公开(公告)号：DE3662278D1

公开(公告)日：1989-04-13

申请号：DE3662278

申请日：1986-05-06

Applicant: IBM

Inventor： CAPWELL ROBERT JOHN ,  RICKERT ROBERT GEORGE

IPC: C23C18/16 ,  C23C18/31 ,  C23C18/40 ,  H05K3/18

Abstract: Apparatus and method for determining the deposition capability of an electroless metal plating bath (10) by monitoring the difference in instantaneous electrical potential between a pair of test substrates (12, 13) immersed in the bath in which one substrate (12) is seeded to initiate plating thereon of the bath metal and the other substrate (13) has a surface of the bath metal. The magnitude of the difference in potential and its change with respect to time during concurrent immersion of both substrates (12, 13) indicate the probable rate and quality of the bath deposition onto work pieces.

公开(公告)号：DE3482271D1

公开(公告)日：1990-06-21

申请号：DE3482271

申请日：1984-10-26

Applicant: IBM

Inventor： CAPWELL ROBERT JOHN ,  KASCHAK RONALD ANTHONY ,  MC BRIDE DONALD GENE ,  RICKERT ROBERT GEORGE ,  SERAPHIM DONALD PHILLIP

IPC: H05K3/18 ,  C23C18/40