公开(公告)号：BR9006652A

公开(公告)日：1991-10-01

申请号：BR9006652

申请日：1990-12-28

Applicant: IBM

Inventor： AUG CONRAD J ,  CASANOVA WAYNE J ,  CORFITS WILLIAM D ,  DIMMICK ROGER F ,  WHEELER STEPHEN E

IPC: G06F1/18 ,  H05K7/14 ,  H05K7/18

Abstract: A double-sided backplane assembly (20) is provided for increasing the logic element density in a logic cage or CEC. The backplane assembly is multi-layered with a backplane card (22) centrally located between a stiffener (30) and an EMC shield (36) affixed to each side thereof. Connectors for connecting logic elements to the backplane card are provided on both sides of the backplane card, so that a logic cage having two sub-cages may be provided, the two sub-cages sharing the one backplane assembly.

公开(公告)号：CA1124406A

公开(公告)日：1982-05-25

申请号：CA335497

申请日：1979-09-12

Applicant: IBM

Inventor： AUG CONRAD J ,  RECKINGER ARTHUR P JR

IPC: H01R12/71 ,  H01R13/64 ,  H05K7/14 ,  H05K1/11 ,  H05K1/14

Abstract: CIRCUIT BOARD AND CARD INTERCONNECTION SYSTEM Interconnection between a large planar electronic printed circuit board and a plurality of relatively smaller electronic printed circuit cards is accomplished by connecting the planar board to an array board by means of elongated interposer connectors. The array board contains a plurality of positions which accommodate the plugging of electronic printed circuit cards and cables. A mechanical ejection system allows the planar board to be removed from the system without disturbing the cards, cables or the interposer connection to the array board. RO978-044