公开(公告)号：JPS61188942A

公开(公告)日：1986-08-22

申请号：JP20459685

申请日：1985-09-18

Applicant: IBM

Inventor： DATSUDEREI OOGASUTASU CHIYANSU ,  DEIIN ERITSUKU IISUTOMAN ,  CHIYUNGU UEN HOU ,  CHIMOSHII KURAAKU REIRII

IPC: H05K3/34 ,  H01L21/60

公开(公告)号：JPS60128695A

公开(公告)日：1985-07-09

申请号：JP17165784

申请日：1984-08-20

Applicant: IBM

Inventor： DATSUDOREI OOGASUTASU CHIYANSU ,  CHIMOSHII KURAAKU REIRII ,  MAIKERU SAMUPOGUNA

IPC: H05K3/10 ,  B28B1/30 ,  H01L21/48 ,  H05K1/03 ,  H05K3/00 ,  H05K3/02 ,  H05K3/04 ,  H05K3/46

公开(公告)号：JPS6332941A

公开(公告)日：1988-02-12

申请号：JP5704087

申请日：1987-03-13

Applicant: IBM

Inventor： RODONII TOREBAA HOJISON ,  HARII JIYOODAN JIYOONZU ,  PIITAA JIERARUDO REDAAMAN ,  CHIMOSHII KURAAKU REIRII ,  POORU ANDORIYUU MOSUKOUITSUTSU

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/538 ,  H05K3/40

公开(公告)号：JPH05211205A

公开(公告)日：1993-08-20

申请号：JP21193492

申请日：1992-08-10

Applicant: IBM

Inventor： RODONII TOREBAA HOJISON ,  HARII JIYOODAN JIYOONZU ,  PIITAA JIERARUDO REDAAMAN ,  CHIMOSHII KURAAKU REIRII ,  POORU ANDORIYUU MOSUKOUITSUTSU

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/538 ,  H05K3/40

Abstract: PURPOSE: To provide a chip-connecting structure which enable defect correction, wiring modification and mounting of different types of chips. CONSTITUTION: An interconnection between a chip 12 and a wiring substrate 133 is effected by a beam/lead wiring layer having ball-shaped bonding contacts. The chip 12 has conductive pads 234, 235 and 236 thereon, while the wiring substrate 133 has conductive pads 35, 39 and 82 thereon. A wiring layer 10C has a conductive beam/lead 13C formed on an insulating film. The insulating film has openings 215 and 315 therein, and the beam/lead is extended into the opening. The beam/lead has ball-shaped bonding contacts at its both ends, one 238 of which is connected to the conductive pad 39 of the wiring substrate 133, and the other of which is connected to the conductive pad 236 of the chip.