5.
    发明专利
    未知

    公开(公告)号:DE3576798D1

    公开(公告)日:1990-05-03

    申请号:DE3576798

    申请日:1985-01-24

    Applicant: IBM

    Abstract: Chemical heat amplification is provided in thermal transfer printing, wherein some of the heat necessary for melting and transferring ink from a solid fusible layer in a ribbon to a re- ce i ving medium is provided by an exothermic reaction. This chemical reaction is due to an exothermic material that is located in the ink layer, or in another layer of the ink bearing ribbon. The exothermic reaction reduces the amount of the input power which must be applied either electrically or with electromagnetic waves. Examples of suitable exothermic materials are those which will provide heat within the operative temperature range of the ink, and include hydrazone derivatives which are substantially colorless, and have a molecular weight in the approximate range 150-650. The group consisting of substituted aryl sulfonyl hydrazones, mono hydrazones of acylic -diketones, aromatic disulfonyl and diacyl hydrazones, and mono hydrazones of cyclic -dicarbonyl heterocycles are usable exothermic materials.

    MULTILEVEL METAL STRUCTURE AND PROCESS FOR MAKING SAME

    公开(公告)号:DE3473198D1

    公开(公告)日:1988-09-08

    申请号:DE3473198

    申请日:1984-12-14

    Applicant: IBM

    Abstract: The structure overlay a substrate with conductive first pattern (7a) and comprise first layer (3 min ) of an organic polymer, a second layer (9) of an organometallic compound, second conductive pattern (7c sec ) on said layer (9) and metallurgy (7b min ) interconnecting said first and second pattern (7a, 7c sec ) through said layers (3 min , 9). For forming the structure said first, said second, a third and a fourth layer (3 min , 9, 4 min and 5 min ) are deposited with third layer (4 min ) being soluble in a solvent not dissolving layer (3 min ) and fourth layer (5 min ) being oxygen RIE resistant. The layers are selectively removed successively by RIE. Blanket metal layer (7 min ) is applied and then third layer (4 min ) is removed by dissolution and with it the overlying layers. Subsequently the process steps are repeated with the exception of steps involving an organometallic layer. The usage of an organometallic layer provides an improved compatibility of the thermal expansion coefficients between contiguous layers and an oxygen etch stop.

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