公开(公告)号：BR9006651A

公开(公告)日：1991-10-01

申请号：BR9006651

申请日：1990-12-28

Applicant: IBM

Inventor： CASANOVA WAYNE J ,  CORFITS WILLIAM D ,  DIMMICK ROGER F ,  THOMPSON GARY A ,  THORPE JAMES R ,  WHEELER STEPHEN E

IPC: G06F1/16 ,  H05K7/14 ,  H05K7/18

Abstract: A double-sided central electronics complex (CEC) (20) is provided for increasing the logic card density in a logic cage or CEC. Specifically, two logic cages or sub-enclosures (22, 24) are integrated, sharing one backplane card so that logic elements may be plugged into the CEC from both sides. The CEC is formed by unitary sheet metal side plates, top and bottom cast or guides (26, 28) and a single double-sided backplane assembly (38).

公开(公告)号：BR9006653A

公开(公告)日：1991-10-01

申请号：BR9006653

申请日：1990-12-28

Applicant: IBM

Inventor： CASANOVA WAYNE J ,  RECKINGER ARTHUR P JR ,  SEYFERT MICHAEL D ,  THORPE JAMES R ,  WHELLER STEPHEN E

IPC: G06F1/16 ,  H05K7/14 ,  H05K5/02

Abstract: An enclosure is provided for containing the logic elements and ancillary components for computing systems. The enclosure is a unitized central electronics enclosure (20) (CEC) wherein the primary structural element is the enclosure for the logic elements. This enclosure or logic cage includes unitary side plates (24, 25), a double-sided backplane and top and bottom cast guides (29, 30). The integrated structural and enclosure functions accommodate the structural needs of a CEC, as well as containing and supporting the logic elements and ancillary equipment.

公开(公告)号：BR9006652A

公开(公告)日：1991-10-01

申请号：BR9006652

申请日：1990-12-28

Applicant: IBM

Inventor： AUG CONRAD J ,  CASANOVA WAYNE J ,  CORFITS WILLIAM D ,  DIMMICK ROGER F ,  WHEELER STEPHEN E

IPC: G06F1/18 ,  H05K7/14 ,  H05K7/18

Abstract: A double-sided backplane assembly (20) is provided for increasing the logic element density in a logic cage or CEC. The backplane assembly is multi-layered with a backplane card (22) centrally located between a stiffener (30) and an EMC shield (36) affixed to each side thereof. Connectors for connecting logic elements to the backplane card are provided on both sides of the backplane card, so that a logic cage having two sub-cages may be provided, the two sub-cages sharing the one backplane assembly.