Terpolymers for electron beam positive resists
    2.
    发明授权
    Terpolymers for electron beam positive resists 失效
    电子束正抗蚀剂三元共聚物

    公开(公告)号:US3898350A

    公开(公告)日:1975-08-05

    申请号:US48358974

    申请日:1974-06-27

    Applicant: IBM

    CPC classification number: G03F7/039 C08G75/22 Y10S430/143

    Abstract: Electron beam positive resists are formed from terpolymers of (a) an alpha olefin, (b) sulfur dioxide, and (c) a compound selected from the group consisting of cyclopentene, bicycloheptene and methyl methacrylate. The terpolymers have the particular unexpected advantage of being resistant to cracking of the films.

    Abstract translation: 电子束正性抗蚀剂由(a)α-烯烃,(b)二氧化硫和(c)选自环戊烯,双环庚烯和甲基丙烯酸甲酯的化合物的三元共聚物形成。 三元共聚物具有耐薄膜破裂的特别意想不到的优点。

    8.
    发明专利
    未知

    公开(公告)号:DE2602825A1

    公开(公告)日:1976-08-05

    申请号:DE2602825

    申请日:1976-01-27

    Applicant: IBM

    Abstract: 1515330 Electron sensitive polymers INTERNATIONAL BUSINESS MACHINES CORP 5 Dec 1975 [29 Jan 1975] 49960/75 Heading G2C Positive resist masks are formed by exposing a supported film of a non-crosslinked polymeric material to electron beam radiation in a predetermined pattern so as to degrade the polymeric material in the exposed areas, and removing the degraded products in the exposed areas. The polymeric material used is selected from (1) polyalkyl methacrylates and copolymers of alkyl methacrylates with halogen - or cyano - containing monomers and (2) post halogenated derivatives of the polymers in (1). The coated polymers may be baked prior to exposure and also after development.

    10.
    发明专利
    未知

    公开(公告)号:DE2536300A1

    公开(公告)日:1976-04-08

    申请号:DE2536300

    申请日:1975-08-14

    Applicant: IBM

    Abstract: 1500403 Sensitized olefin-sulphone polymers INTERNATIONAL BUSINESS MACHINES CORP 21 May 1975 [26 Sept 1974] 21838/75 Addition to 1421805 Heading G2C A radiation sensitive positive resist comprises an olefin-sulphone polymer sensitized by a charge transfer agent or a free radical source. The polymer is preferably poly (hexene-1-sulphone) and sensitizers include azulene, 2, 4, 7-trinitrofluorenone, fluorene, diphenylamine, p-nitroaniline, CCl4, CBr4, Cl4, phenyl disulphide, azobenzene, and poly(alpha-chloromethylacrylate). The resist is degraded on exposure to U.V., visible light, x-rays, gamma radiation and low energy electron beams of from 10 to 30 KeV. The exposed areas of the polymer are removed using a solvent such as 1,4- dichlorobutane.

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