公开(公告)号：EP0748150A3

公开(公告)日：1998-09-23

申请号：EP96107833

申请日：1996-05-17

Applicant: IBM

Inventor： CANESTARO MICHAEL J

IPC: B05C3/109 ,  B05D1/26 ,  B08B3/04 ,  C23F1/08 ,  H01L21/304 ,  H05K3/00 ,  H05K3/06 ,  H05K3/26

CPC classification number: C23F1/08 ,  B08B3/041 ,  H05K3/0085 ,  Y10S134/902 ,  Y10T29/4984

Abstract: A fluid treatment apparatus, including a lower substrate transportation and fluid head including a plurality of lower drive rod members (3) provided in a plurality of spaced apart lower drive rod member receiving passages (7). The lower drive rod members at least partially extend through an upper surface of the lower substrate transportation and fluid head (9). A plurality of fluid injector passages (5) and fluid drain passages are provided between the lower drive rod members. An upper substrate transportation and fluid head is provided including a plurality of upper drive rod members provided in a plurality of spaced apart drive upper rod member receiving passages. The upper drive rod members at least partially extending through a lower surface of the upper substrate transportation and fluid head. A plurality of fluid injector passages and fluid drain passages are provided between the upper drive rod members. A fluid supply apparatus supplies fluid to the fluid injector passages. A fluid source supplies fluid to the fluid treatment apparatus.

公开(公告)号：CH613287A5

公开(公告)日：1979-09-14

申请号：CH1680474

申请日：1974-12-17

Applicant: IBM

Inventor： ABOLAFIA OSCAR R ,  CANESTARO MICHAEL J ,  CUTILLO JOSEPH G

IPC: C08F2/50 ,  C08F299/02 ,  C08G59/00 ,  C08G59/40 ,  C08G59/50 ,  G03F7/032 ,  G03F7/038 ,  H01L21/027 ,  H05K3/00 ,  G03C1/70

公开(公告)号：CA1097823A

公开(公告)日：1981-03-17

申请号：CA310044

申请日：1978-08-25

Applicant: IBM

Inventor： ALPAUGH WARREN A ,  CANESTARO MICHAEL J ,  ELLIS THERON L

IPC: H05K3/00 ,  B08B3/08 ,  H05K3/25

Abstract: CLEANING OF HIGH ASPECT RATIO THROUGH HOLES IN MULTILAYER PRINTED CIRCUIT BOARDS A cleaning process for high aspect ratio through holes of multilayer printed circuit boards assures the removal of any loosened fiberous material or epoxy smears in the through holes and also provides an inverted "T" structure at the innerplanes of the internal conductive circuits within the printed circuit board sandwich. The inverted "T" structure helps to move the contact point between the plating of the through hole and internal circuit lines further into the circuit board, thereby eliminating the "Z" stress at the edge of the innerplane. This process is accomplished by first vapor blasting the through holes, soaking the board in a suitable solvent to loosen any fibers or smears on the circuit innerplanes of the board, removing the excess solvent from the through holes and then feeding a unilateral stream of a cleaning solution through the holes, the cleaning solution operating to remove excess fibers and smears in the through holes and to produce a slight, uniform etchback of the metal innerplanes of the printed circuit boards. Thereafter, the solution may be reduced and any excess cleaning solution is removed.

公开(公告)号：CA1048328A

公开(公告)日：1979-02-13

申请号：CA214897

申请日：1974-11-27

Applicant: IBM

Inventor： CANESTARO MICHAEL J ,  ABOLAFIA OSCAR R ,  SCHMITT GEORGE P ,  CUTILLO JOSEPH G

IPC: C08F2/50 ,  C08F299/02 ,  C08G59/00 ,  C08G59/40 ,  C08G59/50 ,  G03F7/032 ,  G03F7/038 ,  H01L21/027 ,  H05K3/00

Abstract: PHOTO-PROCESSABLE COATINGS of the Invention A photo-processable coating is formed using (1) an epoxy prepolymer which is solid at room temperature and which has at least 2 epoxy groups per molecule, (2) an alpha, beta ethylenically unsaturated carboxylic acid, (3) a primary aromatic amine, and (4) a photo-initiator.