester and a styrene, the latter in a proportion of 40 to 65% by weight, a finely divided mineral pigment on a silicic acid or silicate basis, a photopolymerization initiator, a compound having at least two epoxy groups in its molecule and a thermal hardener for epoxy groups. The mixture is advantageous, in particular, for producing solder masks and can be cured after exposure to an image and development by heating to about 80 to 150.degree.C to form a stencil which is resistant under soldering conditions.

公开(公告)号：NO904115D0

公开(公告)日：1990-09-20

申请号：NO904115

申请日：1990-09-20

Applicant: HOECHST AG

Inventor： EMMELIUS MICHAEL ,  HERWIG WALTER ,  ERBES KURT ,  DECKER RUDOLF

IPC: G03F7/033 ,  C08F257/02 ,  C08F283/10 ,  C08G59/00 ,  C08G59/18 ,  C08G59/40 ,  C08K3/36 ,  G03F1/08 ,  G03F7/004 ,  G03F7/031 ,  G03F7/032 ,  G03F7/038 ,  H05K3/06 ,  H05K3/28 ,  C08L

Abstract: A description is given of a radiation-polymerisable composition which contains a polymerisable compound, a polymeric binder containing units of methacrylic acid, a methacrylate and a styrene, the latter in a proportion of 40 to 65% by weight, a finely divided mineral pigment with a silicic acid or silicate base, a photopolymerisation initiator, a compound containing at least two epoxy groups in the molecule and a thermal hardener for epoxy groups. The composition is suitable in particular for producing solder resist masks and, after exposure to an image and development, can be cured by heating to 80 to 150 DEG C to form a template which is resistant under soldering conditions.

公开(公告)号：FI904605A0

公开(公告)日：1990-09-19

申请号：FI904605

申请日：1990-09-19

Applicant: HOECHST AG

Inventor： EMMELIUS MICHAEL ,  HERWIG WALTER ,  ERBES KURT ,  DECKER RUDOLF

IPC: G03F7/033 ,  C08F257/02 ,  C08F283/10 ,  C08G59/00 ,  C08G59/18 ,  C08G59/40 ,  C08K3/36 ,  G03F1/08 ,  G03F7/004 ,  G03F7/031 ,  G03F7/032 ,  G03F7/038 ,  H05K3/06 ,  H05K3/28 ,  C08L

Abstract: A description is given of a radiation-polymerisable composition which contains a polymerisable compound, a polymeric binder containing units of methacrylic acid, a methacrylate and a styrene, the latter in a proportion of 40 to 65% by weight, a finely divided mineral pigment with a silicic acid or silicate base, a photopolymerisation initiator, a compound containing at least two epoxy groups in the molecule and a thermal hardener for epoxy groups. The composition is suitable in particular for producing solder resist masks and, after exposure to an image and development, can be cured by heating to 80 to 150 DEG C to form a template which is resistant under soldering conditions.

公开(公告)号：CA2025831C

公开(公告)日：2001-11-20

申请号：CA2025831

申请日：1990-09-20

Applicant: HOECHST AG

Inventor： EMMELIUS MICHAEL ,  HERWIG WALTER ,  ERBES KURT ,  DECKER RUDOLF

IPC: G03F7/033 ,  C08F257/02 ,  C08F283/10 ,  C08G59/00 ,  C08G59/18 ,  C08G59/40 ,  C08K3/36 ,  G03F1/08 ,  G03F7/004 ,  G03F7/031 ,  G03F7/032 ,  G03F7/038 ,  H05K3/06 ,  H05K3/28 ,  G03F7/40

Abstract: The present invention relates to a radiation- polymerizable mixture which includes a polymerizable compound, a polymeric binder which has units of methacrylic acid, a methacrylic acid ester and a styrene, the latter in a proportion of 40 to 65% by weight, a finely divided mineral pigment on a silicic acid or silicate basis, a photopolymerization initiator, a compound having at least two epoxy groups in its molecule and a thermal hardener for epoxy groups. The mixture is advantageous, in particular, for producing solder masks and can be cured after exposure to an image and development by heating to about 80 to 150.degree.C to form a stencil which is resistant under soldering conditions.

公开(公告)号：ZA907479B

公开(公告)日：1991-06-26

申请号：ZA907479

申请日：1990-09-19

Applicant: HOECHST AG

Inventor： EMMELIUS MICHAEL ,  MICHAEL EMMELIUS ,  ERBES KURT ,  KURT ERBES ,  HERWIG WALTER ,  WALTER HERWIG ,  DECKER RUDOLF ,  RUDOLF DECKER

IPC: G03F7/033 ,  C08F257/02 ,  C08F283/10 ,  C08G59/00 ,  C08G59/18 ,  C08G59/40 ,  C08K3/36 ,  G03F1/08 ,  G03F7/004 ,  G03F7/031 ,  G03F7/032 ,  G03F7/038 ,  H05K3/06 ,  H05K3/28 ,  C08L ,  C08K ,  G03F ,  H05K

Abstract: A description is given of a radiation-polymerisable composition which contains a polymerisable compound, a polymeric binder containing units of methacrylic acid, a methacrylate and a styrene, the latter in a proportion of 40 to 65% by weight, a finely divided mineral pigment with a silicic acid or silicate base, a photopolymerisation initiator, a compound containing at least two epoxy groups in the molecule and a thermal hardener for epoxy groups. The composition is suitable in particular for producing solder resist masks and, after exposure to an image and development, can be cured by heating to 80 to 150 DEG C to form a template which is resistant under soldering conditions.

公开(公告)号：NO904115L

公开(公告)日：1991-03-22

申请号：NO904115

申请日：1990-09-20

Applicant: HOECHST AG

Inventor： EMMELIUS MICHAEL ,  HERWIG WALTER ,  ERBES KURT ,  DECKER RUDOLF

IPC: G03F7/033 ,  C08F257/02 ,  C08F283/10 ,  C08G59/00 ,  C08G59/18 ,  C08G59/40 ,  C08K3/36 ,  G03F1/08 ,  G03F7/004 ,  G03F7/031 ,  G03F7/032 ,  G03F7/038 ,  H05K3/06 ,  H05K3/28 ,  C08L25/02 ,  C08L33/00

Abstract: A description is given of a radiation-polymerisable composition which contains a polymerisable compound, a polymeric binder containing units of methacrylic acid, a methacrylate and a styrene, the latter in a proportion of 40 to 65% by weight, a finely divided mineral pigment with a silicic acid or silicate base, a photopolymerisation initiator, a compound containing at least two epoxy groups in the molecule and a thermal hardener for epoxy groups. The composition is suitable in particular for producing solder resist masks and, after exposure to an image and development, can be cured by heating to 80 to 150 DEG C to form a template which is resistant under soldering conditions.