公开(公告)号：JPH06252226A

公开(公告)日：1994-09-09

申请号：JP1328194

申请日：1994-02-07

Applicant: IBM

Inventor： ANIRUKUMARU CHINUPURASADO BATS ,  REO REIMONDO BUDA ,  ROBAATO DAGURASU EDOWAAZU ,  POORU JIYOOZEFU HAATO ,  ANSONII POORU INGURAHAMU ,  BUOYA RISUTA MARUKOBUICHI ,  JIYAINARU AABEDEIIN MOTSURA ,  RICHIYAADO JIERARUDO MAAFUII ,  JIYOOJI SAKUSENMAIYAA JIYUNIA ,  JIYOOJI FUREDERITSUKU UOOKAA ,  BETSUTO JIEI HOUEEREN ,  RICHIYAADO SUCHIYUAATO ZARU

IPC: G01R31/28 ,  H01L21/60 ,  H01L21/66

Abstract: PURPOSE: To provide simulated site test and actual site test for integrated circuit chip by providing a contact corresponding to the contact of semiconductor chip and defining the contact of carrier as a chip carrier having a dendrite surface. CONSTITUTION: A semiconductor circuit chip is placed on a board or a test jig while facing a connector on the board. The board or jig has the dendrite in structure including a conductive pad or substrate, smooth Pd lower layer and upper layer such as a pole-shaped Pd layer on the connecting plane, contact or pad of chip. Then, the chip and the board are contacted and compressing force is applied to the chip and the board. Afterwards, various logic tests and memory tests are performed to the integrated circuit chip while applying power between the input and the ground, and unsuccessful chip is discarded but the successful chip is bonded to the board between the bonding pad and the dendritic surface.

公开(公告)号：JPH0544021B2

公开(公告)日：1993-07-05

申请号：JP27193589

申请日：1989-10-20

Applicant: IBM

Inventor： RICHAADO GOODON AAMANTO ,  EDOWAADO RII ARINTON ,  ANIRUKUMARU CHINUPURASADO BATS ,  DONARUDO MAIKURU EGURUTON ,  FUREDERITSUKU MAAKU OOTOROFU ,  JOZEFU JON SUNIIZEKU ,  JON ANDORUU UERUSHU

IPC: G03F7/42 ,  H01L21/027 ,  H01L21/30

公开(公告)号：JPH05216242A

公开(公告)日：1993-08-27

申请号：JP23436692

申请日：1992-09-02

Applicant: IBM

Inventor： NAGESHIYUWAA RAO BANTOU ,  ANIRUKUMARU CHINUPURASADO BATS ,  ASHIYUUINKUMARU CHINUPURASADO ,  JIYOZEFU ARUFUONSU KOTEIRO ,  JIERARUDO UOORUTAA JIYOONZU ,  ROBAATO JIYON OUIN ,  KOSUTASU PAPATOMASU ,  ANAAYA KUMARU BARUDOYA

IPC: G03F7/32 ,  G03F7/42 ,  H05K3/06

Abstract: PURPOSE: To provide a developer and a stripping agent simple, adaptable to environment and for a free radical initiating and addition polymerizing photoresist, a cationic hardened resist and a soldering mask and a Vacrel photoresist. CONSTITUTION: Both of the developer and the stripping agent in all cases contain τ-butylolactone, propylene carbonate and benzyl alcohol and optionally contains a small quantity of methanol, ethanol, isopropyl, propylene glycol monomethyl acetate, ethylene glycol monomethyl ether, formamide, nitromethane, propylene oxide, methylethyl ketone, acetone and water.

公开(公告)号：JPH02251855A

公开(公告)日：1990-10-09

申请号：JP27193589

申请日：1989-10-20

Applicant: IBM

Inventor： RICHIYAADO GOODON AAMANTO ,  EDOWAADO RII ARINTON ,  ANIRUKUMARU CHINUPURASADO BATS ,  DONARUDO MAIKURU EGURUTON ,  FUREDERITSUKU MAAKU OOTOROFU ,  JIYOZEFU JIYON SUNIIZEKU ,  JIYON ANDORUU UERUSHIYU

IPC: G03F7/42 ,  H01L21/027 ,  H01L21/30

Abstract: PURPOSE: To obtain a compsn. relatively rapidly and effectively stripping a photoresist by incorporating specified amts. of o-dichlorobenzene, dodecyl benzenesulfonic acid and perchloroethylene. CONSTITUTION: This compsn. consists essentially of about 42.5-43.5wt.% o- dichlorobenzene, about 18.5-19.5wt.% dodecylbenzenesulfonic acid, about 18.5-38.5wt.% perchloroethylene and 0 to about 19.5wt.% at least 8C arom. hydrocarbon and does not contain phenol. When this compsn. is brought into contact with a photoresist on a substrate, the substrate is rapidly and effectively stripped form the substrate.