公开(公告)号：BR9006652A

公开(公告)日：1991-10-01

申请号：BR9006652

申请日：1990-12-28

Applicant: IBM

Inventor： AUG CONRAD J ,  CASANOVA WAYNE J ,  CORFITS WILLIAM D ,  DIMMICK ROGER F ,  WHEELER STEPHEN E

IPC: G06F1/18 ,  H05K7/14 ,  H05K7/18

Abstract: A double-sided backplane assembly (20) is provided for increasing the logic element density in a logic cage or CEC. The backplane assembly is multi-layered with a backplane card (22) centrally located between a stiffener (30) and an EMC shield (36) affixed to each side thereof. Connectors for connecting logic elements to the backplane card are provided on both sides of the backplane card, so that a logic cage having two sub-cages may be provided, the two sub-cages sharing the one backplane assembly.

公开(公告)号：CA1297975C

公开(公告)日：1992-03-24

申请号：CA577729

申请日：1988-09-16

Applicant: IBM

Inventor： BEHRENS LINDA M ,  BLOHM NEIL A ,  CIMIJOTTI RAYMOND L ,  CORFITS WILLIAM D ,  RASMUSSEN JERRY R

IPC: H05K7/14 ,  H05K9/00 ,  H05K7/20

Abstract: A plugable interposer assembly for enclosing printed circuit cards used in electronic devices and accommodating the connection of cables and additional printed circuit card enclosures. The enclosure is completely shielded and is particularly adapted to use in circumstances where unskilled persons either plug or unplug the assembly into a backplane assembly.

公开(公告)号：BR9006651A

公开(公告)日：1991-10-01

申请号：BR9006651

申请日：1990-12-28

Applicant: IBM

Inventor： CASANOVA WAYNE J ,  CORFITS WILLIAM D ,  DIMMICK ROGER F ,  THOMPSON GARY A ,  THORPE JAMES R ,  WHEELER STEPHEN E

IPC: G06F1/16 ,  H05K7/14 ,  H05K7/18

Abstract: A double-sided central electronics complex (CEC) (20) is provided for increasing the logic card density in a logic cage or CEC. Specifically, two logic cages or sub-enclosures (22, 24) are integrated, sharing one backplane card so that logic elements may be plugged into the CEC from both sides. The CEC is formed by unitary sheet metal side plates, top and bottom cast or guides (26, 28) and a single double-sided backplane assembly (38).

公开(公告)号：CA1283739C

公开(公告)日：1991-04-30

申请号：CA579389

申请日：1988-10-05

Applicant: IBM

Inventor： CORFITS WILLIAM D ,  MOSLEY CLAUDE J ,  RASMUSSEN JERRY R ,  WHEELER STEPHEN E

IPC: B41J29/00 ,  H05K7/14 ,  H05K7/20 ,  H05K9/00 ,  H05K1/14

Abstract: A plugable assembly for enclosing printed circuit cards used in electronic devices. The enclosure is completely shielded and is particularly adapted to use in circumstances where unskilled persons either plug or unplug the assembly into a backplane assembly.