-
公开(公告)号：US20170356622A1
公开(公告)日：2017-12-14
申请号：US15618253
申请日：2017-06-09
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Markus Rossi , Peter Riel , Peter Roentgen
IPC: F21V9/08 , F21V5/00 , F21V7/22 , F21Y2115/30
CPC classification number: F21V9/08 , F21V5/004 , F21V7/22 , F21V9/30 , F21Y2115/30
Abstract: The present disclosure describes light conversion modules each having a single laser diode or multiple laser diodes. The light conversion modules can be particularly small in size (height and lateral footprint) and can overcome various challenges associated with the high optical power and heat emitted by laser diodes. In some implementations, the light conversion modules include glass phosphors, which, in some instances, can resist degradation caused by the optical power and/or heat generated by the laser diodes. In some instances, the light conversion modules include optical filters which, in some instances, can reduce or eliminate human eye-safety risk.
-
公开(公告)号：US20170343889A1
公开(公告)日：2017-11-30
申请号：US15675955
申请日：2017-08-14
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Peter Riel , Markus Rossi , Daniel Pérez Calero , Matthias Gloor , Moshe Doron , Dmitry Bakin , Philippe Bouchilloux
CPC classification number: G03B21/142 , G02B7/003 , G02B7/02 , G03B21/2033 , H01L27/14618 , H01L33/483 , H01L33/58 , H01L2933/0033 , H01L2933/0058
Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.
-
公开(公告)号：US20180315911A1
公开(公告)日：2018-11-01
申请号：US15769893
申请日：2016-10-24
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Bojan Tesanovic , Peter Riel
IPC: H01L33/62 , H01L31/02 , H01L33/54 , H01L31/0203 , H01L33/58 , H01L31/0232 , H01L31/18
CPC classification number: H05K3/425 , H05K3/0014 , H05K3/007 , H05K3/284 , H05K2201/09118 , H05K2201/09845 , H05K2201/10121 , H05K2203/0733 , H05K2203/1461 , H05K2203/1476
Abstract: An electrical-contact assembly includes electrical contacts with first and second electrical-contact surfaces on opposing sides of the assembly. The electrical-contact assembly is manufactured by a structurable process (e.g., photo-structurable process) and by electroplating. The first and second electrical-contact surfaces can be positioned with respect to each other with an accuracy, for example, of at least 5 microns. Further, the thickness of the electrical-contact assembly can be at most 17 microns in some cases. The electrical-contact assembly can include integrated active optoelectronic elements, overmolds, optical elements and non-transparent walls.
-
公开(公告)号：US09768361B2
公开(公告)日：2017-09-19
申请号：US14903217
申请日：2015-07-22
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Peter Riel , Markus Rossi , Daniel Pérez Calero , Matthias Gloor , Moshe Doron , Dmitry Bakin , Philippe Bouchilloux
CPC classification number: G03B21/142 , G02B7/003 , G02B7/02 , G03B21/2033 , H01L27/14618 , H01L33/483 , H01L33/58 , H01L2933/0033 , H01L2933/0058
Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.
-
5.发明申请Accurate Positioning and Alignment of a Component During Processes Such as Reflow Soldering 审中-公开组件在回流焊接过程中的精确定位和对准公开(公告)号：US20160057855A1
公开(公告)日：2016-02-25
申请号：US14784754
申请日：2014-04-11
Applicant: HEPTAGON MICRO OPTICS PTE. LTD.
Inventor： Peter Riel
CPC classification number: H05K1/0272 , B23K1/0016 , B23K1/008 , B23K35/025 , H05K1/0269 , H05K1/0306 , H05K1/111 , H05K1/181 , H05K3/303 , H05K3/3421 , H05K3/3431 , H05K3/3452 , H05K3/3494 , H05K2201/09663 , H05K2201/09745 , H05K2201/09909 , H05K2201/09918 , H05K2201/10121 , H05K2203/0445 , H05K2203/048 , H05K2203/0571 , H05K2203/166 , Y02P70/611 , Y02P70/613
Abstract: One or more channels are provided in the surface of a conductive layer of a PCB substrate in an area on which a component is to be placed. The channels can help reduce or prevent shifting of the component during reflow soldering through surface tension/capillary forces of the solder paste material in the channels. Such channels also can be used, for example, by an image processing system to facilitate accurate positioning and/or alignment of the component. The image processing system can use the location of the channels alone, or in combination with other features such as a solder mask or other alignment marks, to position and/or align the component with high accuracy.
Abstract translation: 在要放置部件的区域中的PCB基板的导电层的表面中设置一个或多个通道。 这些通道可以帮助减少或防止回流焊接过程中部件在通道中的焊膏材料的表面张力/毛细管力的移动。 这样的通道也可以例如由图像处理系统使用，以促进部件的精确定位和/或对准。 图像处理系统可以单独使用通道的位置，或者与诸如焊接掩模或其它对准标记的其它特征组合，以高精度地定位和/或对齐部件。
-
Patent Agency Ranking
6.发明申请METHOD FOR WAFER-LEVEL MANUFACTURING OF OBJECTS AND CORRESPONDING SEMI-FINISHED PRODUCTS 审中-公开用于水平制造物体和相关半成品的方法公开(公告)号：US20140295122A1
公开(公告)日：2014-10-02
申请号：US14346804
申请日：2012-10-01
Applicant: Heptagon Micro Optics Pte. Ltd
Inventor： Peter Riel , Hartmut Rudmann , Markus Rossi
CPC classification number: B81B7/04 , B81C1/00904 , H01L27/14618 , H01L27/14685 , H01L27/14696 , H01L2924/0002 , Y10T29/49002 , Y10T428/18 , H01L2924/00
Abstract: The method for manufacturing an object comprises the steps of (a) providing a wafer comprising a multitude of semi-finished objects; (b) separating said wafer into parts referred to as sub- wafers, at least one of said sub-wafers comprising a plurality of said semi-finished objects; (c) processing at least a portion of said plurality of semi-finished objects by subjecting said at least one sub-wafer to at least one processing step; and preferably also the step of (d) separating said at least one sub-wafer into a plurality of parts.
Abstract translation: 制造物体的方法包括以下步骤：（a）提供包括多个半成品的晶片; （b）将所述晶片分离成称为子晶片的部件，所述子晶片中的至少一个包括多个所述半成品; （c）通过对所述至少一个子晶片进行至少一个处理步骤来处理所述多个半成品的至少一部分; 并且还优选地（d）将所述至少一个子晶片分成多个部分的步骤。
-
公开(公告)号：US10566363B2
公开(公告)日：2020-02-18
申请号：US15675955
申请日：2017-08-14
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Peter Riel , Markus Rossi , Daniel Pérez Calero , Matthias Gloor , Moshe Doron , Dmitry Bakin , Philippe Bouchilloux
IPC: H01L27/146 , G02B7/02 , H01L33/58 , H01L31/0232 , H01L33/48 , G02B7/00 , G03B21/14 , G03B21/20
Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.
-
公开(公告)号：US20170299433A1
公开(公告)日：2017-10-19
申请号：US15512977
申请日：2015-09-23
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Peter Riel , Peter Roentgen
CPC classification number: G01J3/10 , G01J3/06 , G01J3/108 , G01J3/26 , H01S3/094096 , H01S5/0071 , H01S5/0287 , H01S5/041 , H01S5/1096 , H01S5/183 , H01S5/32375 , H01S5/34306 , H01S5/34313 , H01S5/34326 , H01S5/3438 , H01S5/4043 , H01S5/4087
Abstract: The present disclosure describes broadband optical emission sources that include a stack of semiconductor layers, wherein each of the semiconductor layers is operable to emit light of a different respective wavelength; a light source operable to provide optical pumping for stimulated photon emission from the stack; wherein the semiconductor layers are disposed sequentially in the stack such that a first one of the semiconductor layers is closest to the light source and a last one of the semiconductor layers is furthest from the light source, and wherein each particular one of the semiconductor layers is at least partially transparent to the light generated by the other semiconductor layers that are closer to the light source than the particular semiconductor layer. The disclosure also describes various spectrometers that include a broadband optical emission device, and optionally include a tuneable wavelength filter operable to allow a selected wavelength or narrow range of wavelengths to pass through.
-
9.发明申请LIGHT EMITTER AND LIGHT DETECTOR MODULES INCLUDING VERTICAL ALIGNMENT FEATURES 有权光发射器和光检测器模块，包括垂直对准功能公开(公告)号：US20160306265A1
公开(公告)日：2016-10-20
申请号：US14903217
申请日：2015-07-22
Applicant: HEPTAGON MICRO OPTICS PTE. LTD.
Inventor： Peter Riel , Markus Rossi , Daniel Pérez Calero , Matthias Gloor , Moshe Doron , Dmitry Bakin , Philippe Bouchilloux
CPC classification number: G03B21/142 , G02B7/003 , G02B7/02 , G03B21/2033 , H01L27/14618 , H01L33/483 , H01L33/58 , H01L2933/0033 , H01L2933/0058
Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.
Abstract translation: 本公开描述了可以为诸如光发射器或光检测器的光电子器件提供超精密和稳定的封装的各种模块。 这些模块包括在模块制造期间可以根据需要加工的垂直对准特征，以在光电器件与设置在光电器件上的光学元件或光学组件之间建立精确的距离。
-
10.发明申请公开(公告)号：US20180235080A1
公开(公告)日：2018-08-16
申请号：US15956472
申请日：2018-04-18
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Peter Riel
IPC: H05K1/02 , H05K3/34 , B23K1/00 , B23K1/008 , B23K35/02 , H05K1/03 , H05K1/11 , H05K1/18 , H05K3/30
CPC classification number: H05K1/0272 , B23K1/0016 , B23K1/008 , B23K35/025 , H05K1/0269 , H05K1/0306 , H05K1/111 , H05K1/181 , H05K3/303 , H05K3/3421 , H05K3/3431 , H05K3/3452 , H05K3/3494 , H05K2201/09663 , H05K2201/09745 , H05K2201/09909 , H05K2201/09918 , H05K2201/10121 , H05K2203/0445 , H05K2203/048 , H05K2203/0571 , H05K2203/166 , Y02P70/611 , Y02P70/613
Abstract: One or more channels are provided in the surface of a conductive layer of a PCB substrate in an area on which a component is to be placed. The channels can help reduce or prevent shifting of the component during reflow soldering through surface tension/capillary forces of the solder paste material in the channels. Such channels also can be used, for example, by an image processing system to facilitate accurate positioning and/or alignment of the component. The image processing system can use the location of the channels alone, or in combination with other features such as a solder mask or other alignment marks, to position and/or align the component with high accuracy.
-
-
-
-
-
-
-
-
-
Search Results
12
records
(took 0.025 seconds)
