公开(公告)号：JPH0621140A

公开(公告)日：1994-01-28

申请号：JP5843993

申请日：1993-03-18

Applicant: IBM

Inventor： MAIKERU JIYON BURADEII ,  KAACHISU EDOWAADO FUARERU ,  SUN KUON KAN ,  JIEFURII ROBAATO MARINO ,  DONARUDO JIYOOZEFU MIKARUSEN ,  POORU ANDORIYUU MOSUKOUITSUTSU ,  YUUJIN JIYON OSARIBAN ,  TERENSU ROBAATO OTOUURU ,  SANPASU PURUSHIYOTAMAN ,  SHIERUDON KOORU RIIREI ,  JIYOOJI FUREDERITSUKU UOOKAA

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532 ,  H01L21/321

Abstract: PURPOSE: To replace a structural material for forming an electric mutual connection with a semiconductor chip for an inexpensive substitute for gold by providing a metallurgical structure, including a material containing silicon and germanium. CONSTITUTION: For example, it is desired that a pad is provided with surface metallurgically wetted by solder for bonding, so that a chip with solder mound such as C4 can be connected with a substrate like the pad on a package substrate. Then, a passivation state layer 8 constituted of an organic material or an inorganic material is formed in the surrounding of an electric conductor 4 made of an Al/Cu material, while an exposed region 10 of the electric conductor 4 is left. A layer constituted of a material 12, including silicon or germanium, is arranged on the passivation state layer 8 so as to be brought in contact with the exposed region 10. Thus, aluminum oxide or copper oxide can be removed from the surface of the contact pad, the increase in a contact resistance can be suppressed, and Cu can be prevented from being dispersed in a silicon substrate 2.

公开(公告)号：JPH05211205A

公开(公告)日：1993-08-20

申请号：JP21193492

申请日：1992-08-10

Applicant: IBM

Inventor： RODONII TOREBAA HOJISON ,  HARII JIYOODAN JIYOONZU ,  PIITAA JIERARUDO REDAAMAN ,  CHIMOSHII KURAAKU REIRII ,  POORU ANDORIYUU MOSUKOUITSUTSU

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/538 ,  H05K3/40

Abstract: PURPOSE: To provide a chip-connecting structure which enable defect correction, wiring modification and mounting of different types of chips. CONSTITUTION: An interconnection between a chip 12 and a wiring substrate 133 is effected by a beam/lead wiring layer having ball-shaped bonding contacts. The chip 12 has conductive pads 234, 235 and 236 thereon, while the wiring substrate 133 has conductive pads 35, 39 and 82 thereon. A wiring layer 10C has a conductive beam/lead 13C formed on an insulating film. The insulating film has openings 215 and 315 therein, and the beam/lead is extended into the opening. The beam/lead has ball-shaped bonding contacts at its both ends, one 238 of which is connected to the conductive pad 39 of the wiring substrate 133, and the other of which is connected to the conductive pad 236 of the chip.

公开(公告)号：JPS6332941A

公开(公告)日：1988-02-12

申请号：JP5704087

申请日：1987-03-13

Applicant: IBM

Inventor： RODONII TOREBAA HOJISON ,  HARII JIYOODAN JIYOONZU ,  PIITAA JIERARUDO REDAAMAN ,  CHIMOSHII KURAAKU REIRII ,  POORU ANDORIYUU MOSUKOUITSUTSU

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/538 ,  H05K3/40

公开(公告)号：JPS5975687A

公开(公告)日：1984-04-28

申请号：JP13111983

申请日：1983-07-20

Applicant: Ibm

Inventor： SADEGU MUSUTAAFUA FUARISU ,  POORU ANDORIYUU MOSUKOUITSUTSU ,  AASAA DABITSUDOSON ,  JIYOOJI ANSONII SAIIHARASUZU

IPC: H01L39/24 ,  F17C13/00 ,  G01R13/34 ,  G01R31/28

CPC classification number: G01R31/2822 ,  F17C13/00 ,  F17C2203/0391 ,  F17C2203/0629 ,  F17C2223/0161 ,  F17C2250/0631 ,  F17C2270/0168 ,  F17C2270/0509 ,  F17C2270/0518 ,  Y10S505/843

公开(公告)号：JPH08213419A

公开(公告)日：1996-08-20

申请号：JP26985695

申请日：1995-10-18

Applicant: IBM

Inventor： MAIKERU JIYON BUREDEI ,  TOOMASU ANSONII KOFUIINO ,  HAAREI KENTO HAINRITSUHI ,  GUREN UOORUDEN JIYONSON ,  POORU ANDORIYUU MOSUKOUITSUTSU ,  FUIRITSUPU MAAFUI ,  JIYOOJI FUREDERITSUKU UOOKAA

IPC: H01L21/60 ,  G06K7/08 ,  G06K19/067 ,  H01L25/04 ,  H01L25/18 ,  H04B1/59

Abstract: PROBLEM TO BE SOLVED: To enable high volume production of radio frequency tags at a low cost by using material which can be obtained, by forming an antenna constituted of a wire, by wire bonding, on an organic board on which semiconductor is fixed. SOLUTION: Semiconductor 205 having a first contact 207, a second contact 208, a storage device, and a logic circuit for modulating a radio frequency sinal with a frequency is fixed on an organic board 210. By using a wire bonding machine, the end of a first wire 131 is connected with the first contact 207, and the first wire 131 is led out to have a first length and fixed to the organic board 210. The first wire 131 is cut out at the point of the first length. Similarly, the second wire 132 is fixed to the second contact 208 and the organic board 210. Hence the first wire 131 and the second wire 132 form an antenna for receiving a signal, which is modulated by the logic circuit of the semiconductor 205. The modulated signal is transmitted from the antenna.

公开(公告)号：JPH04277639A

公开(公告)日：1992-10-02

申请号：JP28980791

申请日：1991-11-06

Applicant: IBM

Inventor： TOOMASU MARIO SHIPORA ,  POORU UIRIAMU KOTEUSU ,  ROBAATO HENRII KATEIRU ,  ROBAATO JIYOSEFU KERUHAA ,  POORU ANDORIYUU MOSUKOUITSUTSU

IPC: H01L21/60 ,  H01L23/485

Abstract: PURPOSE: To provide a mount structure which connects conductors fitted to a carrier at difference height positions to contact places on a flat substrate. CONSTITUTION: On a surface 1 of the substrate, connection parts 5, 6, and 7 in a swelled shape are formed and made tall enough to reach the height position of individual conductors 15, 17, and 19 to which their connection parts fitted to the carrier 11 are bonded. In the extension plane of the conductors, the conductor and connection parts are bonded. To form the connection part in the swelled shape, sticking bodies of solder are stuck and formed on a pad formed on the surface of the substrate and the connection parts are made spherical by surface tension by performing a reflow process for the sticking bodies. The heights of the connection parts after the reflow process can be controlled by the area of the pad and the volumetric amount of the solder which is stuck and formed.

公开(公告)号：JPH05211281A

公开(公告)日：1993-08-20

申请号：JP18924292

申请日：1992-07-16

Applicant: IBM

Inventor： POORU UIRIAMU KOTEUSU ,  POORU ANDORIYUU MOSUKOUITSUTSU ,  FUIRITSUPU MAFUII ,  MAAKU BII RITSUTAA ,  JIYOOJI FUREDERITSUKU UOOKAA

IPC: H01L25/18 ,  H01L25/065 ,  H01L25/07 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K7/20

Abstract: PURPOSE: To provide an electronic device package which can stack electronic devices with high density, can secure electrical interconnection of the electronic devices and can have superior heat radiation effect. CONSTITUTION: A plurality of electronic devices 40 are arranged in a stacked manner, and each has a contact position 24 close to one end of each device. The electronic devices are arranged as in steps, so that the lower contact positions of the devices are exposed and are arranged along contact positions 46 on a substrate as opposite thereto, whereby the devices are electrically connected with the substrate. Thereby a large number of electronic devices of the step-like structure can be packaged with a high density and can easily radiate heat, generated in the electronic devices when combined with a heat radiating means 50.

公开(公告)号：JPS6345826A

公开(公告)日：1988-02-26

申请号：JP12727687

申请日：1987-05-26

Applicant: IBM

Inventor： MAIKERU JIYON BURADEII ,  SANGU KUUON KANGU ,  POORU ANDORIYUU MOSUKOUITSUTSU ,  JIEEMUZU GAADONAA RAIAN ,  TEIMOSHII KURAAKU REIRII ,  ERITSUKU GUREGORI UORUTON ,  HARII RANDOORU BITSUKUFUOODO ,  MAIKERU JIYON PAAMAA

IPC: H01L21/60 ,  H01L23/485