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公开(公告)号：DE3681064D1
公开(公告)日：1991-10-02
申请号：DE3681064
申请日：1986-04-30
Applicant: IBM
Abstract: A substrate is prepared for subsequent electroless deposition of a metal by contacting the substrate with a surfactant and with an organic carboxylic acid, and subsequently contacting the substrate with sulfuric acid.The process is reliable and simple and does not affect the substrate.
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公开(公告)号：DE3482271D1
公开(公告)日：1990-06-21
申请号：DE3482271
申请日：1984-10-26
Applicant: IBM
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