Abstract:
Polysulfone resists are made more sensitive to decomposition by electron beam radiation and also made sensitive to radiation of light in the 3,000 to 5,000 A region by the addition of sensitizers which are either energy transfer agents or sources of free radicals.
Abstract:
Electron beam positive resists are formed from terpolymers of (a) an alpha olefin, (b) sulfur dioxide, and (c) a compound selected from the group consisting of cyclopentene, bicycloheptene and methyl methacrylate. The terpolymers have the particular unexpected advantage of being resistant to cracking of the films.
Abstract:
POLYMERIC PHOTOCONDUCTORS OF N-VINYLINDOLE, BOTH UNSUBSTITUTED AND SUBSTITUTED, COPOLYMERIZED THROUGH ITS VINYL SUBSTITUENT WITH A COREPEATING UNIT HAVING THE STRUCTURAL FORMULA:
-C WHEREIN R'' IS A FUSED RING RADICAL. EXAMPLES OF THESE COPOLYMERS ARE N-VINYLINDOLE-INDOLE COPOLYMER, N-VINYLINDOLE N-METHYLINDOLE COPOLYMER, N-VINYLINDOLE-INDENE COPOLYMER, N-VINYLLINDOLE-COUMARIN COPOLYMER, AND NVINYLINDOLE-MALEIC ANHYDRIDE COPOLYMER.
Abstract:
A process for forming an image with a positive resist using a polymer containing dimethylglutarimide units. The polymer is sensitive to both electron beam and light radiation, has a high glass transition temperature, a high temperature resistance, and is capable of very fine spatial resolution, very suitable for micro circuitry processings.
Abstract:
Patterns, such as etch resistant resists, masks, are formed by degradation of a t-butyl methacrylate polymer coating, or film, under an electron beam in a predetermined pattern, followed by removal with a solvent, of the electron degraded product in the exposed areas.
Abstract:
1515330 Electron sensitive polymers INTERNATIONAL BUSINESS MACHINES CORP 5 Dec 1975 [29 Jan 1975] 49960/75 Heading G2C Positive resist masks are formed by exposing a supported film of a non-crosslinked polymeric material to electron beam radiation in a predetermined pattern so as to degrade the polymeric material in the exposed areas, and removing the degraded products in the exposed areas. The polymeric material used is selected from (1) polyalkyl methacrylates and copolymers of alkyl methacrylates with halogen - or cyano - containing monomers and (2) post halogenated derivatives of the polymers in (1). The coated polymers may be baked prior to exposure and also after development.
Abstract:
1500403 Sensitized olefin-sulphone polymers INTERNATIONAL BUSINESS MACHINES CORP 21 May 1975 [26 Sept 1974] 21838/75 Addition to 1421805 Heading G2C A radiation sensitive positive resist comprises an olefin-sulphone polymer sensitized by a charge transfer agent or a free radical source. The polymer is preferably poly (hexene-1-sulphone) and sensitizers include azulene, 2, 4, 7-trinitrofluorenone, fluorene, diphenylamine, p-nitroaniline, CCl4, CBr4, Cl4, phenyl disulphide, azobenzene, and poly(alpha-chloromethylacrylate). The resist is degraded on exposure to U.V., visible light, x-rays, gamma radiation and low energy electron beams of from 10 to 30 KeV. The exposed areas of the polymer are removed using a solvent such as 1,4- dichlorobutane.