Abstract:
Ein Dünnfilm, der aus einem Material besteht, das ein Metall und Silicium enthält, wird auf einem lichtdurchlässigen Substrat ausgebildet. Dann wird eine Vorbehandlung zur Modifikation einer Hauptfläche des Dünnfilms durchgeführt, so dass bei kumulativer Einstrahlung von Belichtungslicht mit einer Wellenlänge von höchstens 200 nm auf eine Dünnfilmstruktur einer durch Strukturieren des Dünnfilms zu erzeugenden Photomaske die Übertragungscharakteristik der Dünnfilmstruktur sich nicht mehr als in einem vorgegebenen Grad ändert. Diese Behandlung wird beispielsweise durch Ausführen einer Wärmebehandlung in einer sauerstoffhaltigen Atmosphäre bei 450°C bis 900°C durchgeführt.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a transfer mask capable of improving chemical resistance, hot-water resistance and light resistance and preventing deterioration of mask performance due to chemical processing, hot water washing or exposure light and the like.SOLUTION: After a thin film pattern 2a made of a material including transition metal and silicon is formed on a translucent substrate 1, a surface modified layer including an oxide on the surface of the thin film pattern 2a is formed by making ozone gas act on the thin film pattern 2a under irradiation of ultraviolet light. Thereby, a transfer mask 20 having enhanced chemical resistance, hot water resistance and light resistance is obtained.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for removing a thin film of a substrate with thin films, capable of reducing damage to the substrate after removing the thin film and preventing a residue of the thin film.SOLUTION: By using a mask blank 10 having a light shielding film 2 made of a material including, for example, a molybdenum silicide compound and an etching mask film 3 made of a chromium based material which are formed on a translucent substrate 1 in this order, and patterning the thin films of the mask blank by a photolithography method, an etching mask film pattern 3a and a light shielding film pattern 2a are formed. After processing of making an ozone gas with high concentration of 100 volume% act on (for example, contact) the etching mask film pattern 3a while heating the substrate at 100°C or more, the etching mask film pattern 3a is peeled and removed.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a mask blank and a method for manufacturing a transfer mask, and a mask blank and a transfer mask which are capable of improving light resistance of a thin film against exposure light having a wavelength of 200 nm or less and significantly improving a mask lifetime.SOLUTION: A method for manufacturing a mask blank having a thin film formed on a transparent substrate includes steps of: forming a thin film made of a material containing transition metal on the transparent substrate; and performing superheated steam treatment onto the thin film.
Abstract:
PROBLEM TO BE SOLVED: To provide a transfer mask improved in the light resistance of a translucent film or a light-shielding film containing a transition metal and silicon against exposure light at a wavelength of 200 nm or less.SOLUTION: The transfer mask which has a transfer pattern formed in a thin film for pattern formation provided on a light-transmissive substrate is produced by using a mask blank, wherein a thin film for pattern formation comprising silicon and a material containing a transition metal other than chromium, and a chromium-based thin film containing chromium are laminated in this order on a light-transmissive substrate, and the chromium content of the thin film for pattern formation is less than 1.0×10atoms/cm.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a photomask blank, capable of improving light fastness of a light semi-transmitting film or a light-shielding film containing metal and silicon to exposure light at a wavelength of 200 nm or shorter, and improving a service life of a photomask.SOLUTION: A photomask is manufactured by forming a thin film comprising a material containing molybdenum and silicon on a light-transmitting substrate, then subjecting the thin film to a treatment of increasing the number of SiOmolecules in a surface layer of the thin film to form a layer containing silicon and oxide on the surface layer of the thin film, and patterning the thin film. The above treatment on the thin film is carried out in such a manner that, when a thin film pattern of a photomask manufactured by patterning the treated thin film is continuously irradiated with ArF excimer laser light up to the total dose of 30 kJ/cm, a change amount of the line width of the thin film pattern after the irradiation is 5 nm or less.
Abstract translation:要解决的问题:提供一种制造光掩模坯料的方法,其能够将光半透明膜或含有金属和硅的遮光膜的耐光性提高到200nm或更短的波长的曝光光,以及 提高光掩模的使用寿命。解决方案:通过在透光性基板上形成含有钼和硅的材料的薄膜,然后对该薄膜进行处理以增加表面上的SiO分子的数量来制造光掩模 层,以在薄膜的表面层上形成含有硅和氧化物的层,并对该薄膜进行构图。 对薄膜进行上述处理是这样进行的:当通过对经处理的薄膜进行图案化制造的光掩模的薄膜图案用ArF准分子激光连续照射直至总剂量为30kJ / cm 2时, 照射后的薄膜图案的线宽的变化量为5nm以下。
Abstract:
PROBLEM TO BE SOLVED: To provide a mask blank that is improved in adhesion of a thin film for forming a transfer pattern to a resist, thereby suppressing the occurrence of collapse, chipping, or the like of the formed resist pattern.SOLUTION: The mask blank has, on a translucent substrate 1, a thin film 2 which is for forming a transfer pattern and is made of a material containing a metal. The thin film 2 has a surface modified layer in the form of an oxide film containing a hydrocarbon. The surface modified layer of the thin film 2 can be formed by, for example, causing a highly concentrated ozone gas and an unsaturated hydrocarbon gas to act on the thin film.