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公开(公告)号：DE3783831D1
公开(公告)日：1993-03-11
申请号：DE3783831
申请日：1987-05-12
Applicant: IBM
Inventor： MCBRIDE DONALD GENE , RICKERT ROBERT GEORGE
Abstract: An electroless plating bath (11) is selectively cleaned of organic contaminants. The organic contaminants are detected by measuring the capacitance between a working electrode (26) and counter electrode (27) with a potentiostat (31). The capacitance measurements are used to indicate the level of organic contaminants. Exposure of the dummy plating surface (39) in the electroless plating bath is controlled such that the exposed surface is directly proportional to the detected level of organic contaminants.
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公开(公告)号：DE3783831T2
公开(公告)日：1993-08-19
申请号：DE3783831
申请日：1987-05-12
Applicant: IBM
Inventor： MCBRIDE DONALD GENE , RICKERT ROBERT GEORGE
Abstract: An electroless plating bath (11) is selectively cleaned of organic contaminants. The organic contaminants are detected by measuring the capacitance between a working electrode (26) and counter electrode (27) with a potentiostat (31). The capacitance measurements are used to indicate the level of organic contaminants. Exposure of the dummy plating surface (39) in the electroless plating bath is controlled such that the exposed surface is directly proportional to the detected level of organic contaminants.
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公开(公告)号：DE3662278D1
公开(公告)日：1989-04-13
申请号：DE3662278
申请日：1986-05-06
Applicant: IBM
Inventor： CAPWELL ROBERT JOHN , RICKERT ROBERT GEORGE
Abstract: Apparatus and method for determining the deposition capability of an electroless metal plating bath (10) by monitoring the difference in instantaneous electrical potential between a pair of test substrates (12, 13) immersed in the bath in which one substrate (12) is seeded to initiate plating thereon of the bath metal and the other substrate (13) has a surface of the bath metal. The magnitude of the difference in potential and its change with respect to time during concurrent immersion of both substrates (12, 13) indicate the probable rate and quality of the bath deposition onto work pieces.
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公开(公告)号：DE3763518D1
公开(公告)日：1990-08-09
申请号：DE3763518
申请日：1987-04-10
Applicant: IBM
Inventor： MCBRIDE DONALD GENE , RICKERT ROBERT GEORGE
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Patent Agency Ranking
公开(公告)号：DE3669738D1
公开(公告)日：1990-04-26
申请号：DE3669738
申请日：1986-12-18
Applicant: IBM
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公开(公告)号：DE3681064D1
公开(公告)日：1991-10-02
申请号：DE3681064
申请日：1986-04-30
Applicant: IBM
Abstract: A substrate is prepared for subsequent electroless deposition of a metal by contacting the substrate with a surfactant and with an organic carboxylic acid, and subsequently contacting the substrate with sulfuric acid.The process is reliable and simple and does not affect the substrate.
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公开(公告)号：DE3482271D1
公开(公告)日：1990-06-21
申请号：DE3482271
申请日：1984-10-26
Applicant: IBM
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