公开(公告)号：JPH10245539A

公开(公告)日：1998-09-14

申请号：JP19831797

申请日：1997-07-24

Applicant: IBM

Inventor： BERGER MICHAEL ,  COICO PATRICK A ,  SACHDEV KRISHNA GANDHI ,  POMPEO FRANK L

IPC: C08L79/08 ,  C08G73/10 ,  C09J179/08 ,  C09J183/10 ,  H01L21/52

Abstract: PROBLEM TO BE SOLVED: To obtain a siloxane-containing polyimide adhesive capable of TSM capping with a reduced seal band width in assembling an electronic package and soluble in a solvent friendly to the environment by using an aromatic diether dianhydride, an aromatic diamine having a flexible molecular chain and a polysiloxanediamine. SOLUTION: The composition for forming the adhesive comprises an aromatic diether dianhydride, an aromatic diamine having a flexible molecular chain and a polysiloxanediamine having a vinyl functional group as part of the structure. The molar ratio of the anhydride to the total diamines is about 0.95/1 to 1.05/1, and an excess molar amount of the reactants are capped with a monohydride or a monoamine compound. This composition is polymerized to obtain a siloxane-containing polyimide adhesive. The seal band width is below 4mm.

公开(公告)号：CA2288605C

公开(公告)日：2003-02-11

申请号：CA2288605

申请日：1999-11-08

Applicant: IBM CANADA

Inventor： COICO PATRICK A ,  GUERIN LUC

IPC: H01L23/498 ,  H01L23/50

Abstract: An area array integrated circuit package having contact pads is provided wit h compliant rectangular shaped connection leads each attached to a contact pad. The lead s are arranged and oriented on the surface of the package around the neutral point of the packa ge such that the flat width dimension of each lead faces the neutral point of the contact array, thereby offering optimal compliance against thermally induced deformation and resulting in improved interconnection reliability.

公开(公告)号：CA2288605A1

公开(公告)日：2001-05-08

申请号：CA2288605

申请日：1999-11-08

Applicant: IBM CANADA

Inventor： GUERIN LUC ,  COICO PATRICK A

IPC: H01L23/498 ,  H01L23/50

Abstract: An area array integrated circuit package having contact pads is provided wit h compliant rectangular shaped connection leads each attached to a contact pad. The lead s are arranged and oriented on the surface of the package around the neutral point of the packa ge such that the flat width dimension of each lead faces the neutral point of the contact array, thereby offering optimal compliance against thermally induced deformation and resulting in improved interconnection reliability.