Abstract:
A Schottky barrier diode comprises a first-type substrate (100), a second-type well isolation region (102) on the first-type substrate, and a first-type well region (110) on the second-type well isolation region. With embodiments herein a feature referred to as a perimeter capacitance well junction ring (106) is on the second-type well isolation region. A second-type well region (104) is on the second-type well isolation region. The perimeter capacitance well junction ring is positioned between and separates the first-type well region and the second-type well region. A second-type contact region (108) is on the second-type well region, and a first-type contact region (112) contacts the inner portion of the first-type well region. The inner portion of the first-type well region is positioned within the center of the first-type contact region. Additionally, a first ohmic metallic layer (124) is on the first- type contact region and a second ohmic metallic layer (126) is on the first-type well region. The first ohmic metallic layer contacts the second ohmic metallic layer at a junction that makes up the Schottky barrier of the Schottky barrier diode.