公开(公告)号：JP2002314258A

公开(公告)日：2002-10-25

申请号：JP2002075801

申请日：2002-03-19

Applicant: IBM

Inventor： ANSTROM DONALD O ,  CHAMBERLIN BRUCE J ,  LAUFFER JOHN M ,  MARKOVICH VOYA R ,  THOMAS DAVID L

IPC: H01L23/538 ,  H05K1/02 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method and structure for realizing close wiring, which can exhibit excellent electric characteristics, while satisfying system resistance requirements and characteristic impedance requirements in a printed circuit board applied product or in a chip carrier applied product. SOLUTION: For close wiring, wiring length is selected to enable use of an allowable 'short' wiring as close circuit lines, or short-length wiring lines are provided in a necessary region and switched to possible rough wiring lines of low-resistance. In order to ensure that the resistance of the longest wiring used will not exceed a predetermined maximum resistance, all the wirings are required to have sufficient sectional areas. Provision of a burial via enables change to a low-resistance wiring to form a dense wiring in the element region.