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公开(公告)号:AU1797876A
公开(公告)日:1978-04-06
申请号:AU1797876
申请日:1976-09-21
Applicant: IBM
Inventor: BARGON JOACHIM , GIPSTEIN EDWARD , HIRAOKA HIROYUKI
Abstract: A process for forming an image with a positive resist using a polymer containing dimethylglutarimide units. The polymer is sensitive to both electron beam and light radiation, has a high glass transition temperature, a high temperature resistance, and is capable of very fine spatial resolution, very suitable for micro circuitry processings.
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公开(公告)号:CA1072243A
公开(公告)日:1980-02-19
申请号:CA261430
申请日:1976-09-17
Applicant: IBM
Inventor: BARGON JOACHIM , GIPSTEIN EDWARD , HIRAOKA HIROYUKI
Abstract: POSITIVE RESISTS CONTAINING DIMETHYLGLUTARIMIDE UNITS A process for forming an image with a positive resist using a polymer containing dimethylglutarimide units. The polymer is sensitive to both electron beam and light radiation, has a high glass transition temperature, a high temperature resistance, and is capable of very fine spatial resolution, very suitable for micro circuitry processings.
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公开(公告)号:CH600393A5
公开(公告)日:1978-06-15
申请号:CH1174076
申请日:1976-09-16
Applicant: IBM
Inventor: BARGON JOACHIM , GIPSTEIN EDWARD , HIRAOKA HIROYUKI
IPC: G03F7/038 , C08F8/32 , G03F7/039 , H01L21/027 , G03F7/02
Abstract: A process for forming an image with a positive resist using a polymer containing dimethylglutarimide units. The polymer is sensitive to both electron beam and light radiation, has a high glass transition temperature, a high temperature resistance, and is capable of very fine spatial resolution, very suitable for micro circuitry processings.
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公开(公告)号:FR2325077A1
公开(公告)日:1977-04-15
申请号:FR7623080
申请日:1976-07-20
Applicant: IBM
Inventor: BARGON JOACHIM , GIPSTEIN EDWARD , HIRAOKA HIROYUKI
IPC: G03F7/038 , C08F8/32 , G03F7/039 , H01L21/027 , G03C1/495 , H01L21/312 , H05K3/06
Abstract: A process for forming an image with a positive resist using a polymer containing dimethylglutarimide units. The polymer is sensitive to both electron beam and light radiation, has a high glass transition temperature, a high temperature resistance, and is capable of very fine spatial resolution, very suitable for micro circuitry processings.
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公开(公告)号:DE2641624A1
公开(公告)日:1977-03-24
申请号:DE2641624
申请日:1976-09-16
Applicant: IBM
Inventor: BARGON JOACHIM , GIPSTEIN EDWARD , HIRAOKA HIROYUKI
IPC: G03F7/038 , C08F8/32 , G03F7/039 , H01L21/027 , G03F7/10
Abstract: A process for forming an image with a positive resist using a polymer containing dimethylglutarimide units. The polymer is sensitive to both electron beam and light radiation, has a high glass transition temperature, a high temperature resistance, and is capable of very fine spatial resolution, very suitable for micro circuitry processings.
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公开(公告)号:DE3268140D1
公开(公告)日:1986-02-06
申请号:DE3268140
申请日:1982-09-08
Applicant: IBM
Inventor: BARGON JOACHIM , HIRAOKA HIROYUKI , WELSH LAWRENCE WILLIAM
IPC: G03F7/039 , G03F7/004 , G03F7/038 , G03F7/26 , G03F7/38 , G03F7/40 , H01L21/027 , H01L21/312
Abstract: A photoresist that has strong resistance to reactive ion etching, high photosensitivity to mid- and deep UV-light, and high resolution capability is formed by using as the resist material a copolymer of methacrylonitrile and methacrylic acid, and by baking the resist before the exposure to light for improved photosensitivity, and after exposure to light, development, and prior to treatment with reactive ion etching.
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