公开(公告)号：JPH06326376A

公开(公告)日：1994-11-25

申请号：JP5049994

申请日：1994-03-22

Applicant: IBM

Inventor： RODONII TOREBAA HOJISON ,  POORU MARUKOMU MAAKASU ,  BIKUTAA RUISU MORUTSUJI

IPC: G01R33/09 ,  G11B5/00 ,  G11B5/33 ,  G11B5/39 ,  G11B5/455 ,  G11B5/465 ,  G11B19/02 ,  G11B33/14 ,  H01F10/00 ,  H01F10/08 ,  H01F10/32 ,  H01L43/08 ,  G01R33/06

Abstract: PURPOSE: To improve the sensitivity of the device by providing it with a temperature control circuit coupled with a heating element, as well as a power supply to allow a current to blow in a material for judging the time point when the material is ferromagnetically arrayed. CONSTITUTION: A temperature control circuit 81 controls the temperature of the materials (FeRh, MaPt, FeRu, etc). A signal processing circuit 78 displays that the material 82 is antiferromagnetic or ferromagnetic in a specific magnetic field. The signals transmitted from the signal processing circuit 78 through the intermediary of a lead wire 84 furnish the temperature control circuit 81 with many data for enabling the circuit 81 to control the temperature of the material 82 at a given temperature lower than the transfer temperature. Besides, the temperature control circuit 81 feeds a heating element for controlling the temperature of the material 82 placed in a magnetic head 71 with a current through lead wires 87, 88. Thereby the sensitivity of a magnetic field detector is improved.

公开(公告)号：JPS6332941A

公开(公告)日：1988-02-12

申请号：JP5704087

申请日：1987-03-13

Applicant: IBM

Inventor： RODONII TOREBAA HOJISON ,  HARII JIYOODAN JIYOONZU ,  PIITAA JIERARUDO REDAAMAN ,  CHIMOSHII KURAAKU REIRII ,  POORU ANDORIYUU MOSUKOUITSUTSU

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/538 ,  H05K3/40

公开(公告)号：JPH05211205A

公开(公告)日：1993-08-20

申请号：JP21193492

申请日：1992-08-10

Applicant: IBM

Inventor： RODONII TOREBAA HOJISON ,  HARII JIYOODAN JIYOONZU ,  PIITAA JIERARUDO REDAAMAN ,  CHIMOSHII KURAAKU REIRII ,  POORU ANDORIYUU MOSUKOUITSUTSU

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/538 ,  H05K3/40

Abstract: PURPOSE: To provide a chip-connecting structure which enable defect correction, wiring modification and mounting of different types of chips. CONSTITUTION: An interconnection between a chip 12 and a wiring substrate 133 is effected by a beam/lead wiring layer having ball-shaped bonding contacts. The chip 12 has conductive pads 234, 235 and 236 thereon, while the wiring substrate 133 has conductive pads 35, 39 and 82 thereon. A wiring layer 10C has a conductive beam/lead 13C formed on an insulating film. The insulating film has openings 215 and 315 therein, and the beam/lead is extended into the opening. The beam/lead has ball-shaped bonding contacts at its both ends, one 238 of which is connected to the conductive pad 39 of the wiring substrate 133, and the other of which is connected to the conductive pad 236 of the chip.

公开(公告)号：JPH05178999A

公开(公告)日：1993-07-20

申请号：JP28959591

申请日：1991-11-06

Applicant: IBM

Inventor： KURAUDEIUSU FUEEGAA ,  RODONII TOREBAA HOJISON ,  DEIBITSUDO ANDORUU RUISU ,  RAABII SARAFU

IPC: C08G59/18 ,  B01D71/64 ,  B32B27/00 ,  C08G8/00 ,  C08G8/06 ,  C08G18/70 ,  C08G18/80 ,  C08G85/00 ,  C08J5/00 ,  C08J5/18 ,  C08L75/00 ,  C08L75/04 ,  C08L79/08 ,  C08L101/00 ,  D01F6/94