公开(公告)号：GB2543224A

公开(公告)日：2017-04-12

申请号：GB201701252

申请日：2015-11-03

Applicant: IBM

Inventor： PAUL S ANDRY ,  JEFFREY GELORME ,  CORNELIA K TSANG ,  BUCKNELL WEBB

IPC: H01L21/683 ,  B32B7/12

Abstract: The absorption properties of both an adhesive layer and an ablation layer are employed to facilitate debonding of a device wafer and a glass handler without damaging the device wafer. The penetration depths of the adhesive and ablation layers are selected such that no more than a negligible amount of the ablation fluence reaches the surface of the device wafer.

公开(公告)号：GB2543224B

公开(公告)日：2017-11-08

申请号：GB201701252

申请日：2015-11-03

Applicant: IBM

Inventor： PAUL S ANDRY ,  JEFFREY GELORME ,  CORNELIA K TSANG ,  BUCKNELL WEBB

IPC: H01L21/683 ,  B32B7/12