SUSPENSION SYSTEM
    1.
    发明专利

    公开(公告)号:JPH11120715A

    公开(公告)日:1999-04-30

    申请号:JP22771698

    申请日:1998-08-12

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To provide the method for soldering a suspension and a lead of a converter of a miniaturized disk drive. SOLUTION: The suspension member 32 is provided with the integrated electrically conductive lead 120 extending to the rear tail part along the longitudinal direction. This lead 120 is extended beyond the tail part and electrically connected with an acceptor pad member. The distant end 135 of the lead is provided with a recessed area at the edge of a terminal for guiding the flow of the fluid solder to the joint part. This recessed area is formed into e.g. a chamfer 136, preferably to be semicircular. The tail pad is provided with a pair of tab members 134 accepted by an opening part of the acceptor pad member, for accurately aligning the lead.

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