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公开(公告)号：US20230400717A1
公开(公告)日：2023-12-14
申请号：US18209415
申请日：2023-06-13
Applicant: HyperLight Corporation
Inventor： Mian Zhang , Kevin Luke , Roy Meade , Prashanta Kharel , Christian Reimer , Fan Ye
IPC: G02F1/035
CPC classification number: G02F1/035 , G02F2202/20 , G02F2201/063
Abstract: An electro-optic device is described. The electro-optic device includes at least one optical material having an electro-optic effect. Further, the optical material(s) include lithium. The optical material(s) have a slab and a ridge waveguide. The slab has a top surface. The slab includes free surfaces. Each of the free surfaces is at a nonzero angle from the top surface of the slab and mitigates stress in the slab.
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公开(公告)号：US20230305326A1
公开(公告)日：2023-09-28
申请号：US18125644
申请日：2023-03-23
Applicant: HyperLight Corporation
Inventor： Kevin Luke , Mian Zhang , Fan Ye , Roy Meade , Christian Reimer , Prashanta Kharel
IPC: G02F1/035
CPC classification number: G02F1/035 , G02F2202/20
Abstract: An optical device includes a substrate, an oxide layer on the substrate and an electro-optic device on the oxide layer. The oxide layer is at least one micrometer thick. The electro-optic device includes an electro-optic material having a thickness of not more than one micrometer. The silicon substrate, oxide layer, and the electro-optic material terminate at an edge. At least one of the silicon substrate has a thickness of at least five hundred micrometers or the edge includes a recessed region corresponding to a portion of the oxide layer.
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公开(公告)号：US20250076578A1
公开(公告)日：2025-03-06
申请号：US18817075
申请日：2024-08-27
Applicant: HyperLight Corporation
IPC: G02B6/13
Abstract: A singulated thin film lithium containing (TFLC) photonics device, as well as a method and system for singulating the device are described. The TFLC photonics device includes a device layer and a silicon substrate. The device layer includes a TFLC layer having a depth. The device layer also has a first sawn edge. The silicon substrate has a second sawn edge and includes an upper portion and a lower portion. The upper portion has the second sawn edge that is mutually aligned with the first sawn edge. The upper portion overhangs the lower portion.
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Patent Agency Ranking
公开(公告)号：US20250060530A1
公开(公告)日：2025-02-20
申请号：US18935166
申请日：2024-11-01
Applicant: HyperLight Corporation
Inventor： Mian Zhang , Roy Meade , Christian Reimer
Abstract: A hybrid photonics device package is described. The hybrid photonics device package includes an electro-optic integrated circuit and a photonics integrated circuit. The electro-optic integrated circuit includes an optical structure and an electrode on a first substrate. The optical structure has a thin film electro-optic layer including lithium. The photonics integrated circuit includes a second substrate and a photonics component on the second substrate. The photonics component and the optical structure are optically coupled. One of the electro-optic integrated circuit and the photonics integrated circuit is mounted on an other of the electro-optic integrated circuit and the photonics integrated circuit.
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公开(公告)号：US12174419B2
公开(公告)日：2024-12-24
申请号：US18208828
申请日：2023-06-12
Applicant: HyperLight Corporation
Inventor： Mian Zhang , Roy Meade , Christian Reimer
Abstract: A hybrid photonics device package is described. The hybrid photonics device package includes an electro-optic integrated circuit and a photonics integrated circuit. The electro-optic integrated circuit includes an optical structure and an electrode on a first substrate. The optical structure has a thin film electro-optic layer including lithium. The photonics integrated circuit includes a second substrate and a photonics component on the second substrate. The photonics component and the optical structure are optically coupled. One of the electro-optic integrated circuit and the photonics integrated circuit is mounted on an other of the electro-optic integrated circuit and the photonics integrated circuit.
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公开(公告)号：US20240385470A1
公开(公告)日：2024-11-21
申请号：US18665412
申请日：2024-05-15
Applicant: HyperLight Corporation
Inventor： Mian Zhang , Roy Meade , Kevin Luke
IPC: G02F1/035
Abstract: A wafer for an integrated photonics system is described. The wafer includes a substrate and at least one thin film lithium-containing optical material on the substrate. The wafer also includes at least one photodetecting layer on and bonded with the thin film lithium-containing optical material(s).
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公开(公告)号：US20230400716A1
公开(公告)日：2023-12-14
申请号：US18208818
申请日：2023-06-12
Applicant: HyperLight Corporation
Inventor： Roy Meade , Kevin Luke , Mian Zhang , Christian Reimer
IPC: G02F1/035
CPC classification number: G02F1/035
Abstract: An electro-optic device is described. The electro-optic device includes a thin film electro-optic layer including lithium and a lithium barrier structure. The thin film electro-optic layer has a plurality of surfaces. The lithium barrier structure covers at least a portion of the plurality of surfaces.
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公开(公告)号：US20230400631A1
公开(公告)日：2023-12-14
申请号：US18208828
申请日：2023-06-12
Applicant: HyperLight Corporation
Inventor： Mian Zhang , Roy Meade , Christian Reimer
IPC: G02B6/122
CPC classification number: G02B6/122 , G02B2006/1204
Abstract: A hybrid photonics device package is described. The hybrid photonics device package includes an electro-optic integrated circuit and a photonics integrated circuit. The electro-optic integrated circuit includes an optical structure and an electrode on a first substrate. The optical structure has a thin film electro-optic layer including lithium. The photonics integrated circuit includes a second substrate and a photonics component on the second substrate. The photonics component and the optical structure are optically coupled. One of the electro-optic integrated circuit and the photonics integrated circuit is mounted on an other of the electro-optic integrated circuit and the photonics integrated circuit.
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